Imaging structure color conversion

• US 9,726,887 B2
• Filed: 02/15/2012
• Issued: 08/08/2017
• Est. Priority Date: 02/15/2012
• Status: Active Grant

• Current Assignee: Microsoft Technology Licensing LLC (Microsoft Corporation)
• Original Assignee: Microsoft Technology Licensing LLC (Microsoft Corporation)
• Inventors: Bohn, David D., Nowatzyk, Andreas G., Fleck, Rod G.
• Primary Examiner(s): Coughlin, Andrew
• Application Number:
  US13/397,539
• Publication Number:
  US 20130208482A1
• Time in Patent Office: 2,001 Days
• CPC Class Codes: G02B 2027/0112 comprising device for genereting colour display
• CPC Class Codes: G02B 27/017 Head mounted

Abstract

In embodiments of imaging structure color conversion, an imaging structure includes a silicon backplane with a driver pad array. An embedded light source is formed on the driver pad array in an emitter material layer, and the embedded light source emits light in a first color. A conductive material layer over the embedded light source forms a p-n junction between the emitter material layer and the conductive material layer. A color conversion layer can then convert a portion of the first color to at least a second color. Further, micro lens optics can be implemented to direct the light that is emitted through the color conversion layer.

Claims

1. An imaging structure, comprising:

a silicon backplane with a driver pad array;

an embedded light source formed as an individual emitter on the driver pad array in an emitter material layer, the embedded light source configured to emit light in a first color, the embedded light source formed to approximate a parabolic structure configured to reflect the light through a micro lens optic;

a conductive material layer over the embedded light source forms a p-n junction between the emitter material layer and the conductive material layer; and

a color conversion layer configured to convert only a portion of the light in the first color that is emitted from the embedded light source to at least a second color.

2. An imaging structure as recited in claim 1, wherein the color conversion layer is formed with one of phosphorus material or quantum dots configured to convert the portion of the first color to the second color.

3. An imaging structure as recited in claim 1, wherein the first color is one of UV light or blue light emitted by the embedded light source.

4. An imaging structure as recited in claim 1, wherein the first color is one of green light or red light emitted by the embedded light source, and wherein the first color is converted to one of red light or infra-red light.

5. An imaging structure as recited in claim 1, wherein the color conversion layer is further configured to convert an additional portion of the first color to a third color.

6. An imaging structure as recited in claim 5, wherein:

the first color is blue light emitted by the embedded light source;

the second color is red light converted from the portion of the blue light; and

the third color is green light converted from the additional portion of the blue light.

7. An imaging structure as recited in claim 5, wherein:

the first color is blue light emitted by the embedded light source;

the color conversion layer comprises a red stripe configured to convert the portion of the blue light to red light; and

the color conversion layer further comprises a green stripe configured to convert the additional portion of the blue light to green light.

8. An imaging structure as recited in claim 1, further comprising the micro lens optic configured to direct the light that is emitted through the color conversion layer.

9. An imaging structure as recited in claim 8, wherein the color conversion layer is integrated with micro lens optics.

10. A method, comprising:

forming an imaging structure that comprises a silicon backplane with a driver pad array that controls an embedded light source formed as an individual direct emitter on the driver pad array in an emitter material layer, the embedded light source formed to approximate a parabolic structure configured to reflect light through a micro lens optic, and a conductive material layer over the embedded light source;

forming a color conversion layer over the imaging structure;

emitting the light from the imaging structure in a first color; and

converting only a portion of the light in the first color that is emitted from the embedded light source to at least a second color through the color conversion layer.

11. A method as recited in claim 10, further comprising converting an additional portion of the first color to a third color.

12. A method as recited in claim 11, wherein:

the first color is blue light emitted from the imaging structure;

the second color is red light converted from the portion of the blue light; and

the third color is green light converted from the additional portion of the blue light.

13. A method as recited in claim 11, wherein:

the first color is blue light emitted by the embedded light source;

the color conversion layer comprises a red stripe that converts the portion of the blue light to red light; and

the color conversion layer further comprises a green stripe that converts the additional portion of the blue light to green light.

14. A method as recited in claim 10, wherein the embedded light source is one of a laser or an LED for direct light emission.

15. A method as recited in claim 10, further comprising directing the light that is emitted from the imaging structure and through the color conversion layer with micro lens optics.

16. A method as recited in claim 15, wherein the color conversion layer is integrated with the micro lens optics.

17. A method, comprising:

emitting light from an imaging unit in a first color, the light emitted by an imaging structure comprising;

a silicon backplane with a driver pad array that controls an embedded light source formed as an individual emitter on the driver pad array in an emitter material layer, the embedded light source formed to approximate a parabolic structure configured to reflect light through a micro lens optic; and

a conductive material layer over the embedded light source forming a p-n junction between the emitter material layer and the conductive material layer;

;

and

converting only a portion of the light in the first color that is emitted from the embedded light source to at least a second color through a color conversion layer that is formed over the imaging structure.

18. A method as recited in claim 17, further comprising converting an additional portion of the first color to a third color.

19. A method as recited in claim 18, wherein:

the first color is blue light emitted from the imaging structure;

the second color is red light converted from the portion of the blue light; and

the third color is green light converted from the additional portion of the blue light.

20. A method as recited in claim 17, wherein:

the first color is blue light emitted by the embedded light source;

the color conversion layer comprises a red stripe that converts the portion of the blue light to red light; and

the color conversion layer further comprises a green stripe that converts the additional portion of the blue light to green light.