Flexible circuit board interconnection and methods

• US 9,736,946 B2
• Filed: 10/03/2014
• Issued: 08/15/2017
• Est. Priority Date: 02/14/2008
• Status: Active Grant

• Current Assignee: MetroSpec Technology LLC
• Original Assignee: MetroSpec Technology LLC
• Inventors: Holec, Henry V., Crandell, Wm. Todd, Holec, Eric Henry
• Primary Examiner(s): STONER, KILEY SHAWN
• Application Number:
  US14/506,251
• Publication Number:
  US 20150189765A1
• Time in Patent Office: 1,047 Days
• Field of Search: None
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 37/04 for holding or positioning work
• CPC Class Codes: B23K 37/0435 Clamps
• CPC Class Codes: F21Y 2107/30 on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01R 12/61 connecting to flexible printed circuits, flat or ribbon cables or like structures
• CPC Class Codes: H01R 4/02 Soldered or welded connections H01R4/625, H01R4/723, H01R12/59 take precedence
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0108 Transparent
• CPC Class Codes: H05K 2201/0311 Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
• CPC Class Codes: H05K 2201/058 Direct connection between two or more FPCs or between flexible parts of rigid PCBs
• CPC Class Codes: H05K 2201/09481 Via in pad; Pad over filled via
• CPC Class Codes: H05K 2201/09918 Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 2203/043 : Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
• CPC Class Codes: H05K 2203/16 : Inspection; Monitoring; Aligning
• CPC Class Codes: H05K 3/363 : by soldering

Abstract

Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

Claims

1. A method of connecting a plurality of flexible circuit boards together comprising:

applying a solder composition between first electrical contacts of an upper surface of a first flexible circuit board and second electrical contacts of a lower surface of a second flexible circuit board;

positioning a clamp to hold the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together such that the clamp does not contact the second electrical contacts which are exposed on an upper surface of the second flexible circuit board; and

reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.

2. The method of claim 1, further comprising applying a solder composition between an upper surface of the second flexible circuit board and a lower surface of a third flexible circuit board;

and positioning a clamp to hold the upper surface of the second flexible circuit board and the lower surface of the third flexible circuit board together.

3. The method of claim 1, further comprising applying a solder composition between an upper surface of the third flexible circuit board and a lower surface of a fourth flexible circuit board;

and holding the upper surface of the third flexible circuit board and the lower surface of the fourth flexible circuit board together.

4. The method of claim 1, further comprising positioning a plurality of components on at least one of the first and second flexible circuit boards.

5. The method of claim 4, the components comprising light emitting diodes.

6. The method of claim 4, wherein positioning the plurality of components on the first and second flexible circuit boards takes place before the step of reflowing the solder composition with a heat source and the plurality of components are bonded to at least one of the first and second flexible circuit boards during the step of reflowing the solder composition with a heat source.

7. The method of claim 1, the clamp comprising a u-shaped fastener, a spring tension arm connected to the u-shaped fastener, and an attachment hook attached to the spring tension arm.

8. The method of claim 1, wherein the heat source delivers heat from the bottom of the first and second flexible circuit boards.

9. The method of claim 1, wherein the heat source delivers heat from the top of the first and second flexible circuit boards.

10. The method of claim 1, wherein the heat source delivers heat from the bottom and top of the first and second flexible circuit boards.

11. The method of claim 1, wherein the solder composition is selected from the group consisting of solder, solder paste, and solder with flux.

12. The method of claim 1, further comprising the step of confirming bonding of the first flexible circuit board and the second flexible circuit board together by inspection of the solder having flowed through a hole in the first flexible circuit board.

13. The method of claim 12, wherein the formation of a dome shaped solder bead atop the hole confirms proper bonding of the first flexible circuit board and the second flexible circuit board together.

14. The method of claim 1, wherein the first and second flexible circuit boards are each part of arrays of circuit boards arranged parallel to one another.