Infrared camera system architectures

• US 9,723,228 B2
• Filed: 12/09/2013
• Issued: 08/01/2017
• Est. Priority Date: 06/10/2011
• Status: Active Grant

• Current Assignee: Teledyne FLIR LLC (Teledyne Technologies Incorporated)
• Original Assignee: FLIR Systems, Inc. (Teledyne Technologies Incorporated)
• Inventors: Boulanger, Pierre, Kurth, Eric A., Hoelter, Theodore R., Sharp, Barbara
• Primary Examiner(s): Rao, Andy
• Assistant Examiner(s): Edwards, Tyler
• Application Number:
  US14/101,258
• Publication Number:
  US 20140098238A1
• Time in Patent Office: 1,331 Days
• Field of Search: 348374
• CPC Class Codes: G01J 5/00 Radiation pyrometry, e.g. infrared or optical thermometry
• CPC Class Codes: G01J 5/02 Constructional details
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
• CPC Class Codes: G01J 5/53 Reference sources, e.g. standard lamps; Black bodies
• CPC Class Codes: G06V 20/52 Surveillance or monitoring of activities, e.g. for recognising suspicious objects recognising microscopic objects G06V20/69
• CPC Class Codes: H04N 17/002 for television cameras
• CPC Class Codes: H04N 23/11 for generating image signals from visible and infrared light wavelengths
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 23/71 Circuitry for evaluating the brightness variation
• CPC Class Codes: H04N 23/74 by influencing the scene brightness using illuminating means
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20
• CPC Class Codes: H04N 7/18 Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast

Abstract

Various techniques are disclosed for providing an infrared imaging module that exhibits a small form factor and may be used with one or more portable devices. Such an infrared imaging module may be implemented with a housing that includes electrical connections that may be used to electrically connect various components of the infrared imaging module. In addition, various techniques are disclosed for providing system architectures for processing modules of infrared imaging modules. In one example, a processing module of an infrared imaging module includes a first interface adapted to receive captured infrared images from an infrared image sensor of the infrared imaging module. The processing module may also include a processor adapted to perform digital infrared image processing on the captured infrared images to provide processed infrared images. The processing module may also include a second interface adapted to pass the processed infrared images to a host device.

Claims

1. A device comprising:

an infrared imaging module comprising;

a housing configured to engage with a socket;

an infrared sensor assembly within the housing, wherein the infrared sensor assembly comprises a plurality of microbolometers, wherein each of the plurality of microbolometers is adapted to capture infrared image data from a target scene;

a processing module within the housing and adapted to process the captured infrared image data; and

a lens coupled to and at least partially within the housing and configured to pass infrared energy through to the infrared sensor assembly.

2. The device of claim 1, further comprising a plurality of electrical connections on an inside surface of the housing and adapted to pass electrical signals from the infrared sensor assembly to the processing module.

3. The device of claim 2, further comprising:

a first circuit board in electrical contact with the infrared sensor assembly and the plurality of electrical connections;

a second circuit board in electrical contact with the processing module and the plurality of electrical connections;

wherein the plurality of electrical connections and the first and second circuit boards are adapted to pass the electrical signals from the infrared sensor assembly and the processing module; and

wherein at least a portion of the plurality of electrical connections protrudes from a bottom surface of the housing.

4. The device of claim 3, wherein the processing module is mounted to the second circuit board by flip chip connections and/or a plurality of wire bonds.

5. The device of claim 1, wherein the device further comprises the socket, wherein the infrared imaging module is substantially within the socket, wherein the socket is coupled to the device such that the infrared imaging module is configured as an infrared camera for the device, and wherein the device is a mobile telephone.

6. The device of claim 1, further comprising a shutter adapted to be selectively positioned in front of the infrared imaging module to block infrared energy external to a host device from the infrared sensor assembly, wherein each of the plurality of microbolometers is adapted to capture the infrared image data from a respective portion of the target scene, wherein the plurality of microbolometers forms an array of N microbolometers by M microbolometers, and wherein N and M are integers greater than or equal to 32 and less than or equal to 640.

