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Cavity package with composite substrate

  • US 9,728,510 B2
  • Filed: 11/25/2015
  • Issued: 08/08/2017
  • Est. Priority Date: 04/10/2015
  • Status: Active Grant
First Claim
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1. An integrated device package comprising:

  • a package substrate comprising;

    a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction, the composite die pad comprising a metal die pad and an insulator die pad comprising an insulating material, the insulator die pad being disposed on the metal die pad such that the insulator die pad is exposed at the upper surface of the composite die pad; and

    a plurality of leads disposed about at least a portion of a perimeter of the insulator die pad;

    an integrated device die disposed on and mounted to the insulator die pad; and

    a package lid mounted to the package substrate to define a cavity, the integrated device die disposed within the cavity.

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