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Enhanced density assembly having microelectronic packages mounted at substantial angle to board

  • US 9,728,524 B1
  • Filed: 06/30/2016
  • Issued: 08/08/2017
  • Est. Priority Date: 06/30/2016
  • Status: Active Grant
First Claim
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1. A stacked microelectronic assembly, comprising:

  • a plurality of stacked microelectronic packages, each microelectronic package comprising;

    a dielectric element having a first major surface defining a plane and a second major surface opposite the first major surface, an interconnect edge surface extending away from the first major surface and an interconnect region adjacent the interconnect edge surface;

    a plurality of electrically conductive package contacts at the interconnect region;

    a microelectronic element having a front surface overlying and substantially parallel to the major surface, and a plurality of chip contacts at the front surface electrically coupled with the package contacts; and

    an encapsulation region having a surface substantially parallel to the first and second major surfaces of the dielectric element;

    the plurality of microelectronic packages stacked with one another such that planes defined by the major surfaces of the dielectric elements are substantially parallel to one another, wherein the surface of the encapsulation region of a first microelectronic package of the plurality of microelectronic packages is mechanically coupled with the second major surface of a second microelectronic package of the plurality of microelectronic packages;

    a circuit panel having a mounting surface and surface mount panel contacts at the mounting surface, wherein the plurality of package contacts of each package in the stacked microelectronic assembly are electrically coupled via electrically conductive bumps with a corresponding set of the panel contacts at the mounting surface via a ball grid array, wherein the planes defined by the major surfaces of the dielectric elements are oriented at a non-zero angle relative to the mounting surface; and

    an underfill surrounding the electrically conductive bumps, the underfill mechanically reinforcing connections between the panel contacts and the plurality of package contacts of each package in the stacked microelectronic assembly.

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