Integrated interposer solutions for 2D and 3D IC packaging
First Claim
1. An integrated circuit (IC) package, comprising:
- a first substrate having a backside surface and a top surface with a cavity disposed therein, the cavity having a floor defining a front side surface;
a plurality of first electroconductive contacts disposed on the front side surface;
a plurality of second electroconductive contacts disposed on the back side surface;
a plurality of first electroconductive elements penetrating through the first substrate and coupling selected ones of the first and second electroconductive contacts to each other;
one or more first dies each of which contains an IC electroconductively coupled to corresponding ones of the first electroconductive contacts, an entire top surface of each first die being coplanar with all of the top surface of the first substrate outside the cavity;
a second substrate having a bottom surface permanently sealingly attached to the top surface of the first substrate outside the cavity, for reducing warpage of the first substrate; and
a dielectric material disposed in the cavity and encapsulating each first die.
4 Assignments
0 Petitions
Accused Products
Abstract
An integrated circuit (IC) package includes a first substrate having a backside surface and a top surface with a cavity disposed therein. The cavity has a floor defining a front side surface. A plurality of first electroconductive contacts are disposed on the front side surface, and a plurality of second electroconductive contacts are disposed on the back side surface. A plurality of first electroconductive elements penetrate through the first substrate and couple selected ones of the first and second electroconductive contacts to each other. A first die containing an IC is electroconductively coupled to corresponding ones of the first electroconductive contacts. A second substrate has a bottom surface that is sealingly attached to the top surface of the first substrate, and a dielectric material is disposed in the cavity so as to encapsulate the first die.
152 Citations
27 Claims
-
1. An integrated circuit (IC) package, comprising:
-
a first substrate having a backside surface and a top surface with a cavity disposed therein, the cavity having a floor defining a front side surface; a plurality of first electroconductive contacts disposed on the front side surface; a plurality of second electroconductive contacts disposed on the back side surface; a plurality of first electroconductive elements penetrating through the first substrate and coupling selected ones of the first and second electroconductive contacts to each other; one or more first dies each of which contains an IC electroconductively coupled to corresponding ones of the first electroconductive contacts, an entire top surface of each first die being coplanar with all of the top surface of the first substrate outside the cavity; a second substrate having a bottom surface permanently sealingly attached to the top surface of the first substrate outside the cavity, for reducing warpage of the first substrate; and a dielectric material disposed in the cavity and encapsulating each first die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 17, 18, 19, 20, 21, 22, 23, 24, 25)
-
-
11. An integrated circuit (IC) package, comprising:
-
a first substrate having a backside surface and a front side surface; a plurality of electroconductive elements penetrating through the first substrate and coupling selected ones of electroconductive contacts respectively disposed on the front side surface and the back side surface to each other; at least one first die containing an IC electroconductively coupled to corresponding ones of the electroconductive elements disposed on the front side surface; a second substrate having a bottom surface permanently sealingly attached to the front side surface of the first substrate and a through-opening surrounding the first die, an entire top surface of each first die being coplanar with all of the top surface of the second substrate; a third substrate having a bottom surface permanently sealingly attached to a top surface of the second substrate, the bottom surface and the through-opening defining a first cavity enclosing the first die, and a dielectric material disposed within the first cavity and encapsulating the at least one first die. - View Dependent Claims (12, 13, 14, 15, 16)
-
-
26. An integrated circuit (IC) package, comprising:
-
a first substrate having a backside surface and a top surface with a cavity disposed therein, the cavity having a floor defining a front side surface; a plurality of first electroconductive contacts disposed on the front side surface; a plurality of second electroconductive contacts disposed on the back side surface; a plurality of first electroconductive elements penetrating through the first substrate and coupling selected ones of the first and second electroconductive contacts to each other; one or more first dies each of which contains an IC electroconductively coupled to corresponding ones of the first electroconductive contacts, an entire top surface of each first die being coplanar with all of the top surface of the first substrate outside the cavity; a second substrate having a bottom surface permanently attached to the top surface of the first substrate outside the cavity, the first and second substrates fully enclosing each first die; and a dielectric material disposed in the cavity and encapsulating each first die. - View Dependent Claims (27)
-
Specification