Wafer-level chip-scale package device having bump assemblies configured to furnish shock absorber functionality
First Claim
1. A wafer-level chip-scale package device comprising:
- an integrated circuit chip; and
an array of bump assemblies disposed directly on the integrated circuit chip, the array of bump assemblies comprising a plurality of first bump assemblies including solder bumps, where the solder bumps are without a core and are for electrical interconnection with a redistribution layer of the integrated circuit chip, composed at least substantially of a solder composition and a plurality of second bump assemblies including a solder bump having a plastic core configured to furnish shock absorber functionality to the integrated circuit chip, where the plurality of second bump assemblies is disposed about the perimeter of the integrated circuit chip and is not electrically interconnected with the integrated circuit chip, and where the plurality of first bump assemblies includes a first solder composition and the plurality of second bump assemblies includes a second solder composition different from the first solder composition.
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Accused Products
Abstract
Semiconductor devices are described that have bump assemblies configured to furnish shock absorber functionality. In an implementation, a wafer-levelchip-scale package devices include an integrated circuit chip having an array of bump assemblies disposed over the integrated circuit chip. The array of bump assemblies comprises a plurality of first bump assemblies that include solder bumps composed at least substantially of a solder composition (i.e., solder bumps that do not include a core). The array further comprises a plurality of second bump assemblies that includes a solder bump having a core configured to furnish shock absorber functionality to the integrated circuit chip.
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Citations
12 Claims
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1. A wafer-level chip-scale package device comprising:
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an integrated circuit chip; and an array of bump assemblies disposed directly on the integrated circuit chip, the array of bump assemblies comprising a plurality of first bump assemblies including solder bumps, where the solder bumps are without a core and are for electrical interconnection with a redistribution layer of the integrated circuit chip, composed at least substantially of a solder composition and a plurality of second bump assemblies including a solder bump having a plastic core configured to furnish shock absorber functionality to the integrated circuit chip, where the plurality of second bump assemblies is disposed about the perimeter of the integrated circuit chip and is not electrically interconnected with the integrated circuit chip, and where the plurality of first bump assemblies includes a first solder composition and the plurality of second bump assemblies includes a second solder composition different from the first solder composition. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An electronic device comprising:
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a printed circuit board; and a wafer-level package device coupled to the printed circuit board, the waver-level package device comprising an integrated circuit chip having an array of bump assemblies disposed directly on the integrated circuit chip, the array of bump assemblies comprising a plurality of first bump assemblies having solder bumps, where the solder bumps are without a core and for electrical interconnection with a redistribution layer of the integrated circuit chip, composed at least substantially of a solder composition and a plurality of second bump assemblies including a solder bump having a plastic core configured to furnish shock absorber functionality to the integrated circuit chip, where the plurality of second bump assemblies is disposed about the perimeter of the integrated circuit chip and is not electrically interconnected with the integrated circuit chip, and where the plurality of first bump assemblies includes a first solder composition and the plurality of second bump assemblies includes a second solder composition different from the first solder composition. - View Dependent Claims (8, 9, 10, 11, 12)
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Specification