Semiconductor power modules and devices
First Claim
1. A method of forming an electronic component, comprising:
- providing a first transistor encased in a first package, the first package comprising a first conductive portion having a first area, the first transistor being mounted over the first conductive portion;
providing a second transistor encased in a second package, the second package comprising a second conductive portion having a second area, the second transistor being mounted over the second conductive portion;
providing a substrate comprising an insulating layer between a first metal layer and a second metal layer, the first metal layer being on a first side of the substrate and the second metal layer being on a second side of the substrate;
mounting the first package on a first side of the substrate with the first conductive portion being electrically connected to the first metal layer; and
mounting the second package on a second side of the substrate with the second conductive portion being electrically connected to the second metal layer;
whereinthe first package is opposite the second package, with at least 50% of the first area of the first conductive portion being opposite the second area of the second conductive portion.
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Accused Products
Abstract
An electronic component is described which includes a first transistor encased in a first package, the first transistor being mounted over a first conductive portion of the first package, and a second transistor encased in a second package, the second transistor being mounted over a second conductive portion of the second package. The component further includes a substrate comprising an insulating layer between a first metal layer and a second metal layer. The first package is on one side of the substrate with the first conductive portion being electrically connected to the first metal layer, and the second package is on another side of the substrate with the second conductive portion being electrically connected to the second metal layer. The first package is opposite the second package, with at least 50% of a first area of the first conductive portion being opposite a second area of the second conductive portion.
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Citations
26 Claims
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1. A method of forming an electronic component, comprising:
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providing a first transistor encased in a first package, the first package comprising a first conductive portion having a first area, the first transistor being mounted over the first conductive portion; providing a second transistor encased in a second package, the second package comprising a second conductive portion having a second area, the second transistor being mounted over the second conductive portion; providing a substrate comprising an insulating layer between a first metal layer and a second metal layer, the first metal layer being on a first side of the substrate and the second metal layer being on a second side of the substrate; mounting the first package on a first side of the substrate with the first conductive portion being electrically connected to the first metal layer; and mounting the second package on a second side of the substrate with the second conductive portion being electrically connected to the second metal layer;
whereinthe first package is opposite the second package, with at least 50% of the first area of the first conductive portion being opposite the second area of the second conductive portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of forming an electronic component, comprising:
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providing a first transistor encased in a first package, the first package having a source lead and a first conductive portion, the first transistor being mounted over the first conductive portion; providing a second transistor encased in a second package, the second package having a drain lead and a second conductive portion, the second transistor being mounted over the second conductive portion; providing a substrate comprising an insulating layer between a first metal layer and a second metal layer, the first metal layer being on a first side of the substrate and the second metal layer being on a second side of the substrate; mounting the first package on a first side of the substrate with the first conductive portion being electrically connected to the first metal layer; and mounting the second package on a second side of the substrate with the second conductive portion being electrically connected to the second metal layer;
whereinthe first package is at least partially opposite the second package, with the source lead of the first package being substantially aligned with the drain lead of the second package. - View Dependent Claims (17, 18, 19, 20)
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21. A method of forming an electronic component, comprising:
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providing a capacitor comprising an insulating layer between a first electrically conductive layer and a second electrically conductive layer; providing a first transistor encased in a first package, the first package having a first conductive portion; and providing a second transistor encased in a second package, the second package having a second conductive portion;
whereinthe first conductive portion is mounted directly over the first electrically conductive layer, and the second conductive portion is mounted directly over the second electrically conductive layer. - View Dependent Claims (22, 23, 24, 25, 26)
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Specification