Composite module
First Claim
1. A composite module comprising:
- a first substrate having one principal surface and another principal surface;
a second substrate having one principal surface and another principal surface, wherein the one principal surface of the second substrate is opposed to the another principal surface of the first substrate;
a first electronic component device mounted on the one principal surface of the first substrate;
an external connector disposed in a region of the one principal surface of the first substrate other than an area where the first electronic component device is mounted;
a second electronic component device mounted on the one principal surface of the second substrate; and
a heat dissipation member disposed on the another principal surface of the first substrate, wherein the heat dissipation member is disposed on the second electronic component device and directly in contact with a surface of the second electronic component device opposite to a mounting-surface of the second electronic component device,wherein the external connector is located vertically above the heat dissipation member and the second electronic component device through the first substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A wireless LAN module as a composite module according to the present invention includes a first substrate 26 and a second substrate 28 that is so disposed as opposed to the other principal surface 48b of the first substrate 26. An external connector 66 for the connection with an electronic apparatus is mounted on one principal surface 48a of the first substrate 26. An electronic component device 76a is mounted on one principal surface of the second substrate 28 in a region opposing the external connector 66 sandwiching the first substrate 26 therebetween. A heat dissipation member 78 is disposed on a surface which is an opposite side to the mounting-surface of the electronic component device 76a.
11 Citations
6 Claims
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1. A composite module comprising:
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a first substrate having one principal surface and another principal surface; a second substrate having one principal surface and another principal surface, wherein the one principal surface of the second substrate is opposed to the another principal surface of the first substrate; a first electronic component device mounted on the one principal surface of the first substrate; an external connector disposed in a region of the one principal surface of the first substrate other than an area where the first electronic component device is mounted; a second electronic component device mounted on the one principal surface of the second substrate; and a heat dissipation member disposed on the another principal surface of the first substrate, wherein the heat dissipation member is disposed on the second electronic component device and directly in contact with a surface of the second electronic component device opposite to a mounting-surface of the second electronic component device, wherein the external connector is located vertically above the heat dissipation member and the second electronic component device through the first substrate. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification