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Micro electromechanical system sensor and method of forming the same

  • US 9,725,310 B2
  • Filed: 12/20/2013
  • Issued: 08/08/2017
  • Est. Priority Date: 12/20/2013
  • Status: Active Grant
First Claim
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1. A micro electromechanical system (MEMS) device comprising:

  • a MEMS section attached to a substrate;

    a cap bonded to a first surface of the substrate;

    a carrier bonded to a second surface of the substrate opposite the first surface, wherein the carrier is free of active devices, and the cap and the carrier define a vacuum region surrounding the MEMS section;

    a bond pad within the carrier and exposed at a surface of the carrier opposite the MEMS section, wherein the bond pad is electrically connected to the MEMS section; and

    an isolation trench extending through the carrier and encircling a periphery of the bond pad in the carrier.

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