Micro electromechanical system sensor and method of forming the same
First Claim
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1. A micro electromechanical system (MEMS) device comprising:
- a MEMS section attached to a substrate;
a cap bonded to a first surface of the substrate;
a carrier bonded to a second surface of the substrate opposite the first surface, wherein the carrier is free of active devices, and the cap and the carrier define a vacuum region surrounding the MEMS section;
a bond pad within the carrier and exposed at a surface of the carrier opposite the MEMS section, wherein the bond pad is electrically connected to the MEMS section; and
an isolation trench extending through the carrier and encircling a periphery of the bond pad in the carrier.
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Abstract
A micro electromechanical system (MEMS) device includes a MEMS section attached to a substrate, and a cap bonded to a first surface of the substrate. The MEMS device further includes a carrier bonded to a second surface of the substrate opposite the first surface, wherein the carrier is free of active devices, and the cap and the carrier define a vacuum region surrounding the MEMS section. The MEMS device further includes a bond pad on a surface of the carrier opposite the MEMS section, wherein the bond pad is electrically connected to the MEMS section.
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Citations
20 Claims
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1. A micro electromechanical system (MEMS) device comprising:
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a MEMS section attached to a substrate; a cap bonded to a first surface of the substrate; a carrier bonded to a second surface of the substrate opposite the first surface, wherein the carrier is free of active devices, and the cap and the carrier define a vacuum region surrounding the MEMS section; a bond pad within the carrier and exposed at a surface of the carrier opposite the MEMS section, wherein the bond pad is electrically connected to the MEMS section; and an isolation trench extending through the carrier and encircling a periphery of the bond pad in the carrier. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A micro electromechanical system (MEMS) package comprising:
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a MEMS section attached to a substrate; a cap bonded to a first surface of the substrate; a carrier bonded to a second surface of the substrate opposite the first surface, wherein the carrier is free of active devices, and the cap and the carrier define a vacuum region surrounding the MEMS section; a bond pad on a surface of the carrier opposite the MEMS section, wherein the bond pad is electrically connected to the MEMS section; an active circuit wafer, the active circuit wafer comprising an active circuit substrate and an interconnect structure, the interconnect structure bonded to the surface of the carrier opposite the MEMS section at an interface, wherein the carrier is positioned to block outgassing from the interconnect structure from entering the vacuum region, and the interconnect structure comprises an interconnect bond pad bonded to the bond pad, wherein grain boundaries between the interconnect bond pad and the bond pad extend across the interface; and a conductive element through the active circuit substrate, the conductive element configured to transfer a signal to external circuitry. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A micro electromechanical system (MEMS) device comprising:
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a MEMS section attached to a substrate; a cap bonded to a first surface of the substrate; a carrier bonded to a second surface of the substrate opposite the first surface, wherein the carrier is free of active devices, and the cap and the carrier define a vacuum region surrounding the MEMS section; an interconnect structure electrically connected to the MEMS section, wherein the carrier is bonded to the interconnect structure by a semiconductor-oxide bond; a first bond pad in the carrier; and a second bond pad in the interconnect structure, wherein grain boundaries of the first bond pad extend across an interface of the first bond pad and the second bond pad. - View Dependent Claims (17, 18, 19, 20)
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Specification