Sensor including moving masses and means for detecting relative movements of the masses

• US 9,739,612 B2
• Filed: 11/20/2014
• Issued: 08/22/2017
• Est. Priority Date: 11/20/2013
• Status: Active Grant

• Current Assignee: Safran Electronics & Defense
• Original Assignee: Safran Electronics & Defense
• Inventors: Jeanroy, Alain, Onfroy, Philippe
• Primary Examiner(s): Caputo, Lisa
• Assistant Examiner(s): Hernandez-Prewitt, Roger
• Application Number:
  US15/037,832
• Publication Number:
  US 20160290803A1
• Time in Patent Office: 1,006 Days
• Field of Search: 7350412
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/0271 Resonators; ultrasonic resonators
• CPC Class Codes: B81B 2203/0109 Bridges
• CPC Class Codes: B81B 2203/04 Electrodes
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81B 3/007 For controlling stiffness, e.g. ribs
• CPC Class Codes: B81C 1/00658 Treatments for improving the stiffness of a vibrating element
• CPC Class Codes: G01C 19/574 the devices having two sensing masses in anti-phase motion
• CPC Class Codes: G01P 15/097 by vibratory elements
• CPC Class Codes: G01P 2015/084 the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass

Abstract

A MEMS type inertial sensor comprising a support structure having at least a first seismic body and a second seismic body connected thereto by resilient means in order to be movable in a suspension plane, transducers for maintaining the seismic bodies in vibration and for determining movements of the seismic bodies in the suspension plane, and a control unit connected to the transducers by electrical conductor means. The transducers comprise at least one electrode secured to the first seismic body and at least one electrode secured to the second seismic body, the two electrodes being arranged to enable relative movements of the seismic bodies relative to each other in the suspension plane to be measured directly.

Claims

1. A MEMS type inertial sensor comprising:

a support structure having at least a first seismic body and a second seismic body connected thereto by resilient means in order to be movable in a suspension plane;

transducers for maintaining the seismic bodies in vibration and for determining movements of the seismic bodies in the suspension plane; and

a control unit connected to the transducers by electrical conductor means,

wherein the transducers have electrodes secured respectively to the first seismic body and to the second seismic body, said electrodes secured respectively to the first seismic body and to the second seismic body cooperating together to make it possible to measure directly movements of the seismic bodies relative to each other in the suspension plane, in at least two directions parallel to the suspension plane.

2. A sensor according to claim 1, further comprising:

at least a first semiconductor layer in which there are formed at least a portion of the seismic bodies, the resilient means, and the electrodes;

a first electrically insulating layer; and

a second semiconductor layer forming a support,

wherein the first semiconductor layer is provided with slots through its full height in order to define electrical conduction paths extending from the electrodes to the periphery of the support structure via the resilient means so as to form at least some of the conduction means.

3. A sensor according to claim 2, further comprising a second insulating layer and a third semiconductor layer, the second semiconductor layer extending between the insulating layers and an intermediate support frame being formed in the second semiconductor layer, the third semiconductor layer forming a support structure.

4. A sensor according to claim 3, wherein the seismic bodies are concentric, the first seismic body being mounted in the second seismic body and including a central cavity in which there extends a stud secured to the third semiconductor layer, and the first seismic body is connected to the stud by resilient means.

5. A sensor according to claim 1, wherein the seismic bodies are of the same shape and have the same mass, and in that the seismic bodies include mutual engagement portions in such a manner that the seismic bodies are nested in one another while being movable in the suspension plane relative to one another, the seismic bodies having centers of gravity that coincide.

6. A sensor according to claim 5, wherein each seismic body has two wings in the form of rectangular parallelepipeds that extend parallel to each other and that are connected together by a central core in the form of a rectangular parallelepiped that is set back from the wings, the seismic bodies being oriented at 90°

relative to each other about an axis normal to the suspension plane and at 180°

about an axis in the suspension plane in such a manner that the core of each seismic body extends facing the core and between the wings of the other seismic body, and the wings of each seismic body have end portions extending in the same plane as the core and facing end portions of the wings of the other seismic body.

7. A sensor according to claim 6, wherein each wing is of mass that is less than half the mass of the core.