Molded semiconductor package

• US 9,735,191 B2
• Filed: 05/02/2016
• Issued: 08/15/2017
• Est. Priority Date: 12/08/1999
• Status: Expired due to Fees

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven
• Primary Examiner(s): Vieaux, Gary C
• Application Number:
  US15/143,682
• Publication Number:
  US 20160380015A1
• Time in Patent Office: 470 Days
• CPC Class Codes: G02B 7/02 for lenses supports for magnifying lenses G02B25/002
• CPC Class Codes: G02B 7/022 lens and mount having complementary engagement means, e.g. screw/thread
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 : Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/02325 : the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 : Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 : Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 : Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Claims

1. A package comprising:

a substrate comprising;

a top substrate surface having a center region and a peripheral region around the center region;

a bottom substrate surface; and

a first conductive trace on the perimeter region;

a semiconductor die coupled to the substrate, where said semiconductor die comprises an active area that is responsive to light; and

a molding comprising;

an upper molding portion comprising an aperture through which light passes to the active area of the semiconductor die; and

a lower molding portion that extends downward from the upper molding portion, where a bottom surface of the lower molding portion is adhered to the perimeter region of the top substrate surface, and the lower molding portion covers at least a portion of the first conductive trace.

2. The package of claim 1, wherein the semiconductor die comprises a first bond pad that is electrically connected to the first conductive trace.

3. The package of claim 1, comprising a first conductive via that extends completely through the substrate and is electrically connected to the first conductive trace.

4. The package of claim 3, wherein the lower molding portion covers the first conductive via.

5. The package of claim 1, comprising a second conductive trace on the perimeter region of the top substrate surface, and wherein:

the first conductive trace is positioned proximate a first edge of the substrate;

the second conductive trace is positioned proximate a second edge of the substrate opposite the first edge of the substrate; and

the lower molding portion covers at least a portion of the second conductive trace.

6. The package of claim 5, comprising:

a third conductive trace on the perimeter region of the top substrate surface and positioned proximate a third edge of the substrate; and

a fourth conductive trace on the perimeter region of the top substrate surface and positioned proximate a fourth edge of the substrate opposite the third edge of the substrate,

wherein the lower molding portion covers at least a respective portion of each of the third conductive trace and the fourth conductive trace.

7. The package of claim 1, wherein at least a portion of the first conductive trace is not covered by the lower molding portion.

8. The package of claim 7, wherein the at least a portion of the first conductive trace that is not covered by the lower molding portion extends from the lower molding portion toward the semiconductor die.

9. The package of claim 1, wherein:

the substrate comprises a lateral substrate surface that extends between the top substrate surface and the bottom substrate surface; and

the lower molding portion comprises a lateral side that is coplanar with the lateral substrate surface.

10. The package of claim 9, comprising an adhesive layer that adheres the bottom surface of the lower molding portion to the perimeter region of the top substrate surface, the adhesive layer comprising a lateral side that is coplanar with the lateral substrate surface.

11. A package comprising:

a substrate comprising;

a top substrate surface having a center region and a peripheral region around the center region;

a bottom substrate surface; and

a first conductive trace on the perimeter region;

a semiconductor die coupled to the substrate, where said semiconductor die comprises an active area that is responsive to light;

a molding comprising;

an upper molding portion comprising an aperture through which light passes to the active area of the semiconductor die; and

a lower molding portion that extends downward from the upper molding portion, where a bottom surface of the lower molding portion is adhered to the perimeter region of the top substrate surface, and the lower molding portion covers at least a portion of the first conductive trace;

a lens; and

a moveable lens holder that holds the lens and is moveably coupled to the upper molding portion and positioned such that the lens is positioned directly above the active area of the semiconductor die.

12. The package of claim 11, wherein the semiconductor die comprises a first bond pad that is electrically connected to the first conductive trace.

13. The package of claim 11, comprising a first conductive via that extends completely through the substrate and is electrically connected to the first conductive trace.

14. The package of claim 11, comprising a second conductive trace on the perimeter region of the top substrate surface, and wherein:

the first conductive trace is positioned proximate a first edge of the substrate;

the second conductive trace is positioned proximate a second edge of the substrate opposite the first edge of the substrate; and

the lower molding portion covers at least a portion of the second conductive trace.

15. The package of claim 11, wherein:

the substrate comprises a lateral substrate surface that extends between the top substrate surface and the bottom substrate surface; and

the lower molding portion comprises a lateral side that is coplanar with the lateral substrate surface.

16. A package comprising:

a substrate comprising;

a top substrate surface having a center region and a peripheral region around the center region;

a bottom substrate surface;

a first conductive trace on the perimeter region proximate a first edge of the substrate; and

a second conductive trace on the perimeter region proximate a second edge of the substrate opposite the first edge of the substrate;

a semiconductor die coupled to the substrate, where said semiconductor die comprises an active area that is responsive to light; and

a molding comprising;

an upper molding portion comprising an aperture through which light passes to the active area of the semiconductor die; and

a lower molding portion that extends downward from the upper molding portion, where a bottom surface of the lower molding portion is adhered to the perimeter region of the top substrate surface, and the lower molding portion covers at least a respective portion of each of the first conductive trace and the second conductive trace.

17. The package of claim 16, comprising a movable lens holder coupled to the upper molding portion.

18. The package of claim 16, wherein the semiconductor die comprises a first bond pad that is electrically connected to the first conductive trace.

19. The package of claim 16, comprising:

a first conductive via that extends completely through the substrate, is electrically connected to the first conductive trace, and is covered by the bottom surface of the lower molding portion; and

a second conductive via that extends completely through the substrate, is electrically connected to the second conductive trace, and is covered by the bottom surface of the lower molding portion.

20. The package of claim 16, wherein the semiconductor die is attached to the top substrate surface.