Thin film deposition

• US 9,735,392 B2
• Filed: 01/06/2016
• Issued: 08/15/2017
• Est. Priority Date: 08/20/2012
• Status: Active Grant

• Current Assignee: Universal Display Corporation
• Original Assignee: Universal Display Corporation
• Inventors: Ma, Ruiqing, Xia, Chuanjun, Mandlik, Prashant
• Primary Examiner(s): Thompson, Timothy
• Assistant Examiner(s): PIZZUTO, CHARLES M
• Application Number:
  US14/988,948
• Publication Number:
  US 20160118623A1
• Time in Patent Office: 587 Days
• Field of Search: 257787, 174506, 438127
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 31/048 Encapsulation of modules
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 59/873 Encapsulations
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/135 using ink-jet printing
• CPC Class Codes: H10K 71/861 Repairing
• CPC Class Codes: H10K 85/141 comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
• CPC Class Codes: H10K 85/40 Organosilicon compounds, e.g. TIPS pentacene
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy
• CPC Class Codes: Y02E 10/549 Organic PV cells

Abstract

A method of preparing a surface for deposition of a thin film thereon, wherein the surface including a plurality of protrusions extending therefrom and having shadowed regions, includes locally treating at least one of the protrusions.

Claims

1. A method of encapsulating a device including a plurality of protrusions extending therefrom, comprising:

locally treating at least one of the protrusions, at least one of the at least one of the having a corresponding shadow region; and

depositing a thin film to encapsulate the device after a local treatment of the at least one of the protrusions.

2. The method of claim 1 further comprising defining a threshold value for at least one measurable aspect of the protrusions to determine protrusions for which local treatment is to be effected.

3. The method of claim 1 further comprising depositing a protective, thin barrier layer on the device prior to the locally treating the at least one of the protrusions.

4. The method of claim 1 wherein the thin film comprises at least one of an inorganic material, an organic material, or a metallic material.

5. The method of claim 4 wherein the inorganic material is an oxide, a nitride, or an oxynitride.

6. The method of claim 4 wherein the organic material is an acrylate or a siloxane.

7. The method of claim 1 wherein the thin film comprises a plurality of layers.

8. The method of claim 7 wherein the thin film comprises a layer of a first material and at least a second layer of a second material different from the first material.

9. A device, comprising:

a surface comprising a plurality of protrusions extending therefrom, at least one of the plurality of protrusions having a corresponding shadow region; and

a thin film deposited to encapsulate the device, wherein at least one of the plurality of protrusions has undergone a local treatment prior to a deposition of the thin film.

10. The device of claim 9 wherein protrusions exceeding a threshold value for at least one measurable aspect of the protrusions have undergone the local treatment to reduce a thickness of the thin film required to encapsulate the device.

11. A microelectronic device, comprising:

a surface comprising a plurality of protrusions extending therefrom, at least one of the plurality of protrusions having a corresponding shadow region; and

a thin film deposited to encapsulate the microelectronic device, wherein at least one of the plurality of protrusions has undergone a local treatment prior to a deposition of the thin film.

12. The microelectronic device of claim 11 wherein protrusions exceeding a threshold value for at least one measurable aspect of the protrusions have undergone the local treatment to reduce a thickness of the thin film required to encapsulate the microelectronic device.

13. A system for preparing a surface for deposition of a thin film thereon, wherein the surface includes a plurality of protrusions extending therefrom which have shadowed regions, comprising:

at least one detecting device to locate protrusion satisfying a threshold value for at least one measurable aspect of the protrusions; and

at least one device to locally treat at least one of the protrusions for which the measurable aspect exceeds the threshold value.