High voltage monolithic LED chip
First Claim
1. A monolithic LED chip, comprising:
- a plurality of active regions on a submount;
integral electrically conductive interconnect elements in electrical contact with said plurality of active regions and electrically connecting at least some active regions of said plurality of active regions in series, wherein said interconnect elements are completely embedded within said submount; and
one or more integral insulating layers surrounding at least a portion of said interconnect elements and isolating said at least a portion of said interconnect elements from other elements of said monolithic LED chip.
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Accused Products
Abstract
Monolithic LED chips are disclosed comprising a plurality of active regions on a submount, wherein the submount comprises integral electrically conductive interconnect elements in electrical contact with the active regions and electrically connecting at least some of the active regions in series. The submount also comprises an integral insulator element electrically insulating at least some of the interconnect elements and active regions from other elements of the submount. The active regions are mounted in close proximity to one another with at least some of the active regions having a space between adjacent ones of the active regions that is 10 percent or less of the width of one or more of the active regions. The space is substantially not visible when the LED chip is emitting, such that the LED chips emits light similar to a filament.
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Citations
33 Claims
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1. A monolithic LED chip, comprising:
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a plurality of active regions on a submount; integral electrically conductive interconnect elements in electrical contact with said plurality of active regions and electrically connecting at least some active regions of said plurality of active regions in series, wherein said interconnect elements are completely embedded within said submount; and one or more integral insulating layers surrounding at least a portion of said interconnect elements and isolating said at least a portion of said interconnect elements from other elements of said monolithic LED chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A monolithic LED chip, comprising:
a plurality of active regions on a submount and configured to emit light, wherein at least some active regions of said plurality of active regions are interconnected in series with at least one serial interconnection extending entirely within an interior of said monolithic LED chip without being exposed along an outer surface of said monolithic LED chip, and wherein at least some adjacent active regions of said plurality of active regions are separated from one another by a space that is 10 percent or less of a width of one or more of said adjacent active regions, such that said space is substantially not visible when said monolithic LED chip is emitting. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A light source, comprising:
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a housing defining an opening; and a monolithic LED chip mounted within said housing and configured to transmit LED emissions out said opening, said monolithic LED chip comprising; a plurality of active regions mounted on a submount, with each active region of the plurality of active regions in close proximity to at least one other active region of the plurality of active regions, such that adjacent active regions of the plurality of active regions are separated from one another by a space that is substantially not visible when said adjacent active regions are emitting; and at least one electrical connection extending between at least one pair of active regions of the plurality of active regions and completely within said submount without being exposed along an outer surface of said monolithic LED chip. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. A monolithic LED chip, comprising:
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a plurality of active regions on a submount that includes integral electrically insulating elements; and integral electrically conductive interconnect elements forming at least one series connection extending between adjacent active regions of the plurality of active regions, wherein the at least one series connection is at least partially embedded in the integral electrically insulating elements and is entirely embedded in said submount without being exposed along an outer surface of said monolithic LED chip.
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Specification