Power supply module with electromagnetic-interference (EMI) shielding, cooling, or both shielding and cooling, along two or more sides

• US 9,723,766 B2
• Filed: 02/25/2011
• Issued: 08/01/2017
• Est. Priority Date: 09/10/2010
• Status: Active Grant

• Current Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Original Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Inventors: Althar, Michael, Kelkar, Nikhil Vishwanath, Yin, Jian
• Primary Examiner(s): Slutsker, Julia
• Assistant Examiner(s): SODERHOLM, KRISTA Z
• Application Number:
  US13/035,792
• Publication Number:
  US 20120063038A1
• Time in Patent Office: 2,349 Days
• Field of Search: 257660, 257659, 257422, 257E23114, 257666, 257691, 257797
• CPC Class Codes: H01L 2224/37147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/40095 Kinked
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H05K 9/0007 Casings standardised racks H05K9/0062
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

An embodiment of a power-supply module includes a package having sides, a first power-supply component disposed in the package, and an electromagnetic-interference (EMI) shield disposed adjacent to two sides of the package. For example, such a module may include component-mounting platforms (e.g., a lead frame or printed circuit board) on the top and bottom sides of the module, and these platforms may provide a level of EMI shielding specified for a particular application. Consequently, such a module may provide better EMI shielding than modules with shielding along only one side (e.g., the bottom) of the module. Moreover, if the module components are mounted to, or otherwise thermally coupled to, the shielding platforms, then the module may provide multi-side cooling of the components.

Claims

1. A power-supply module, comprising:

a package having a first side and a second side;

an electromagnetic-interference shield including

a platform disposed adjacent to the first side of the package, and

a first lead frame disposed adjacent to the second side of the package;

a first power-supply component electrically coupled to one of the platform and the first lead frame; and

a second power-supply component electrically coupled to the other of the platform and the first lead frame.

2. The power-supply module of claim 1 wherein the package includes an epoxy resin.

3. The power-supply module of claim 1 wherein one of the first and second power-supply components includes a controller.

4. The power-supply module of claim 1 wherein one of the first and second power-supply components includes an inductor.

5. The power-supply module of claim 1 wherein one of the first and second power-supply components includes a transistor.

6. The power-supply module of claim 1 wherein one of the first and second power-supply components includes a resistor.

7. The power-supply module of claim 1 wherein one of the first and second power-supply components includes a capacitor.

8. The power supply module of claim 1 wherein the platform includes a circuit board disposed adjacent to the first side of the package.

9. The power-supply module of claim 1,

wherein the platform includes a circuit board disposed adjacent to the first side of the package;

and

wherein the first lead frame includes a lead that is disposed inside of the package and that contacts the circuit board.

10. The power-supply module of claim 1,

wherein the platform includes a circuit board disposed adjacent to the first side of the package;

and

wherein the first lead frame includes a lead that is disposed inside of the package and that supports the lead frame over the circuit board.

11. The power-supply module of claim 1,

wherein the platform includes a circuit board disposed adjacent to the first side of the package;

and

wherein the lead frame includes a lead that is disposed inside of the package and that supports the circuit board over the lead frame.

12. The power-supply module of claim 1, further comprising:

wherein the first lead frame has a portion exposed through the second side of the package; and

a heat sink attached to the exposed portion of the lead frame.

18. The power-supply module of claim 1, further comprising:

wherein the platform includes a circuit board disposed adjacent to the first side of the package and having a portion exposed through the side of the package; and

a heat sink attached to the exposed portion of the circuit board.

19. The power-supply module of claim 1, further comprising:

wherein the platform includes a circuit board disposed adjacent to the first side of the package;

wherein one of the first and second components includes a pad and is mounted to the circuit board; and

a clip electrically coupling the pad of the one of the first and second components to the circuit board.

20. The power-supply module of claim 1, further comprising:

wherein one of the first and second components includes a pad and is mounted to the first lead frame; and

a clip electrically coupling the pad of the one of the first and second components to the first lead frame.

21. The power-supply module of claim 1 wherein:

one of the first and second components includes a pad and is mounted to the platform; and

wherein the first lead frame includes a lead that is disposed inside of the package and that contacts the pad of the one of the first and second components.

22. The power-supply module of claim 1, wherein:

the first lead frame is disposed adjacent to a top side of the package and has a lead that extends along the first side of the package to a bottom side of the package and has a first lead portion that is exposed adjacent to the first and bottom sides of the package; and

the platform includes a second lead frame disposed adjacent to the bottom side of the package and having a second lead portion that is exposed adjacent to the first and bottom sides of the package and to the first lead portion.

23. The power-supply module of claim 1 wherein:

the first lead frame is disposed adjacent to a top side of the package and has first and second leads that extends along a first side of the package to a bottom side of the package and has respective first and second lead portions that are exposed adjacent to the first and bottom sides of the package; and

the platform includes a second lead frame disposed adjacent to the bottom side of the package and having third and fourth leads with respective third and fourth lead portions that are exposed adjacent to the first and bottom sides of the package and that extend between the first and second lead portions.

25. The power-supply module of claim 1 wherein the electromagnetic-interference shield is disposed adjacent to only a portion of one of the first and second sides of the package, the portion being less than the entirety of the one side.

