Electromagnetic resonant coupler and high-frequency transmission device

• US 9,735,456 B2
• Filed: 04/14/2014
• Issued: 08/15/2017
• Est. Priority Date: 04/15/2013
• Status: Active Grant

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: Kawai, Yasufumi, Nagai, Shuichi, Ueda, Daisuke
• Primary Examiner(s): Takaoka, Dean
• Application Number:
  US14/783,617
• Publication Number:
  US 20160072167A1
• Time in Patent Office: 1,219 Days
• Field of Search: 333 24 R
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01P 1/2013 Coplanar line filters
• CPC Class Codes: H01P 1/20345 Multilayer filters
• CPC Class Codes: H01P 1/20381 Special shape resonators
• CPC Class Codes: H01P 5/187 Broadside coupled lines
• CPC Class Codes: H02J 50/12 of the resonant type
• CPC Class Codes: H02J 50/70 involving the reduction of electric, magnetic or electromagnetic leakage fields

Abstract

A high-frequency transmission device includes first and second resonators as ring-shaped wires each having an opening part at a part thereof, first and second input/output terminals each electrically connected to both resonators, a first ground shield formed on a plane different from planes on which both resonators are arranged, a second ground shield formed on a plane different from the planes on which both resonators and the first ground shield are arranged, and first and second ground wires each formed to surround peripheries of both resonators. The ground shields and the ground wires are respectively connected to each other. A dielectric wire is present between both ground wires, and the ground wires are not electrically connected to each other.

Claims

1. A high-frequency transmission device comprising a substrate, an electromagnetic resonant coupler, a transmission circuit, and a receiver circuit, wherein

the electromagnetic resonant coupler includes a first resonant wire arranged on the substrate and electrically connected to the transmission circuit, and a second resonant wire electrically connected to the receiver circuit and arranged on the substrate to oppose the first resonant wire,

the transmission circuit includes a high-frequency signal generation unit that is arranged on the substrate and that generates a high-frequency signal,

the transmission circuit is arranged on the substrate, generates a high-frequency transmission signal by modulating an input signal by the high-frequency signal generated by the high-frequency signal generating unit, and sends the generated high-frequency transmission signal to the first resonant wire,

the first resonant wire transmits the high-frequency transmission signal sent from the transmission circuit, to the second resonant wire,

the receiver circuit rectifies the high-frequency transmission signal transmitted to the second resonant wire, generates an output signal corresponding to the input signal,

the receiver circuit is arranged on a main surface of the substrate, and

the receiver circuit is arranged in a region on the main surface of the substrate immediately above a region where the electromagnetic resonant coupler is arranged.

2. The high-frequency transmission device according to claim 1, wherein the transmission circuit is arranged in a region on the main surface of the substrate at a position other than a region immediately above a region where the electromagnetic resonant coupler is arranged.

3. The high-frequency transmission device according to claim 2, wherein

the transmission circuit is arranged on the main surface of the substrate, and

a heat dissipation structure is arranged below the transmission circuit.

4. The high-frequency transmission device according to claim 2, wherein the transmission circuit and the receiver circuit are integrated in one semiconductor chip, and is arranged on the main surface of the substrate.

5. The high-frequency transmission device according to claim 1, wherein an electric field shielding unit is arranged between the electromagnetic resonant coupler and the receiver circuit.

6. The high-frequency transmission device according to claim 1, wherein a metal wall is arranged around the electromagnetic resonant coupler.