Cavity package with composite substrate
First Claim
Patent Images
1. An integrated device package comprising:
- a package substrate comprising;
a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction, the composite die pad comprising a metal die pad and an insulator die pad comprising an insulating material, the insulator die pad being disposed on the metal die pad such that the insulator die pad is exposed at the upper surface of the composite die pad; and
a plurality of leads disposed about at least a portion of a perimeter of the insulator die pad;
an integrated device die disposed on and mounted to the insulator die pad; and
a package lid mounted to the package substrate to define a cavity, the integrated device die disposed within the cavity.
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Abstract
An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad.
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Citations
20 Claims
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1. An integrated device package comprising:
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a package substrate comprising; a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction, the composite die pad comprising a metal die pad and an insulator die pad comprising an insulating material, the insulator die pad being disposed on the metal die pad such that the insulator die pad is exposed at the upper surface of the composite die pad; and a plurality of leads disposed about at least a portion of a perimeter of the insulator die pad; an integrated device die disposed on and mounted to the insulator die pad; and a package lid mounted to the package substrate to define a cavity, the integrated device die disposed within the cavity. - View Dependent Claims (2, 3, 4, 5, 9, 10)
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6. An integrated device package comprising:
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a package substrate comprising; an insulator die pad comprising an insulating material; and a plurality of leads disposed about at least a portion of a perimeter of the insulator die pad; an integrated device die mounted over the insulator die pad; a package lid mounted to the package substrate to define a cavity, the integrated device die disposed within the cavity; and an annular metal ring disposed about the insulator die pad such that the insulator die pad is within the annular metal ring. - View Dependent Claims (7, 8, 11, 12, 13, 14, 15, 16, 17)
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18. A method of manufacturing an integrated device package, the method comprising:
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providing a package substrate comprising; an insulator die pad comprising an insulating material; and a plurality of leads disposed about at least a portion of a perimeter of the insulator die pad; providing an annular metal ring disposed about the insulator die pad such that the insulator die pad is within the annular metal ring; mounting an integrated device die over the insulator die pad; and mounting a package lid to the package substrate to define a cavity such that the integrated device die is disposed within the cavity. - View Dependent Claims (19, 20)
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Specification