26. The power-supply module of claim 1 wherein the electromagnetic-interference shield is disposed adjacent to more than the first and second sides of the package.

27. The power-supply module of claim 1 wherein the electromagnetic-interference shield is disposed adjacent to all sides of the package.

28. The power-supply module of claim 1 wherein the electromagnetic-interference shield further includes a lead of the lead frame disposed adjacent to the second side of the package.

39. The power-supply module of claim 1 wherein the platform and the first lead frame completely cover at least one of the first and second power-supply components.

13. A power-supply module, comprising:

a package having a first side and a second side;

a first power-supply component disposed within the package and configured to generate a regulated supply signal; and

an electromagnetic-interference shield including;

a platform disposed adjacent to the first side of the package; and

a first lead frame disposed adjacent to the second side of the package; and

wherein the platform includes a second lead frame disposed adjacent to the first side of the package.

14. The power-supply module of claim 13, further comprising:

wherein the first component is mounted to one of the first and second lead frames; and

a second component mounted to the other of the first and second lead frames.

16. The power-supply module of claim 13 wherein the second lead frame has a lead that is disposed inside of the package and that supports the second lead frame over the first lead frame.

17. The power-supply module of claim 13 wherein the second lead frame has a lead that is disposed inside of the package and that supports the first lead frame over the second lead frame.

40. The power-supply module of claim 13 wherein the platform and the first lead frame overlap the entire first power-supply component.

15. The power-supply module of 13, wherein the second lead frame has a lead that is disposed inside of the package and that contacts the first lead frame.

24. A power-supply module, comprising:

a package having a first side and a second side;

an electromagnetic-interference shield including

a platform disposed adjacent to the first side of the package, and

a first lead frame disposed adjacent to the second side of the package;

a first power-supply component electrically coupled to one of the platform and the first lead frame;

a second power-supply component electrically coupled to the other of the platform and the first lead frame;

wherein the first lead frame is disposed adjacent to a bottom side of the package and has first and second leads with respective first and second lead portions that are exposed adjacent to first and bottom sides of the package; and

wherein the platform includes a second lead frame disposed adjacent to a top side of the package and having third and fourth leads that extend along the first side of the package to the bottom side of the package and having respective third and fourth lead portions that are exposed adjacent to the first and bottom sides of the package and that extend between the first and second lead portions.

29. A system, comprising:

a power-supply module, including

a package having first and second sides,

an electromagnetic-shield platform disposed adjacent to one of the first and second sides of the package,

an electromagnetic-shield lead frame disposed adjacent to the other of the first and second sides of the package,

a first electronic component electrically coupled to one of the platform and the lead frame,

a second electronic component electrically coupled to the other of the platform and the lead frame, and

a supply output node; and

an integrated circuit coupled to the supply output node.

30. The system of claim 29 wherein the integrated circuit comprises a processor.

31. The system of claim 29 wherein the integrated circuit comprises a memory.

41. The system of claim 29 wherein:

the electromagnetic-shield platform is disposed over one of the first and second electronic components in its entirety and is disposed under the other one of the first and second electronic components in its entirety; and

the electromagnetic-shield lead is disposed over the other one of the first and second electronic components in its entirety and is disposed under the one of the first and second electronic components in its entirety.

32. A method, comprising:

electrically coupling a first power-supply component to a side of an electromagnetic-interference-shielding platform;

disposing a first lead frame to form an electromagnetic-interference shield adjacent to the side of the platform;

electrically coupling a second power-supply component to a side of the lead frame;

packaging the first and second components, platform, and shield; and

exposing a portion of the lead frame through the package, wherein the exposed portion is configured to be coupled to a heat sink.

33. The method of claim 32 wherein the platform comprises a circuit board.

34. The method of claim 32 wherein the platform comprises a second lead frame.

35. The method of claim 32, further comprising attaching the first component to the platform.

36. The method of claim 32 wherein disposing the lead frame includes disposing the shield approximately perpendicular to the platform.

37. The method of claim 32 wherein packaging includes covering the first and second components, platform, and shield with a packaging material.

38. The method of claim 32 wherein packaging includes disposing epoxy around the first and second components, platform, and shield.

42. The method of claim 32 wherein:

electrically coupling the first power-supply component includes electrically coupling the first power-supply component to the side of the electromagnetic-interference-shielding platform such that the electromagnetic-interference-shielding platform completely covers the first power-supply component; and

disposing the first lead frame includes disposing the first lead frame such that the electromagnetic-interference shield completely covers the first power-supply component.

43. The method of claim 42 wherein electrically coupling the second power-supply component includes electrically coupling the second power-supply component to the side of the lead frame such that the electromagnetic-interference-shielding platform and the electromagnetic-interference shield completely cover the second power-supply component.

44. A circuit module, comprising:

a package having a first side and a second side;

an electromagnetic-interference shield including

a platform disposed adjacent to the first side of the package, and

a first lead frame disposed adjacent to the second side of the package;

a first power-supply component electrically coupled to one of the platform and the first lead frame such that the platform and the first lead frame completely overlap the first power-supply component; and

a second power-supply component electrically coupled to the other of the platform and the first lead frame.

45. The circuit module of claim 44 wherein the second power-supply component is electrically coupled to the other of the platform and the first lead frame such that the platform and the first lead frame completely overlap the second power-supply component.