Method and device for heating electronic component and electronic apparatus using the same

• US 9,736,887 B2
• Filed: 01/14/2012
• Issued: 08/15/2017
• Est. Priority Date: 10/21/2011
• Status: Active Grant

• Current Assignee: Getac Technology Company Limited (MiTAC Holdings Corp.)
• Original Assignee: Getac Technology Company Limited (MiTAC Holdings Corp.)
• Inventors: Chiu, Chia-Chang, Wang, Chun-Chi
• Primary Examiner(s): Thanh, Quang D
• Assistant Examiner(s): SIMS III, JAMES F
• Application Number:
  US13/350,769
• Publication Number:
  US 20130098891A1
• Time in Patent Office: 2,040 Days
• Field of Search: 219209, 219210, 219486, 219488, 219492, 219494, 219497, 219507
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: H05B 1/0227 Applications

Abstract

The invention provides a method and a device for heating an electronic component and an electronic apparatus using the method/device. A heater is disposed at the electronic component. The heating method includes following steps: driving the heater according to a duty ratio by using electrical energy of a power module. If the output voltage of the power module is greater than a first threshold, set the duty ratio as a first ratio. If the output voltage of the power module is less than a second threshold, set the duty ratio as a second ratio. If the output voltage of the power module is between the first threshold and the second threshold, adjust the duty ratio so that the difference between the output voltage of the power module and the second threshold is positively proportional to the duty ratio.

Claims

1. A device for heating an electronic component in a low-temperature environment, comprising:

a first heater, disposed at a first electronic component;

a power module, configured for providing the first heater with required electrical energy; and

a controller, coupled to the first heater and the power module, wherein the controller is programmed to detect an output voltage and a temperature of the power module and, when the temperature is below a predetermined threshold, dynamically control the first heater to use the electrical energy of the power module to heat the first electronic component according to a duty ratio set according to the detected output voltage of the power module as follows;

when the output voltage of the power module is greater than a first threshold voltage, the controller is programmed to set the duty ratio as a first ratio;

when the output voltage of the power module is less than a second threshold voltage, the controller is programmed to set the duty ratio as a second ratio, wherein the second threshold voltage is less than the first threshold voltage and greater than zero, and the second ratio is less than the first ratio; and

when the output voltage of the power module is between the first threshold voltage and the second threshold voltage, the controller is programmed to adjust the duty ratio by conversion to a difference between the output voltage of the power module and the second threshold so that the difference between the output voltage of the power module and the second threshold voltage is positively proportional to the duty ratio.

2. The device for heating the electronic component in the low-temperature environment as claimed in claim 1, wherein the controller is programmed to adjust the duty ratio to be between the first ratio and the second ratio when the output voltage of the power module is between the first threshold voltage and the second threshold voltage.

3. The device for heating the electronic component in the low-temperature environment as claimed in claim 1, wherein, when the output voltage of the power module is between the first threshold voltage and the second threshold voltage, the controller is programmed to set the duty ratio as (DH−

DL)×

[(V−

VL)/(VH−

VL)], wherein DH is a positive number less than or equal to 1, DL is a positive number less than DH, V is the output voltage of the power module, VH is the first threshold voltage and VL is the second threshold voltage.

4. The device for heating the electronic component in the low-temperature environment as claimed in claim 1, further comprising:

a temperature sensor, disposed at the first electronic component to detect a temperature of the first electronic component, wherein the temperature sensor is coupled to the controller;

wherein the controller is programmed to control the first heater to stop heating when the temperature of the first electronic component reaches a normal operation temperature.

5. The device for heating an electronic component in a low-temperature environment as claimed in claim 1, wherein the controller is an embedded controller.

6. A method for heating an electronic component in a low-temperature environment using the device of claim 1, the method comprising:

detecting an output voltage and a temperature of the power module and, when the temperature is below the predetermined threshold, driving the first heater according to the duty ratio to use electrical energy of the power module, wherein the duty ratio is dynamically set by the controller according to the detected output voltage of the power module as follows;

when the output voltage of the power module is greater than the first threshold voltage, the controller setting the duty ratio as the first ratio;

when the output voltage of the power module is less than the second threshold voltage, the controller setting the duty ratio as the second ratio, wherein the second threshold voltage is less than the first threshold voltage and greater than zero, and the second ratio is less than the first ratio; and

when the output voltage of the power module is between the first threshold voltage and the second threshold voltage, the controller adjusting the duty ratio by conversion to a difference between the output voltage of the power module and the second threshold so that the difference between the output voltage of the power module and the second threshold voltage is positively proportional to the duty ratio.

