Light emitting device and fluidic manufacture thereof

• US 9,722,145 B2
• Filed: 06/24/2015
• Issued: 08/01/2017
• Est. Priority Date: 06/24/2015
• Status: Active Grant

• Current Assignee: Elux Inc.
• Original Assignee: Sharp Laboratories of America Incorporated (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Sasaki, Kenji Alexander, Schuele, Paul John, Crowder, Mark Albert
• Primary Examiner(s): PRENTY, MARK V
• Application Number:
  US14/749,569
• Publication Number:
  US 20160380158A1
• Time in Patent Office: 769 Days
• Field of Search: 257 89
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/83143 Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
• CPC Class Codes: H01L 2224/83424 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/83447 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/83488 Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2224/83805 involving forming a eutectic alloy at the bonding interface
• CPC Class Codes: H01L 2224/83815 Reflow soldering
• CPC Class Codes: H01L 2224/95001 involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95101 in a liquid medium
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/95146 by surface tension
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0543 : 13th Group
• CPC Class Codes: H01L 2924/0544 : 14th Group
• CPC Class Codes: H01L 2924/0549 : being a combination of two or more materials provided in the groups H01L2924/0531 - H01L2924/0546
• CPC Class Codes: H01L 2924/10155 : being other than a cuboid
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 : the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2933/0033 : relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0066 : relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/20 : with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/483 : Containers
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.

Claims

1. A light emitting device comprising:

a substrate having a recess;

an interlayer dielectric layer being located on the substrate, and having a first hole and a second hole, the first hole opening over the recess of the substrate;

a first micro light emitting device and a second micro light emitting device, the first micro light emitting device having a thickness greater than the second micro light emitting device and being placed in the first hole;

the second micro light emitting device being located in the second hole; and

wherein a void includes the first hole and the recess, and wherein the void is larger than the first micro light emitting device and the second hole is larger than the second micro light emitting device.

2. The light emitting device of claim 1, wherein an upper surface of the interlayer dielectric layer, an upper surface of the first micro light emitting device, and an upper surface of the second micro light emitting device are substantially level.

3. The light emitting device of claim 1, further comprising:

a third hole in the interlayer dielectric layer having a different size from the second hole; and

a third micro light emitting device having a different size from the second micro light emitting device and being located in the third hole.

4. The light emitting device of claim 3, wherein the second hole and the second micro light emitting device are at least 1.2 times larger than the third hole and the third micro light emitting device, respectively.

5. The light emitting device of claim 3, wherein the first hole, the second hole, and the third hole have different sizes, and the first micro light emitting device, the second micro light emitting device, and the third micro light emitting device have different sizes.

6. The light emitting device of claim 5, wherein the first, second, and third micro light emitting devices are configured to emit red, green, and blue light, respectively, and wherein the thickness of the first micro light emitting device is greater than the thicknesses of the second and third micro light emitting devices, respectively.

7. The light emitting device of claim 6, wherein an area of the upper surface of the first micro light emitting device is larger than an area of the upper surface of the second micro light emitting device, and which in turn is larger than an area of the upper surface of the third micro light emitting device.

8. The light emitting device of claim 6, further comprising:

a fourth hole in the interlayer dielectric layer; and

a fourth micro light emitting device being located in the fourth hole, which is configured to emit blue light.

9. The light emitting device of claim 1, wherein a depth of the recess in the substrate is substantially equal to a thickness of the interlayer dielectric layer.

10. The light emitting device of claim 1, further comprising:

the substrate having a first through hole formed at a bottom of the recess and opening to communicate with the corresponding hole first hole opening over the recess of the substrate, and having a second through hole formed at a bottom of the second hole that is not positioned over the recess.

11. The light emitting device of claim 1, wherein a shape of the light emitting device is a disc-shape with an area of a lighting surface larger than an electrode surface, or a polygon-shape with an area of a lighting surface larger than an electrode surface.

12. The light emitting device of claim 1, wherein the recess of the substrate has a tapered-shape.

13. A light emitting system, the system comprising:

a substrate having a recess;

an dielectric layer being located on the substrate, and having a first hole and a second hole, the first hole opening over the recess of the substrate;

a first micro light emitting device and a second micro light emitting device, wherein the first micro light emitting device is thicker than the second micro light emitting device, has a diameter smaller than the first hole and the recess, and is located in the first hole and the recess; and

the second micro light emitting device being located in the second hole.

14. A light emitting system, the system comprising:

a substrate having a recess;

a dielectric layer being located on the substrate, and having a first hole and a second hole, the first hole opening over the recess of the substrate;

a first micro light emitting device being placed in a void including the first hole and the recess, wherein the void is larger than the first micro light emitting device; and

a second micro light emitting device being placed in the second hole.

15. The light emitting system of claim 14, wherein the recess of the substrate has a tapered-shape.

16. The light emitting system of claim 14, wherein a depth of the recess in the substrate is substantially equal to a thickness of the dielectric layer.

17. The light emitting system of claim 14, wherein the substrate further includes:

a first through hole formed at a bottom of the recess and opening to communicate with the corresponding hole first hole opening over the recess of the substrate; and

a second through hole formed at a bottom of the second hole.

18. The light emitting system of claim 14, wherein a shape of the light emitting device is a disc-shape with an area of a lighting surface larger than an electrode surface, or a polygon-shape with an area of a lighting surface larger than an electrode surface.

19. The light emitting system of claim 14, further comprising:

a third hole in the dielectric layer having a different size from the second hole; and

a third micro light emitting device having a different size from the second micro light emitting device and being located in the third hole.

20. The light emitting system of claim 19, wherein the second hole and the second micro light emitting device are at least 1.2 times larger than the third hole and the third micro light emitting device, respectively.

21. The light emitting system of claim 19, wherein the first hole, the second hole, and the third hole have different sizes, and the first micro light emitting device, the second micro light emitting device, and the third micro light emitting device have different sizes.