7. A method comprising:

passing infrared energy through a lens coupled to and at least partially within a housing of an infrared imaging module of a device, wherein the housing is configured to engage with a socket;

capturing infrared image data associated with a target scene from the passed infrared energy through each of a plurality of microbolometers of an infrared sensor assembly within the housing; and

providing electrical signals from the infrared sensor assembly to a processing module within the housing.

8. The method of claim 7, wherein the electrical signals are provided through a plurality of electrical connections in the housing.

9. The method of claim 8, wherein the infrared imaging module further comprises:

a first circuit board in electrical contact with the infrared sensor assembly and the plurality of electrical connections;

a second circuit board in electrical contact with the processing module and the plurality of electrical connections; and

wherein the electrical signals are provided through the plurality of electrical connections, the first circuit board, and the second circuit board.

10. The method of claim 9, wherein the processing module is mounted to the second circuit board by flip chip connections and/or a plurality of wire bonds.

11. The method of claim 7, wherein the device further comprises the socket, wherein the infrared imaging module is substantially within the socket, wherein the socket is coupled to the device such that the infrared imaging module is configured as an infrared camera for the device, and wherein the device is a mobile telephone.

12. The method of claim 7, further comprising selectively positioning a shutter of the device in front of the infrared imaging module to block infrared energy external to the device from the infrared sensor assembly.

13. A processing module of an infrared imaging module, the processing module comprising:

a first interface adapted to receive captured infrared images associated with a target scene from each of a plurality of microbolometers of the infrared imaging module;

a processor adapted to perform digital infrared image processing on the captured infrared images to provide processed infrared images; and

a second interface adapted to pass the processed infrared images to a host device.

14. The processing module of claim 13, further comprising:

a memory interface;

a memory; and

wherein the first interface is adapted to receive the captured infrared images and provide the captured infrared images to the memory interface as digital data for storage in the memory for use by the processor to perform the digital infrared image processing.

15. The processing module of claim 13, wherein:

the first interface is adapted to receive the captured infrared images at a first frame rate;

the processor is adapted to process a plurality of the captured infrared images to provide the processed infrared images; and

the second interface is adapted to pass the processed infrared images to the host device at a second frame rate that is less than the first frame rate.

16. The processing module of claim 13, wherein the processor is a central processing unit (CPU) adapted to perform the digital infrared image processing without dedicated image processing blocks and wherein the first interface is adapted to receive the captured infrared images from a read out integrated circuit (ROIC) associated with the plurality of microbolometers.

17. The processing module of claim 13, wherein the processing module is electrically connected to the plurality of microbolometers through electrical connections in a housing of the infrared imaging module, wherein the infrared imaging module is adapted to be received by a socket, wherein the socket is adapted to be installed in the host device, and wherein the host device is a mobile telephone.

18. A method of operating a processing module of an infrared imaging module, the method comprising:

receiving captured infrared images associated with a target scene from each of a plurality of microbolometers of the infrared imaging module over a first interface of the processing module;

performing digital infrared image processing on the captured infrared images to provide processed infrared images; and

passing the processed infrared images to a host device over a second interface.

19. The method of claim 18, further comprising providing the captured infrared images from the first interface to a memory interface as digital data for storage in a memory for use by a processor to perform the digital infrared image processing.

20. The method of claim 18, wherein:

the receiving captured infrared images comprises receiving the captured infrared images at a first frame rate;

the performing digital infrared image processing comprises processing a plurality of the captured infrared images to provide the processed infrared images; and

the passing the processed infrared images comprises passing the processed infrared images to the host device at a second frame rate that is less than the first frame rate.

21. The method of claim 18, wherein the performing digital infrared image processing is performed by a central processing unit (CPU) adapted to perform the digital infrared image processing without dedicated image processing blocks and wherein the receiving captured infrared images comprises receiving captured infrared images from a read out integrated circuit (ROIC) associated with the plurality of microbolometers.

22. The method of claim 18, wherein the processing module is electrically connected to the plurality of microbolometers through electrical connections in a housing of the infrared imaging module, wherein the infrared imaging module is adapted to be received by a socket, wherein the socket is adapted to be installed in the host device, and wherein the host device is a mobile telephone.