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Sealed devices comprising transparent laser weld regions

  • US 9,741,963 B2
  • Filed: 03/10/2016
  • Issued: 08/22/2017
  • Est. Priority Date: 05/10/2013
  • Status: Active Grant
First Claim
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1. A sealed device comprising:

  • an inorganic film formed over a surface of a first substrate, the inorganic film comprising;

    20-100 mol % SnO,0-50 mol % SnF2, and0-30 mol % P2O5 or B2O3;

    a second substrate in contact with the inorganic film; and

    a weld region comprising a bond formed between the first and second substrates and extending from a first depth in the first substrate to a second depth in the second substrate;

    wherein the inorganic film comprises at least one inorganic film element and wherein one or both of the first and second substrates comprises at least one inorganic substrate element; and

    wherein a first inorganic film element concentration of the first or second substrate in the weld region is higher than a second inorganic film element concentration of the first or second substrate outside the weld region.

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