Method and apparatus for using light emitting diodes for curing

• US 9,726,435 B2
• Filed: 01/24/2005
• Issued: 08/08/2017
• Est. Priority Date: 07/25/2002
• Status: Active Grant

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Dahm, Jonathan S.
• Primary Examiner(s): LEWIS, RALPH A
• Application Number:
  US11/042,970
• Publication Number:
  US 20050158687A1
• Time in Patent Office: 4,579 Days
• Field of Search: 433 29, 433215, 606 1, 606 13, 606 16, 607 80, 362800
• CPC Class Codes: A61C 19/004 Hand-held apparatus, e.g. guns
• CPC Class Codes: A61N 2005/0652 Arrays of diodes
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]

Abstract

The present invention provides a method and apparatus for using light emitting diodes for curing in various applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention that utilizes heat pipes performs far more efficiently in much more compact space. This allows much more closely spaced LEDs operating at higher power and brightness.

Claims

1. An apparatus for transporting thermal energy, the apparatus comprising:

at least one heat pipe, each heat pipe having a first end and a second end;

a cavity formed in each heat pipe;

a wicking structure within the cavity, said wicking structure including a capillary-action material extending from the first end to the second end; and

a light emitting device mounted to a tip body end surface on the first end of each heat pipe;

wherein said wicking structure extends over and substantially covers the tip body end surface immediately under the light emitting device.

2. An apparatus of claim 1 wherein said light emitting device is supported at a distal end of a housing tube and wherein said tube is flexible.

3. An apparatus of claim 1 wherein said light emitting device is supported at a distal end of a housing tube and wherein said tube is elongate and is bent.

4. An apparatus comprising:

a housing;

an optical reflector at least partially within the housing;

at least one light emitting device creating light, the light impinging on the reflector;

a heat pipe mounted at least partially within the housing, a light emitting device mounted to the heat pipe;

a fan in flow communication with the housing, the fan configured to move cooling air directly over said heat pipe.

5. The apparatus of claim 4 wherein the heat pipe is in thermal connection with the housing.

6. The apparatus of claim 4 wherein the housing has an aperture for removing air flow from the housing.

7. An apparatus for transporting thermal energy, the apparatus comprising:

at least one elongated heat pipe, each heat pipe having a first end and a second end, wherein the first end includes a tip body surface that is transverse to the length of the heat pipe;

a cavity formed in each heat pipe;

a wicking structure within the cavity, said wicking structure including a capillary-action material extending from the first end to the second end; and

a light emitting device mounted to the tip body surface on the first end of each heat pipe;

wherein said wicking structure substantially covers the inside of the tip body surface immediately under the light emitting device.

8. An apparatus of claim 7 wherein said light emitting device is supported at a distal end of a housing tube and wherein said tube is flexible.

9. An apparatus of claim 7 wherein said light emitting device is supported at a distal end of a housing tube and wherein said tube is elongate and is bent.