Semiconductor light emitting device
First Claim
1. A light emitting device package, comprising:
- a substrate having a front surface and a rear surface, the front surface of the substrate having a first opening and a second opening;
a first conductive part formed on the front surface of the substrate;
a second conductive part formed on the front surface of the substrate;
a third conductive part formed in the first opening, and connected to the first conductive part;
a fourth conductive part formed in the second opening, and connected to the second conductive part;
a fifth conductive part formed on the rear surface of the substrate, and electrically connected to the first conductive part through the third conductive part;
a sixth conductive part formed on the rear surface of the substrate, and electrically connected to the second conductive part through the fourth conductive part;
an LED chip mounted on the front surface of the substrate, having a front surface and a rear surface, and including an anode electrode, which is connected to the first conductive part and formed on the rear surface of the LED chip, and a cathode electrode, which is connected to the second conductive part and formed on the rear surface of the LED chip, the rear surface of the LED chip facing the front surface of the substrate; and
a light transmitting resin covering the LED chip, formed on the front surface of the substrate, and transmitting a light from the LED chip.
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Abstract
A semiconductor light emitting device includes an LED chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked on a substrate. The LED chip further includes an anode electrode connected to the p-type semiconductor, and a cathode connected to the n-type semiconductor. The anode and cathode electrodes face a case with the LED chip mounted thereon. The case includes a base member including front and rear surfaces, and wirings including a front surface layer having anode and cathode pads formed at the front surface, a rear surface layer having anode and cathode mounting electrodes formed at the rear surface, an anode through wiring connecting the anode pad and the anode mounting electrode and passing through a portion of the base member, and a cathode through wirings connecting the cathode pad and the cathode mounting electrode and passing through a portion of the base member.
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Citations
18 Claims
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1. A light emitting device package, comprising:
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a substrate having a front surface and a rear surface, the front surface of the substrate having a first opening and a second opening; a first conductive part formed on the front surface of the substrate; a second conductive part formed on the front surface of the substrate; a third conductive part formed in the first opening, and connected to the first conductive part; a fourth conductive part formed in the second opening, and connected to the second conductive part; a fifth conductive part formed on the rear surface of the substrate, and electrically connected to the first conductive part through the third conductive part; a sixth conductive part formed on the rear surface of the substrate, and electrically connected to the second conductive part through the fourth conductive part; an LED chip mounted on the front surface of the substrate, having a front surface and a rear surface, and including an anode electrode, which is connected to the first conductive part and formed on the rear surface of the LED chip, and a cathode electrode, which is connected to the second conductive part and formed on the rear surface of the LED chip, the rear surface of the LED chip facing the front surface of the substrate; and a light transmitting resin covering the LED chip, formed on the front surface of the substrate, and transmitting a light from the LED chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A light emitting device package, comprising:
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a substrate having a front surface and a rear surface, the front surface of the substrate having a first opening and a second opening; a first lead formed on the front surface of the substrate; a second lead formed on the front surface of the substrate; a first electrode formed in the first opening, and connected to the first lead; a second electrode formed in the second opening, and connected to the second lead; a third electrode formed on the rear surface of the substrate, and electrically connected to the first lead through the first electrode; a fourth electrode formed on the rear surface of the substrate, and electrically connected to the second lead through the second electrode; and an LED chip mounted on the front surface of the substrate, having a front surface and a rear surface, and including an anode electrode, which is connected to the first conductive part and formed on the rear surface of the LED chip, and a cathode electrode, which is connected to the second conductive part and formed on the rear surface of the LED chip, the rear surface of the LED chip facing the front surface of the substrate. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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Specification