7. The method for heating an electronic component in a low-temperature environment as claimed in claim 6, wherein the first ratio is 100% and the second ratio is 0%.

8. The method for heating the electronic component in the low-temperature environment as claimed in claim 6, wherein in the step of adjusting the duty ratio, the duty ratio is between the first ratio and the second ratio.

9. The method for heating the electronic component in the low-temperature environment as claimed in claim 6, wherein the step of adjusting the duty ratio comprises:

setting the duty ratio as (DH−

DL)×

[(V−

VL)/(VH−

VL)], wherein DH is a positive number less than or equal to 1, DL is a positive number less than DH, V is the output voltage of the power module, VH is the first threshold voltage and VL is the second threshold voltage.

10. The method for heating the electronic component in the low-temperature environment as claimed in claim 9, wherein the first ratio and DH are 75%, the second ratio is 0%, DL is 10%, the first threshold voltage VH is 8.1 and the second threshold voltage VL is 7.1.

11. The method for heating the electronic component in the low-temperature environment as claimed in claim 6, further comprising:

disposing a second heater at a second electronic component; and

driving the second heater according to the duty ratio to use electrical energy of the power module;

wherein an enabling duration of the first heater does not overlap with an enabling duration of the second heater.

12. The method for heating the electronic component in the low-temperature environment as claimed in claim 11, wherein a duty cycle of the duty ratio is evenly distributed to the first heater and the second heater.

13. The method for heating the electronic component in the low-temperature environment as claimed in claim 11, wherein the duty cycle of the duty ratio is entirely distributed to the second heater when a temperature of the first electronic component reaches a normal operation temperature.

14. The method for heating the electronic component in the low-temperature environment as claimed in claim 6, further comprising:

disposing a second heater at a second electronic component; and

enabling the second heater by using electrical energy of the power module according to the duty ratio;

wherein the enabling duration of the first heater overlaps with the enabling duration of the second heater, and the total time of the enabling duration of the first heater and the enabling duration of the second heater is not greater than the duty cycle of the duty ratio.

15. The method for heating the electronic component in the low-temperature environment as claimed in claim 6, further comprising:

detecting the temperature of the first electronic component;

when the temperature of the first electronic component reaches a normal operation temperature, stop driving the first heater; and

when the temperature of the first electronic component reaches the normal operation temperature, activating the first electronic component.

16. The method for heating the electronic component in the low-temperature environment as claimed in claim 6, wherein the first electronic component is a hard disk drive.

17. The method for heating the electronic component in the low-temperature environment as claimed in claim 6, wherein the power module is a battery module or an AC adapter.

18. An electronic apparatus, comprising:

a first electronic component;

a first heater, disposed at the first electronic component;

a power module, configured for providing the electrical energy the first electronic component and the first heater require; and

a controller, coupled to the first heater and the power module, wherein the controller is programmed to detect an output voltage and a temperature of the power module and, when the temperature is below a predetermined threshold dynamically control the first heater to use the electrical energy of the power module for heating the first electronic component according to a duty ratio set according to the detected output voltage of the power module as follows;

when the output voltage of the power module is greater than a first threshold voltage, the controller is programmed to set the duty ratio as a first ratio;

when the output voltage of the power module is less than a second threshold voltage, the controller is programmed to set the duty ratio as a second ratio, wherein the second threshold voltage is less than the first threshold voltage and greater than zero, and the second ratio is less than the first ratio; and

when the output voltage of the power module is between the first threshold voltage and the second threshold voltage, the controller is programmed to adjust the duty ratio by conversion to a difference between the output voltage of the power module and the second threshold so that the difference between the output voltage of the power module and the second threshold voltage is positively proportional to the duty ratio.

19. The electronic apparatus as claimed in claim 18, wherein the controller is programmed to adjust the duty ratio to be between the first ratio and the second ratio when the output voltage currently amended the power module is between the first threshold voltage and the second threshold voltage.

20. The electronic apparatus as claimed in claim 18, wherein, when the output voltage of the power module is between the first threshold voltage and the second threshold voltage, the controller is programmed to set the duty ratio as (DH−

DL)×

[(V−

VL)/(VH−

VL)], wherein DH is a positive number less than or equal to 1, DL is a positive number less than DH, V is the output voltage of the power module, VH is the first threshold voltage and VL is the second threshold voltage.

21. The electronic apparatus as claimed in claim 18, further comprising:

a temperature sensor, disposed at the first electronic component to detect a temperature of the first electronic component, wherein the temperature sensor is coupled to the controller;

wherein the controller is programmed to control the first heater to stop heating when the temperature of the first electronic component reaches a normal operation temperature.

22. The electronic apparatus as claimed in claim 18, wherein the controller is an embedded controller.