Method for producing a plurality of measurement regions on a chip, and chip with measurement regions

• US 9,735,072 B2
• Filed: 05/30/2014
• Issued: 08/15/2017
• Est. Priority Date: 05/30/2013
• Status: Active Grant

• Current Assignee: Boehringer Ingelheim Vetmedica GmbH (C.H. Boehringer Sohn AG & Co. KG)
• Original Assignee: Boehringer Ingelheim Vetmedica GmbH (C.H. Boehringer Sohn AG & Co. KG)
• Inventors: Schoeder, Heinz, Schieber, Markus
• Primary Examiner(s): Seven, Evren
• Assistant Examiner(s): IMTIAZ, S M SOHEL
• Application Number:
  US14/894,421
• Publication Number:
  US 20160126151A1
• Time in Patent Office: 1,173 Days
• CPC Class Codes: B01J 2219/00317 Microwell devices, i.e. having large numbers of wells
• CPC Class Codes: B01J 2219/00619 using hydrophilic or hydrophobic regions
• CPC Class Codes: B01J 2219/00635 by reactive plasma treatment
• CPC Class Codes: B01J 2219/00637 by coating it with another layer
• CPC Class Codes: B01J 2219/00653 the compounds being bound to electrodes embedded in or on the solid supports
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0645 Electrodes
• CPC Class Codes: B01L 2300/0819 Microarrays; Biochips
• CPC Class Codes: B01L 2300/0861 Configuration of multiple channels and/or chambers in a single devices
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 3/5088 confining liquids at a location by surface tension, e.g. virtual wells on plates, wires B01L3/50857 takes precedence
• CPC Class Codes: G01N 27/403 Cells and electrode assemblies
• CPC Class Codes: H01L 22/32 Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors arrangements for conducting electric current to or from the solid state body in operation H01L23/48
• CPC Class Codes: H01L 29/401 Multistep manufacturing processes

Abstract

A a chip and a method for producing the chip with a plurality of measurement regions which are provided with electrodes for electrically detecting reactions in which, in order to reliably separate the individual measurement regions from one another, a monolayer of a fluorosilane is formed on the chip surface which has strongly hydrophobic properties. Therefore, during spotting with a liquid, the drops of liquid applied by spotting can be reliably prevented from coalescing, and thus, causing mixing of the substances in the drops of liquid which are supposed to be immobilized in the measurement regions.

Claims

1. Chip having a plurality of electrically addressable measurement regions, wherein a compartmental structure separates the measurement regions from one another on the chip surface, wherein the compartmental structure has a hydrophobic layer, wherein the hydrophobic layer contains a photoresist or is a photoresist and wherein the chip surface is planar and the compartmental structure is raised relative thereto.

2. Chip according to claim 1, wherein the photoresist is a polyamide-based photoresist.

3. Chip according to claim 1, wherein electrically contactable electrode pairings are structured in each of the measurement regions on the chip.

4. Chip according to claim 1, wherein the compartmental structure surrounds each measurement region completely or annularly with a hydrophobic layer or a hydrophobic intermediate region.

5. Chip according to claim 1, wherein the compartmental structure or hydrophobic layer is of lattice-shaped and/or honeycomb-shaped configuration.

6. Chip according to claim 1, wherein the compartmental structure or hydrophobic layer is smaller in height than in width and the width between two adjacent measurement regions is greater than the height relative to the chip surface carrying the measurement regions by at least a factor 5.

7. Chip according to claim 1, wherein the compartmental structure or hydrophobic layer forms hydrophobic intermediate regions between the measurement regions.

8. Chip according to claim 7, wherein the intermediate regions between the measurement regions have a width between the measurement regions of more than 20%, of a measurement region.

9. Chip according to claim 7, wherein the intermediate regions have a width between the measurement regions of more than 5 μ

m.

10. Chip according to claim 1, wherein the compartmental structure or the hydrophobic layer has a contact angle with water of at least 90°

.

11. Chip according to claim 1, wherein the compartmental structure or hydrophobic layer is at least briefly chemically and physically stable at temperatures up to 150°

C.

12. Method for producing a chip having a plurality of electrically addressable measurement regions, comprising:

structuring electrically contactable electrode pairings on the chip in each of the electrically addressable measurement regions, and

forming the measurement regions by producing a compartmental structure that comprises a hydrophobic layer that separates the measurement regions from each other,

wherein the hydrophobic layer is produced by applying a hydrophobic coating in the form of photoresist to the chip, resulting in a compartmental structure that is raised relative to a planar chip surface.

13. A chip having a plurality of electrically addressable measurement regions produced by the process of claim 12.