Heat sink apparatus and method for power semiconductor device module
First Claim
1. An apparatus comprising:
- a base plate having a first central portion, a second central portion, a periphery, a module facing surface, a coolant facing surface, and fins connected to the coolant facing surface;
a first plurality of heat pipes embedded in the base plate that are arranged to convey heat away from the first central portion; and
a second plurality of heat pipes embedded in the base plate that are arranged to convey heat away from the second central portion, each of the heat pipes of the first and second pluralities having a respective hot end for receiving heat flow and a respective cool end for releasing heat flow, wherein the first plurality of heat pipes and the second plurality of heat pipes are embedded in between the module facing surface and the coolant facing surface, the first plurality of heat pipes arranged to convey heat from the first central portion of the base plate to the second central portion of the base plate, and the second plurality of heat pipes arranged to convey heat away from the second central portion of the base plate to the periphery of the base plate;
an inner casing half that defines an opening, the module facing surface of the heat sink being fastened to an outer surface of the inner casing half;
a semiconductor module mounted to the module facing surface of the heat sink, and received in the opening of the inner casing half; and
an outer casing half having interior partitions, which define at least one coolant inlet channel and a trough connected with the coolant inlet channel, the outer casing half being fastened to the outer surface of the inner casing half, wherein the fins of the heat sink are enclosed in the trough.
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Accused Products
Abstract
A heat sink has a base plate that has a first central portion, a second central portion, and a periphery, a first plurality of heat pipes embedded in the base plate that are arranged to convey heat away from the first central portion, and a second plurality of the heat pipes embedded in the base plate that are arranged to convey heat away from the second central portion, each of the heat pipes of the first and second pluralities having a hot end for receiving heat flow and a cool end for releasing heat flow. A switch package comprises an inner casing half mounted to a module facing surface of the heat sink base plate, a semiconductor module mounted to the module facing surface of the heat sink within the inner casing half, and an outer casing half that encloses the heat sink.
26 Citations
18 Claims
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1. An apparatus comprising:
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a base plate having a first central portion, a second central portion, a periphery, a module facing surface, a coolant facing surface, and fins connected to the coolant facing surface; a first plurality of heat pipes embedded in the base plate that are arranged to convey heat away from the first central portion; and a second plurality of heat pipes embedded in the base plate that are arranged to convey heat away from the second central portion, each of the heat pipes of the first and second pluralities having a respective hot end for receiving heat flow and a respective cool end for releasing heat flow, wherein the first plurality of heat pipes and the second plurality of heat pipes are embedded in between the module facing surface and the coolant facing surface, the first plurality of heat pipes arranged to convey heat from the first central portion of the base plate to the second central portion of the base plate, and the second plurality of heat pipes arranged to convey heat away from the second central portion of the base plate to the periphery of the base plate; an inner casing half that defines an opening, the module facing surface of the heat sink being fastened to an outer surface of the inner casing half; a semiconductor module mounted to the module facing surface of the heat sink, and received in the opening of the inner casing half; and an outer casing half having interior partitions, which define at least one coolant inlet channel and a trough connected with the coolant inlet channel, the outer casing half being fastened to the outer surface of the inner casing half, wherein the fins of the heat sink are enclosed in the trough. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method for a semiconductor switch module, comprising:
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during operation of the semiconductor switch module, transferring heat from a first central portion of the module to a second region of a heat sink and from the second region of the heat sink to a third region of the heat sink, such that the first central portion of the module and a second portion of the module remain at uniform and equal temperatures under load, wherein the module is mounted on the heat sink, the heat sink comprising a base plate, the base plate having a module facing surface to which the module is mounted, a coolant facing surface opposite the module facing surface, and a plurality of heat pipes embedded between the module facing surface and the coolant facing surface, the plurality of heat pipes arranged to transfer heat from a first region of the heat sink to the second region of the heat sink and to the third region of the heat sink, and wherein the module is configured such that the first central portion of the module, disposed adjacent the first region of the heat sink, will be hard switched under load to generate heat at a first rate, while the second portion of the module, disposed adjacent the second region of the heat sink, will be soft switched under load to generate heat at a second rate lower than the first rate.
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Specification