Semiconductor light emitting device package and method for manufacturing the same

• US 9,735,313 B2
• Filed: 12/17/2015
• Issued: 08/15/2017
• Est. Priority Date: 01/05/2015
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Park, Il Woo, Kim, Jung Hoon
• Primary Examiner(s): Smith, Zandra
• Assistant Examiner(s): Parker, John M
• Application Number:
  US14/972,532
• Publication Number:
  US 20160197229A1
• Time in Patent Office: 607 Days
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 2924/10155 being other than a cuboid
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/50 Wavelength conversion elements

Abstract

A method for manufacturing a semiconductor light emitting device package includes forming a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially stacked on a growth substrate, forming a reflective layer on a first surface of the light emitting structure corresponding to a surface of the second conductivity-type semiconductor layer, forming bumps on the first surface, the bumps being electrically connected to the first or second conductivity-type semiconductor layer and protruding from the reflective layer, bonding a support substrate to the bumps on the first surface, removing the growth substrate, bonding a light transmissive substrate coated with a wavelength conversion layer to a second surface of the light emitting structure from which the growth substrate is removed, and removing the support substrate. The reflective layer covers at least portions of side surfaces of the light emitting structure and the bumps.

Claims

1. A method for manufacturing a semiconductor light emitting device package, the method comprising:

forming a light emitting structure on a growth substrate;

forming a reflective layer on a first surface of the light emitting structure;

forming bumps on the first surface of the light emitting structure, the bumps being electrically connected to the light emitting structure and protruding from the reflective layer;

bonding a support substrate to the bumps on the first surface of the light emitting structure;

removing the growth substrate;

bonding a light transmissive substrate coated with a wavelength conversion layer to a second surface of the light emitting structure from which the growth substrate is removed; and

removing the support substrate,

wherein the reflective layer covers at least a portion of side surfaces of the light emitting structure and at least a portion of side surfaces of the bumps.

2. The method of claim 1, wherein the side surfaces of the light emitting structure are covered by the reflective layer and the wavelength conversion layer.

3. The method of claim 1, wherein at least one of the side surfaces of the light emitting structure includes at least two inclined surfaces having different inclinations.

4. The method of claim 3, wherein a boundary between the two inclined surfaces corresponds to a boundary between the reflective layer and the wavelength conversion layer.

5. The method of claim 1, wherein the light emitting structure includes a first conductivity-type semiconductor layer, and

wherein the wavelength conversion layer is formed on a surface of the light transmissive substrate facing the first conductivity-type semiconductor layer.

6. The method of claim 1, wherein the forming of the reflective layer includes:

forming a mask layer, covering regions in which the bumps are to be formed and isolation regions in which the light emitting structure is cut into package units, on the first surface of the light emitting structure;

forming a material layer for forming the reflective layer to cover portions of the light emitting structure exposed through the mask layer;

removing a portion of the material layer for forming the reflective layer using a planarization method to expose a top surface of the mask layer; and

removing the mask layer.

7. The method of claim 1, wherein the bumps protrude from a top surface of the reflective layer.

8. The method of claim 1, further comprising, prior to forming the reflective layer:

mesa-etching the light emitting structure to expose a portion of a first conductivity-type semiconductor layer of the light emitting structure; and

forming electrodes and bump pads on the first surface of the light emitting structure.

9. The method of claim 1, wherein the support substrate is bonded to the bumps on the first surface of the light emitting structure using an adhesive layer.

10. The method of claim 1, further comprising forming uneven portions on the second surface of the light emitting structure after removing the growth substrate.

11. The method of claim 1, further comprising removing a portion of the light emitting structure and dividing the light emitting structure into package units, after removing the growth substrate.

12. The method of claim 1, further comprising cutting the light transmissive substrate and the wavelength conversion layer into package units, after removing the support substrate.

13. The method of claim 1, wherein a plurality of semiconductor light emitting device packages are manufactured on a wafer level, and

the wavelength conversion layer is bonded to the light emitting structure on the wafer level.

14. The method of claim 13, wherein the wavelength conversion layer has a thickness variation of 1 μ

m to 3 μ

m among the plurality of packages manufactured on the wafer level.

15. A method for manufacturing a semiconductor light emitting device package, the method comprising:

forming a light emitting structure on a growth substrate;

forming a reflective layer on a first surface of the light emitting structure;

forming bumps on the first surface of the light emitting structure, the bumps being electrically connected to the light emitting structure, surrounded by the reflective layer and protruding from the reflective layer;

bonding a support substrate to the bumps on the first surface of the light emitting structure;

removing the growth substrate;

removing a portion of the light emitting structure and dividing the light emitting structure into package units;

bonding a light transmissive substrate coated with a wavelength conversion layer to a second surface of the light emitting structure from which the growth substrate is removed; and

removing the support substrate,

wherein side surfaces of the light emitting structure are covered by the reflective layer and the wavelength conversion layer.

16. The method of claim 15, further comprising mesa-etching the light emitting structure to expose a portion of a first conductivity-type semiconductor layer of the light emitting structure prior to forming the reflective layer,

wherein the mesa-etching of the light emitting structure creates a first side surface of the light emitting structure.

17. The method of claim 16, wherein the dividing of the light emitting structure creates a second side surface of the light emitting structure, and

the first and second side surfaces have different inclinations.

18. The method of claim 17, wherein the wavelength conversion layer covers the second side surface of the light emitting structure.

19. The method of claim 16, wherein the reflective layer covers the first side surface of the light emitting structure.

20. The method of claim 15, wherein the reflective layer contacts the wavelength conversion layer on at least one of the side surfaces of the light emitting structure.