Light emitting diode and manufacturing method thereof
First Claim
1. A method for manufacturing a light-emitting diode (LED), comprising:
- providing an LED wafer comprising a substrate and a light-emitting unit;
pasting a fixing piece on a surface of the substrate;
fixing the LED wafer on an elastic membrane, wherein the light-emitting unit faces the elastic membrane;
cutting the LED wafer together with the fixing piece to form a plurality of LEDs; and
removing the fixing piece.
3 Assignments
0 Petitions
Accused Products
Abstract
A light-emitting diode (LED) and a method for manufacturing the same are provided. The method includes following steps. An LED wafer is fixed on a crafting table and is processed such that a substrate of the LED wafer has a thickness smaller than or equal to 100 μm. A fixing piece is pasted on the LED wafer surface. The LED wafer is detached from the crafting table. The LED wafer together with the fixing piece are cut and broken, such that the LED wafer forms a plurality of LEDs. The fixing piece is removed. Before the LED wafer is detached from the crafting table, the fixing piece is pasted on the LED wafer to provide a supporting force to the LED wafer to maintain the flatness of the wafer and avoid the wafer being warped or the substrate being broken or damaged, such that product quality and reliability can be improved.
5 Citations
11 Claims
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1. A method for manufacturing a light-emitting diode (LED), comprising:
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providing an LED wafer comprising a substrate and a light-emitting unit; pasting a fixing piece on a surface of the substrate; fixing the LED wafer on an elastic membrane, wherein the light-emitting unit faces the elastic membrane; cutting the LED wafer together with the fixing piece to form a plurality of LEDs; and removing the fixing piece. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A manufacturing method of light-emitting diode (LED) characterized in that the method comprises:
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providing an LED wafer comprising a substrate and a light-emitting unit; fixing the LED wafer on a crafting table and further processing the LED wafer, such that the substrate has a thickness smaller than or equal to 100 μ
m;pasting a fixing piece on a surface of the LED wafer and removing the LED wafer from the crafting table; fixing the LED wafer on an elastic membrane, wherein the light-emitting unit faces the elastic membrane cutting and breaking the LED wafer together with the fixing piece, such that the LED wafer forms a plurality of LEDs; and removing the fixing piece. - View Dependent Claims (8, 9, 10, 11)
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Specification