Cavity package with composite substrate

• US 9,728,510 B2
• Filed: 11/25/2015
• Issued: 08/08/2017
• Est. Priority Date: 04/10/2015
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Xue, Xiaojie, Sengupta, Dipak
• Primary Examiner(s): Abdelaziez, Yasser A
• Application Number:
  US14/952,562
• Publication Number:
  US 20160300781A1
• Time in Patent Office: 622 Days
• CPC Class Codes: B81B 7/0048 between the MEMS die and the substrate
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73207 Bump and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/043 the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/562 Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15159 : Side view
• CPC Class Codes: H01L 2924/16251 : Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/16315 : Shape
• CPC Class Codes: H01L 2924/1632 : Disposition
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad.

Claims

1. An integrated device package comprising:

a package substrate comprising;

a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction, the composite die pad comprising a metal die pad and an insulator die pad comprising an insulating material, the insulator die pad being disposed on the metal die pad such that the insulator die pad is exposed at the upper surface of the composite die pad; and

a plurality of leads disposed about at least a portion of a perimeter of the insulator die pad;

an integrated device die disposed on and mounted to the insulator die pad; and

a package lid mounted to the package substrate to define a cavity, the integrated device die disposed within the cavity.

2. The package of claim 1, wherein the package substrate comprises a molded leadframe in which a metal leadframe is at least partially embedded in a molding material.

3. The package of claim 1, wherein the insulator die pad and the metal die pad are disposed adjacent one another along the vertical direction and the metal die pad is exposed at the lower surface of the composite die pad.

4. The package of claim 1, wherein the package lid is electrically grounded to form a radio frequency (RF) shield.

5. The package of claim 1, further comprising an adhesive disposed between the composite die pad and the integrated device die.

9. The package of claim 1, wherein the integrated device die comprises a motion sensor die.

10. The package of claim 1, wherein the metal die pad is patterned with one or more holes and the one or more holes are filled with a molding material.

6. An integrated device package comprising:

a package substrate comprising;

an insulator die pad comprising an insulating material; and

a plurality of leads disposed about at least a portion of a perimeter of the insulator die pad;

an integrated device die mounted over the insulator die pad;

a package lid mounted to the package substrate to define a cavity, the integrated device die disposed within the cavity; and

an annular metal ring disposed about the insulator die pad such that the insulator die pad is within the annular metal ring.

7. The package of claim 6, wherein the package substrate comprises a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction, the composite die pad comprising the insulator die pad and a metal die pad, and wherein the metal die pad is disposed on top of the insulator die pad such that the metal die pad is exposed at the upper surface of the composite die pad and the insulator die pad is exposed at the lower surface of the composite die pad.

8. The package of claim 6, wherein the package substrate comprises a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction, the composite die pad comprising the insulator die pad and a metal die pad, and wherein the metal die pad is embedded within the insulator die pad such that the insulator die pad is exposed at the upper surface and the lower surface of the composite die pad.

11. The package of claim 6, wherein the package substrate comprises a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction, the composite die pad comprising the insulator die pad and a metal die pad, wherein the insulator die pad is disposed above and on top of the metal die pad such that the insulator die pad is exposed at the upper surface of the composite die pad and the metal die pad is exposed at the lower surface of the composite die pad.

12. The package of claim 6, wherein the

package substrate comprises a molded leadframe in which a metal leadframe is at least partially embedded in a molding material.

13. The package of claim 6, wherein the package lid is electrically grounded to form a radio frequency (RF) shield.

14. The package of claim 6, wherein a top surface of the annular metal ring defines a portion of an upper surface of the package substrate and a bottom surface of the annular metal ring defines a portion of a lower surface of the package substrate.

15. The package of claim 14, wherein the package lid is mounted to the top surface of the annular metal ring.

16. The package of claim 6, wherein the annular metal ring is disposed about a peripheral portion of the package substrate.

17. The package of claim 6, wherein the annular metal ring is disposed between the leads and the insulator die pad.

18. A method of manufacturing an integrated device package, the method comprising:

providing a package substrate comprising;

an insulator die pad comprising an insulating material; and

a plurality of leads disposed about at least a portion of a perimeter of the insulator die pad;

providing an annular metal ring disposed about the insulator die pad such that the insulator die pad is within the annular metal ring;

mounting an integrated device die over the insulator die pad; and

mounting a package lid to the package substrate to define a cavity such that the integrated device die is disposed within the cavity.

19. The method of claim 18, wherein providing the package substrate comprises providing a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction, the composite die pad comprising the insulator die pad and a metal die pad, the insulator die pad and the metal die pad being disposed adjacent one another along the vertical direction.

20. The method of claim 19, wherein the insulator die pad is disposed above the metal die pad such that the insulator die pad is exposed at the upper surface of the composite die pad and the metal die pad is exposed at the lower surface of the composite die pad.