Method and structure of MEMS PLCSP fabrication
First Claim
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1. A package-level chip scale MEMS packaged device comprising:
- a MEMS chip comprising a CMOS substrate having a top surface having a first portion and a second portion and comprising a cap disposed upon the first portion of the CMOS substrate, wherein the CMOS substrate is associated with a first thickness, wherein the cap is associated with a second thickness, wherein the cap and the first portion of the top surface form an enclosed cavity, wherein at least a MEMS device is formed on the first portion of the top surface and disposed within the enclosed cavity, wherein the second portion of the top surface of the CMOS substrate is substantially free of the cap and includes at least a first bonding region;
a packaging substrate having a top surface, the top surface having a first portion and a second portion, wherein the first portion is characterized by a third thickness, wherein the second portion is characterized by a fourth thickness, wherein the third thickness exceeds the fourth thickness by at least the second thickness associated with the cap, wherein the first portion of the top surface of the packaging substrate includes at least a second bonding region;
wherein the MEMS chip is oriented relative to the packaging substrate such that the second portion of the top surface of the CMOS substrate is opposed to the first portion of the top surface of the packaging substrate, and such that the cap is disposed above the second portion of the top surface of the packaging substrate; and
wherein the first bonding region is bonded to the second bonding region.
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Abstract
A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.
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20 Claims
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1. A package-level chip scale MEMS packaged device comprising:
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a MEMS chip comprising a CMOS substrate having a top surface having a first portion and a second portion and comprising a cap disposed upon the first portion of the CMOS substrate, wherein the CMOS substrate is associated with a first thickness, wherein the cap is associated with a second thickness, wherein the cap and the first portion of the top surface form an enclosed cavity, wherein at least a MEMS device is formed on the first portion of the top surface and disposed within the enclosed cavity, wherein the second portion of the top surface of the CMOS substrate is substantially free of the cap and includes at least a first bonding region; a packaging substrate having a top surface, the top surface having a first portion and a second portion, wherein the first portion is characterized by a third thickness, wherein the second portion is characterized by a fourth thickness, wherein the third thickness exceeds the fourth thickness by at least the second thickness associated with the cap, wherein the first portion of the top surface of the packaging substrate includes at least a second bonding region; wherein the MEMS chip is oriented relative to the packaging substrate such that the second portion of the top surface of the CMOS substrate is opposed to the first portion of the top surface of the packaging substrate, and such that the cap is disposed above the second portion of the top surface of the packaging substrate; and wherein the first bonding region is bonded to the second bonding region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification