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Capacitive sensing array modulation

  • US 9,740,343 B2
  • Filed: 03/15/2013
  • Issued: 08/22/2017
  • Est. Priority Date: 04/13/2012
  • Status: Active Grant
First Claim
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1. An electronic device, comprising:

  • a capacitive sensor comprising;

    a sensor pad comprising an array of individual capacitive sensing elements, the sensor pad configured to receive;

    a sensor pad ground reference voltage greater than earth ground; and

    a sensor pad supply voltage;

    a ring surrounding the sensor pad and maintained at a system ground reference voltage, the ring elevated with respect to the sensor pad and configured for direct contact by user'"'"'s fingertip; and

    a dielectric entirely covering the sensor pad and positioned within the ring;

    a modulating circuit operably connected to the sensor pad and adapted to modulate the sensor pad supply voltage relative to the sensor pad ground reference voltage;

    a inductive boost circuit configured to provide the sensor pad ground reference voltage to the sensor pad; and

    a housing surrounding the modulating circuit and the inductive boost circuit;

    wherein;

    the sensor pad ground reference voltage is greater than the system ground.

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