Wafer level packaging of microbolometer vacuum package assemblies

• US 9,741,591 B2
• Filed: 12/26/2013
• Issued: 08/22/2017
• Est. Priority Date: 12/31/2012
• Status: Active Grant

• Current Assignee: Teledyne FLIR LLC (Teledyne Technologies Incorporated)
• Original Assignee: FLIR Systems, Inc. (Teledyne Technologies Incorporated)
• Inventors: Schweikert, Paul, Sharpe, Andrew, Carlson, Gregory A., Matson, Alex, Vilander, Scott, Zahuta, Bob, Goeden, Richard M.
• Primary Examiner(s): WILCZEWSKI, MARY A
• Application Number:
  US14/141,300
• Publication Number:
  US 20140186999A1
• Time in Patent Office: 1,335 Days
• Field of Search: 438907, 438908
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/6719 characterized by the construction of the processing chambers, e.g. modular processing chambers
• CPC Class Codes: H01L 21/67207 comprising a chamber adapted to a particular process
• CPC Class Codes: H01L 21/67745 characterized by movements or sequence of movements of transfer devices
• CPC Class Codes: H01L 21/67748 horizontal transfer of a single workpiece
• CPC Class Codes: H01L 21/67757 vertical transfer of a batch of workpieces
• CPC Class Codes: H01L 21/681 using optical controlling means
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 24/94 at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/09 Devices sensitive to infrared, visible or ultraviolet radiation H01L31/101 takes precedence

Abstract

An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.

Claims

1. A method comprising:

providing a bolometer wafer;

providing a lid wafer;

pre-baking the bolometer wafer in at least a first ultra-high vacuum (UHV) environment in a first pre-baking module;

pre-baking the lid wafer in at least a second UHV environment in a second pre-baking module different from the first pre-baking module, wherein the pre-baking the lid wafer in the second UHV environment comprises pre-baking at a different time, temperature, and/or vacuum profile than pre-baking the bolometer wafer in the first UHV environment;

moving the bolometer wafer and lid wafer after the pre-baking to a UHV environment in a wafer alignment and bonding module;

mounting the bolometer wafer on a bolometer wafer chuck;

mounting the lid wafer on a lid wafer chuck and in facing opposition to the bolometer wafer;

baking the bolometer wafer at a first temperature using the bolometer chuck;

baking the lid wafer at a second temperature using the lid wafer chuck;

raising the respective temperatures of the bolometer wafer and the lid wafer to a common bonding temperature using the bolometer and lid wafer chucks;

clamping the bolometer wafer and the lid wafer together with a selected force, such that the wafers are bonded together in a bonded wafer pair; and

lowering the temperature of the bonded wafer pair below the common bonding temperature,

wherein a vacuum environment is maintained from the pre-baking of the bolometer and lid wafers through the lowering the temperature of the bonded wafer pair.

2. The method of claim 1, wherein the bolometer wafer is mounted on the bolometer wafer chuck via a first electrostatic clamp (ESC), the lid wafer is mounted on the lid wafer chuck via a second ESC, and the method provides for high volume manufacturing of microbolometer vacuum package assemblies.

3. The method of claim 1, further comprising aligning a fiducial on the bolometer wafer with a fiducial on the lid wafer, wherein the aligning the fiducial comprises operating a pair of dual head cameras to move between a position between the bolometer wafer chuck and the lid wafer chuck, and a position retracted from between the bolometer wafer chuck and the lid wafer chuck.

4. The method of claim 3, further comprising pre-aligning the bolometer wafer with the lid wafer before aligning the fiducial on the bolometer wafer with the fiducial on the lid wafer.

5. The method of claim 1, further comprising inspecting the alignment of the bolometer wafer with the lid wafer after the bonding.

6. The method of claim 1, wherein the baking comprises:

disposing a radiation shield between the bolometer wafer and the lid wafer;

baking the bolometer wafer at the first temperature for a first period of time; and

baking the lid wafer at the second temperature for a second period of time,

wherein the second temperature is less than the first temperature.

7. The method of claim 1, further comprising:

receiving at least one of the bolometer wafer or the lid wafer with an Equipment Front End Module (EFEM) at atmospheric pressure, wherein the providing of the bolometer and lid wafers comprises moving the bolometer and lid wafers from the EFEM to the vacuum environment; and

determining a position of the bolometer wafer and the lid wafer prior to the mounting of the bolometer wafer and the lid wafer.

8. The method of claim 1, wherein the pre-baking comprises:

baking the bolometer wafer at a first temperature for a first period of time in the first UHV environment; and

baking the lid wafer at a second temperature different than the first temperature for a second period of time in the second UHV environment.

9. The method of claim 1, further comprising storing at least one of the pre-baked bolometer and lid wafers in a UHV environment in a chamber separate from a chamber in which at least one of the pre-baked bolometer and/or lid wafers was pre-baked, wherein the vacuum environment is maintained during the pre-baking, the moving, and the storing.

10. The method of claim 1, wherein the UHV environments are environments with a pressure lower than approximately 100 nanopascals maintained by one or more cryogenic pumps, and wherein the providing the bolometer wafer to the mounting the bolometer wafer is via a first path and the providing the lid wafer to the mounting the lid wafer is via a second path.