Method of manufacturing microphone, microphone, and control method therefor
First Claim
1. A method of manufacturing a microphone, the method comprising:
- forming a sound sensing module on a main substrate including a first sound aperture, such that the sound sensing module is connected to the first sound aperture;
forming a cover for receiving the sound sensing module, with a second sound aperture formed at the cover corresponding to the first sound aperture and mounted on the main substrate;
forming a sound delay filter at a receiving space of the cover to be connected to the second sound aperture; and
forming a semiconductor chip electrically connected to the sound sensing module at the receiving space and selectively operating the sound delay filter according to a signal output from the sound sensing module.
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Accused Products
Abstract
Disclosed are a method of manufacturing a microphone, a microphone, and a control method thereof. The method includes forming a sound sensing module on a main substrate including a first sound aperture such that the sound sensing module is connected to the first sound aperture. The method further include forming a cover for receiving the sound sensing module formed therein with a second sound aperture corresponding to the first sound aperture on the main substrate. The method also includes forming a sound delay filter at a receiving space of the cover to be connected to the second sound aperture. The method also includes forming a semiconductor chip electrically connected to the sound sensing module at the receiving space, to selectively operate the sound delay filter according to a signal output from the sound sensing module.
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Citations
13 Claims
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1. A method of manufacturing a microphone, the method comprising:
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forming a sound sensing module on a main substrate including a first sound aperture, such that the sound sensing module is connected to the first sound aperture; forming a cover for receiving the sound sensing module, with a second sound aperture formed at the cover corresponding to the first sound aperture and mounted on the main substrate; forming a sound delay filter at a receiving space of the cover to be connected to the second sound aperture; and forming a semiconductor chip electrically connected to the sound sensing module at the receiving space and selectively operating the sound delay filter according to a signal output from the sound sensing module. - View Dependent Claims (2, 3, 4)
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5. A microphone comprising:
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a sound sensing module mounted on a surface of a main substrate with a first sound aperture formed at the main substrate, such that the sound sensing module is connected to the first sound aperture; a cover for receiving the sound sensing module with a second sound aperture formed at the cover corresponding to the first sound aperture and mounted on the main substrate; a sound delay filter formed at a receiving space of the cover to be connected to the second sound aperture; and a semiconductor chip electrically connected to the sound sensing module at the receiving space and selectively operating the sound delay filter according to a signal output from the sound sensing module. - View Dependent Claims (6, 7, 8, 9, 10)
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11. An operating method of a microphone, comprising:
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operating a sound sensing module by operating a sound processor; transmitting a sound source voltage generated from the sound sensing module to a semiconductor chip; measuring amplitude of a noise voltage with respect to the sound source voltage input to the semiconductor chip to compare the measured noise voltage with a reference voltage preset in the semiconductor chip; applying a current to a sound delay filter when the noise voltage is less than the reference voltage, so that a drive layer makes contact with a filter substrate to close a first plurality of penetration apertures, and to implement the microphone as a non-directional microphone. - View Dependent Claims (12, 13)
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Specification