Substrate based light emitter devices, components, and related methods

• US 9,735,198 B2
• Filed: 03/15/2013
• Issued: 08/15/2017
• Est. Priority Date: 03/30/2012
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Andrews, Peter Scott, Joo, Sung Chul, Welch, Erin
• Primary Examiner(s): SANDVIK, BENJAMIN P
• Application Number:
  US13/834,195
• Publication Number:
  US 20130256711A1
• Time in Patent Office: 1,614 Days
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12035 Zener diode
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (SMD) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of devices can include at least one LED chip electrically connected to one or more traces and at least one pair of bottom contacts adapted to mount over a surface of external substrate. The component can further include a continuous layer of encapsulant disposed over each device of the plurality of devices. Multiple devices can be singulated from the component.

Claims

1. A light emitter device comprising:

a substrate;

at least one light emitter chip on a first side of the substrate, wherein the substrate comprises a recessed portion disposed below a level of the light emitter chip;

a layer of phosphor-containing encapsulant disposed over the at least one light emitter chip; and

a non-reflective, external side wall forming an outer surface of the device, the side wall being at least partially disposed in the recessed portion of the substrate, wherein a first portion of the side wall is disposed above a height of the light emitter chip, wherein a second portion of the side wall is disposed below a level of the light emitter chip, wherein the first portion of the side wall contacts the layer of phosphor-containing encapsulant, and wherein the side wall is spaced apart from the light emitter chip by the layer of phosphor-containing encapsulant thereby retaining the layer of phosphor-containing encapsulant.

2. The device according to claim 1, wherein the substrate comprises ceramic.

3. The device according to claim 1, wherein the side wall comprises silicone.

4. The device according to claim 1, wherein the side wall comprises a polymeric material.

5. The device according to claim 1, wherein the side wall comprises at least some light diffusing material.

6. The device according to claim 1, wherein the side wall comprises multiple layers of material.

7. The device according to claim 1, wherein the side wall comprises phosphor.

8. The device according to claim 1, wherein the side wall comprises a filter or light filtering material.

9. The device according to claim 1, wherein the side wall comprises a material adapted to block some light.

10. The device according to claim 1, wherein the side wall comprises a material adapted to absorb some light.

11. The device according to claim 1, wherein the substrate comprises alumina.

12. The device according to claim 1, wherein the substrate comprises aluminum nitride.

13. The device according to claim 1, further comprising a layer of non-phosphor containing encapsulant provided over the at least one light emitter chip.

14. The device according to claim 1, wherein the side wall comprises phosphor that is non-uniformly dispersed therein.

15. The device according to claim 1, wherein the side wall comprises a thermoplastic material.

16. The device according to claim 1, further comprising at least two layers of phosphor-containing encapsulant disposed over the at least one light emitter chip.

17. A light emitter device comprising:

a ceramic substrate;

at least one light emitter chip on a first side of the substrate, wherein the substrate comprises a recessed portion disposed below a level of the light emitter chip;

a layer of encapsulant disposed over the at least one light emitter chip; and

a non-reflective, external side wall forming an outer surface of the device being spaced apart from the light emitter chip by the layer of encapsulant for retaining the layer of encapsulant, the side wall being at least partially disposed in the recessed portion of the substrate, wherein a first portion of the non-reflective side wall is disposed above a height of the light emitter chip, and wherein a second portion of the non-reflective side wall is disposed below a level of the light emitter chip.

18. A light emitter device comprising:

a substrate;

at least one light emitter chip on a first side of the substrate, wherein the substrate comprises a recessed portion disposed below a level of the light emitter chip;

a layer of phosphor-containing encapsulant disposed over the at least one light emitter chip; and

a lateral side wall at least partially disposed in the recessed portion of the substrate, wherein the lateral side wall comprises phosphor that is non-uniformly dispersed therein, wherein a first portion of the lateral side wall is disposed above a height of the light emitter chip, wherein a second portion of the lateral side wall is disposed below a level of the light emitter chip, wherein the first portion of the lateral side wall contacts the layer of phosphor-containing encapsulant, and wherein the lateral side wall is spaced apart from the light emitter chip by the layer of phosphor-containing encapsulant thereby retaining the layer of phosphor-containing encapsulant.