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Thermal management systems and methods for wafer processing systems

  • US 9,741,593 B2
  • Filed: 08/06/2015
  • Issued: 08/22/2017
  • Est. Priority Date: 08/06/2015
  • Status: Active Grant
First Claim
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1. A workpiece holder that positions a workpiece for processing, the workpiece holder comprising:

  • a substantially cylindrical puck that is characterized by a cylindrical axis, a puck radius about the cylindrical axis, and a puck thickness,wherein the puck radius is at least four times the puck thickness,wherein at least a top surface of the cylindrical puck is substantially planar, andwherein the cylindrical puck defines one or more radial thermal breaks,each thermal break being characterized as a radial recess that intersects at least one of the top surface and a bottom surface of the cylindrical puck, wherein the radial recess is characterized by;

    a thermal break depth that extends from the top surface or the bottom surface of the puck through at least half of the puck thickness,and a thermal break radius that is disposed symmetrically about the cylindrical axis, and is at least one-half of the puck radius;

    and wherein the radial recess intersects the top surface, the workpiece holder further comprising at least three lifting elements that extend above the top surface in an extended state, to lift the workpiece from the top surface, and that retract into the radial recess in a retracted state, to lower the workpiece onto the top surface.

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