Light emitting device

• US 9,741,699 B2
• Filed: 10/19/2015
• Issued: 08/22/2017
• Est. Priority Date: 05/29/2012
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Epistar Corporation
• Inventors: Pu, Chi-Chih, Lee, Chen-Hong, Yeh, Shih-Yu, Cheng, Wei-Kang, Pan, Shyi-Ming, Hong, Siang-Fu, Huang, Chih-Shu, Wang, Tzu-Hsiang, Tang, Shih-Chieh, Yang, Cheng-Kuang
• Primary Examiner(s): Patel, Ashok
• Application Number:
  US14/886,787
• Publication Number:
  US 20160043063A1
• Time in Patent Office: 673 Days
• Field of Search: None
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 17/10 characterised by specific fastening means or way of fastening F21V17/02 - F21V17/08 take precedence
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21V 21/14 Adjustable mountings
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/85 characterised by the material liquid coolants F21V29/56
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/1403 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/14051 Bump connectors having different shapes
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 : the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49107 : on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/83385 : Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/8592 : Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 33/007 : comprising nitride compounds
• CPC Class Codes: H01L 33/44 : characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/50 : Wavelength conversion elements
• CPC Class Codes: H01L 33/507 : the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/508 : having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.

Claims

1. A light-emitting apparatus comprising:

a light-emitting device comprising;

a substrate having a support surface with an end, and a plurality of side surfaces;

a first light-emitting diode chip disposed on the support surface;

a second light-emitting diode chip disposed on the support surface; and

a wavelength conversion layer continuously covering the end, the first light-emitting diode chip, and the second light-emitting diode chip without covering the plurality of side surfaces; and

a support base coupled to the light-emitting device and forming a first angle with the substrate.

2. The light-emitting apparatus of claim 1, wherein the substrate has a main surface opposite to the support surface, the first light-emitting diode chip is capable of emitting light capable of penetrating into the substrate from the support surface and emerging from the main surface.

3. The light-emitting apparatus of claim 2, wherein the wavelength conversion layer is arranged to cover the main surface.

4. The light-emitting apparatus of claim 1, wherein the substrate comprises aluminum oxide, sapphire containing aluminum oxide, glass, plastics, or rubber.

5. The light-emitting apparatus of claim 1, wherein the wavelength conversion layer directly contacts the first light-emitting diode chip and the second light-emitting diode chip.

6. The light-emitting apparatus of claim 1, wherein the substrate comprises a first end portion and a second end portion not covered by the wavelength conversion layer.

7. The light-emitting apparatus of claim 1, further comprising a lamp housing coupled to the support base.

8. The light-emitting apparatus of claim 7, wherein the lamp housing is transparent.

9. The light-emitting apparatus of claim 7, wherein the lamp housing is arranged to partially seal the light-emitting device.

10. The light-emitting apparatus of claim 7, wherein the lamp housing is arranged to directly contact the light-emitting device.

11. The light-emitting apparatus of claim 7, further comprising a lamp base connected to the lamp housing.