Display tile structure and tiled display

• US 9,741,785 B2
• Filed: 08/10/2015
• Issued: 08/22/2017
• Est. Priority Date: 09/25/2014
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Bower, Christopher, Meitl, Matthew, Cok, Ronald S.
• Primary Examiner(s): King, Joshua
• Assistant Examiner(s): Alam, Mohammed R
• Application Number:
  US14/822,866
• Publication Number:
  US 20170047393A1
• Time in Patent Office: 743 Days
• CPC Class Codes: G06F 2203/04104 Multi-touch detection in digitiser, i.e. details about the simultaneous detection of a plurality of touching locations, e.g. multiple fingers or pen and finger
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: G06F 3/04166 Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving Synchronisation with the driving of the display or the backlighting unit to avoid interferences generated internally G06F3/04184
• CPC Class Codes: G06F 3/042 by opto-electronic means
• CPC Class Codes: G06F 3/044 by capacitive means
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0075 relating to heat extraction or cooling elements
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H10K 50/87 Arrangements for heating or cooling
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/179 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/18 Tiled displays
• CPC Class Codes: H10K 59/90 Assemblies of multiple devices comprising at least one organic light-emitting element
• CPC Class Codes: H10K 71/00 : Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/80 : using temporary substrates

Abstract

A display tile structure includes a tile layer with opposing emitter and backplane sides. A light emitter having first and second electrodes for conducting electrical current to cause the light emitter to emit light is disposed in the tile layer. First and second electrically conductive tile micro-wires and first and second conductive tile contact pads are electrically connected to the first and second tile micro-wires, respectively. The light emitter includes a plurality of semiconductor layers and the first and second electrodes are disposed on a common side of the semiconductor layers opposite the emitter side of the tile layer. The first and second tile micro-wires and first and second tile contact pads are disposed on the backplane side of the tile layer.

Claims

1. A display tile structure, comprising:

a tile substrate;

a tile layer disposed on the tile substrate, the tile layer having a backplane side and an emitter side opposite the backplane side, wherein the emitter side is adjacent to and in direct contact with the tile substrate;

a light-emitting diode (LED) disposed in the tile layer in direct contact with the tile substrate and arranged to emit light from the emitter side, the LED having first and second electrodes for conducting electrical current to cause the LED to emit light, wherein the tile substrate is transparent to the light emitted by the LED;

a layer of light-absorbing material disposed in the tile layer on and in direct contact with the tile substrate and only partially encapsulating the LED;

an a electrically conductive first tile micro-wire electrically connected to the first electrode and an electrically conductive second tile micro-wire electrically connected to the second electrode, the first and second tile micro-wires disposed only on a side of the light-absorbing material layer opposite the tile substrate and the first and second tile micro-wires not extending to the edges of the tile substrate; and

an exposed conductive first tile contact pad electrically connected to the first tile micro-wire and an exposed conductive second tile contact pad electrically connected to the second tile micro-wire, wherein the LED comprises a plurality of semiconductor layers and the first and second electrodes are disposed on a common side of the semiconductor layers opposite the emitter side of the tile layer and wherein the first and second tile micro-wires and first and second tile contact pads are disposed only on a side of the light-absorbing material layer opposite the tile substrate on the backplane side of the tile layer, and the first and second tile contact pads disposed on a portion of the first and second tile micro-wires that are in contact with the light-absorbing layer.

2. A tiled display comprising a plurality of display tile structures according to claim 1, the tiled display comprising:

a backplane having first and second backplane contact pads on a surface of the backplane, wherein the backplane side of the tile layer is adjacent to and in contact with the backplane surface having the first and second backplane contact pads; and

a first electrical connector electrically connecting the first tile contact pad to the first backplane contact pad and a second electrical connector electrically connecting the second tile contact pad to the second backplane contact pad.

3. The display tile structure of claim 1, comprising:

a backplane having first and second backplane contact pads on a surface of the backplane, wherein the backplane side of the tile layer is adjacent to and in contact with the backplane surface having the first and second backplane contact pads; and

a first electrical connector electrically connecting the first tile contact pad to the first backplane contact pad and a second electrical connector electrically connecting the second tile contact pad to the second backplane contact pad.

4. The display tile structure of claim 3, wherein the tile layer is a part of or forms a tile, and wherein the display tile structure comprises a plurality of tiles with LEDS arranged in a regular array.

5. The display tile structure of claim 4, comprising an index matching or light-absorbing layer located between the tile layers.

6. The display tile structure of claim 1, wherein the LED has a light-emitting side and an opposed connection side adjacent to the backplane side of the tile layer and the first and second electrodes are disposed on the connection side.

7. The display tile structure of claim 1, wherein:

the first and second tile contact pads have a tile-contact-pad dimension over the tile layer, the first and second tile contact pads are spatially separated by a tile-contact-pad separation over the tile layer, the first and second micro-wires have a micro-wire width, the first and second electrodes have an electrode width, and the first and second electrodes are spatially separated by an electrode separation, wherein at least one of the following are true;

the tile-contact-pad dimension is greater than the micro-wire width, the electrode width, or the electrode separation, or

the tile-contact-pad separation is greater than the micro-wire width, the electrode width, or the electrode separation.

8. The display tile structure of claim 3, wherein the backplane contact pads have a minimum dimension over the backplane that is greater than the tile-contact-pad dimension.

9. The display tile structure of claim 1, comprising one or more passive electrical components mounted on to, formed on, or formed in the backplane side of the tile layer on a side of the layer of light-absorbing material opposite the display substrate and electrically connected to the first or second tile micro-wires, electrodes, or tile contact pads and wherein at least one of the first or second tile micro-wires is electrically connected to a tile contact pad through one or more of the passive electrical components.

10. The display tile structure of claim 1, comprising one or more active electrical components mounted on to the backplane side of the tile layer on a side of the layer of light-absorbing material opposite the display substrate and electrically connected to the first or second tile micro-wires, electrodes, or tile contact pads and wherein at least one of the first or second tile micro-wires is electrically connected to a tile contact pad through one or more of the active electrical components.

11. The display tile structure of claim 1, comprising a plurality of tile contact pads spaced around the perimeter of the tile layer and at least one tile contact pad located within the interior of the tile layer, the plurality of tile contact pads and at least one tile contact pad disposed only on a side of the light-absorbing material layer opposite the tile substrate.

12. The display tile structure of claim 11, comprising one or more active electrical components mounted on to the backplane side of the tile layer, disposed only on a side of the light-absorbing material layer opposite the tile substrate, and electrically connected to the at least one tile contact pad located within the interior of the tile layer and wherein the plurality of tile contact pads spaced around the perimeter of the tile layer are connected to the LEDs.

13. The display tile structure of claim 1, comprising a tile heat-transfer structure on or in the tile layer in thermal communication with a corresponding backplane heat-transfer structure on the backplane.

14. The display tile structure of claim 13, wherein the thermal communication is a solder bond between the tile heat-transfer structure and the backplane heat-transfer structure.