Power module and fabrication method for the same
First Claim
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1. A power module comprising:
- an insulating layer having a top surface and a bottom surface;
a metal layer disposed on the top of the insulating layer;
a semiconductor chip disposed on the metal layer; and
a mold resin formed so as to cover the semiconductor chip, at least a part of the metal layer, and only the top surface side of the insulation layer, whereina groove into which a part of the insulating layer is inserted is formed on a surface of the metal layer facing the insulating layer, and the bottom surface of the insulation layer is a flat surface.
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Abstract
A power module includes: an insulating layer; a leadframe disposed on the insulating layer; a semiconductor chip disposed on the leadframe; and a mold resin formed so as to cover the semiconductor chip and at least a part of the metal layer, wherein a groove into which a part of the insulating layer is inserted is formed on a surface of the leadframe facing the insulating layer. Accordingly, there can be provided the power module with improved reliability so that the insulating layer and the leadframe may be hardly deviated from each other even if external force is applied thereon; and a fabrication method for such a power module.
7 Citations
17 Claims
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1. A power module comprising:
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an insulating layer having a top surface and a bottom surface; a metal layer disposed on the top of the insulating layer; a semiconductor chip disposed on the metal layer; and a mold resin formed so as to cover the semiconductor chip, at least a part of the metal layer, and only the top surface side of the insulation layer, wherein a groove into which a part of the insulating layer is inserted is formed on a surface of the metal layer facing the insulating layer, and the bottom surface of the insulation layer is a flat surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification