Wiring substrate

• US 9,727,196 B2
• Filed: 01/11/2016
• Issued: 08/08/2017
• Est. Priority Date: 07/12/2013
• Status: Active Grant

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: Tada, Nobuyuki, Endo, Yasushi, Hashimoto, Akihiro, Kuriki, Tadashi
• Primary Examiner(s): Tran, Binh
• Application Number:
  US14/992,429
• Publication Number:
  US 20160124550A1
• Time in Patent Office: 575 Days
• Field of Search: 33748, 33760, 33772, 345174, 349151, 349152
• CPC Class Codes: G02F 1/1345 Conductors connecting electrodes to cell terminals
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 1/136286 Wiring, e.g. gate line, drain line
• CPC Class Codes: G06F 2203/04107 Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
• CPC Class Codes: G06F 2203/04112 Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
• CPC Class Codes: H05K 1/02 Details
• CPC Class Codes: H05K 1/0289 having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/03 Use of materials for the substrate
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/11 Printed elements for providing electric connections to or between printed circuits
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/0108 Transparent
• CPC Class Codes: H05K 2201/09227 Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting

Abstract

A wiring board includes a plurality of first terminal parts for electrically connecting with a control circuit and disposed corresponding to a plurality of first electrode parts, and first terminal wiring parts for electrically connecting the plurality of first electrode parts and the corresponding first terminal parts. Each of the first terminal wiring parts has, in at least a portion thereof falling in a circle with a radius of 10 mm centering around a boundary part between the first terminal wiring parts and the corresponding first terminal parts, a portion having a line width of 5 μm to 100 μm inclusive, the wiring resistance value of the first terminal wiring parts connected to the first terminal parts being 100 ohms to 10 kohms inclusive.

Claims

1. A wiring board including an insulating board and an electroconductive section disposed on a surface of the insulating board, wherein

the electroconductive section comprises:

a plurality of electrodes disposed on the surface of the insulating board;

a plurality of terminals disposed on the surface of the insulating board in corresponding relation to the electrodes, for electric connection to an external circuit; and

terminal interconnects disposed on the surface of the insulating board and configured to electrically connect the electrodes respectively to the terminals corresponding thereto, said terminal interconnects are made of a single material;

a line width of a portion of each of the terminal interconnects which lies within a circle having a radius of 10 mm about a boundary between the terminal interconnect and the corresponding one of the terminals is configured to be 5 μ

m or greater and 100 μ

m or smaller; and

an interconnect resistance value of each of the terminal interconnects is configured to be 100 ohms or greater and 10 kohms or smaller, wherein

the plurality of electrodes are disposed as a transparent electroconductive layer on the surface of the insulating board;

the plurality of terminals are disposed on the surface of the insulating board in corresponding relation to the electrodes, for electric connection to an external circuit;

the terminal interconnects are disposed on the surface of the insulating board and configured to electrically connect the electrodes respectively to the terminals corresponding thereto; and

the electroconductive section has a same thickness in the electrodes, the terminals, and the terminal interconnects.

2. The wiring board according to claim 1, wherein the line width of the portion of each of the terminal interconnects which lies within the circle having the radius of 10 mm about the boundary between the terminal interconnect and the corresponding one of the terminals is configured to be 10 μ

m or greater and 50 μ

m or smaller.

3. The wiring board according to claim 1, wherein the interconnect resistance value of each of the terminal interconnects is configured to be 200 ohms or greater and 5 kohms or smaller.

4. The wiring board according to claim 1, wherein the terminal interconnect connected to one or more of the terminals whose linear distance up to the corresponding electrode is shortest, includes a portion which lies within the circle having a radius of 10 mm about a boundary between the terminal interconnect and the corresponding terminal, and the portion is configured to extend tortuously longer than the linear distance.

5. The wiring board according to claim 1, wherein the terminal interconnect connected to one or more of the terminals whose linear distance up to the corresponding electrode is shortest, includes a portion which lies within the circle having a radius of 10 mm about a boundary between the terminal interconnect and the corresponding terminal, and the portion includes at least one bend.

6. The wiring board according to claim 5, wherein the portion has a pattern in which the bend is repeated at least once;

and

the pattern has an interval which is at least twice greater than the line width of the pattern.

7. The wiring board according to claim 1, wherein an electrode film which is kept at a constant potential is formed on a reverse side of the insulating board in a portion thereof which is close to the terminals and is configured to face a portion of each of the terminal interconnects.

8. The wiring board according to claim 1, wherein the electroconductive section is configured to be made of a single electroconductive material, and the single electroconductive material comprises a metal which is one of silver, copper, and aluminum, or an alloy containing at least one of silver, copper, and aluminum.

9. The wiring board according to claim 1, wherein the electroconductive section has an electroconductivity in a range of 1×

10⁶ to 5×

10⁶ S/m.