Integrated optoelectronic modules based on arrays of emitters and microlenses

• US 9,746,369 B2
• Filed: 09/07/2015
• Issued: 08/29/2017
• Est. Priority Date: 02/15/2012
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Shpunt, Alexander, Mor, Zafrir, Erlich, Raviv
• Primary Examiner(s): LE, QUE TAN
• Application Number:
  US14/846,856
• Publication Number:
  US 20150377696A1
• Time in Patent Office: 722 Days
• Field of Search: 250551, 250221, 250216, 250239
• CPC Class Codes: B23P 19/04 for assembling or disassembling parts
• CPC Class Codes: G01J 1/0411 using focussing or collimating elements, i.e. lenses or mirrors; Aberration correction
• CPC Class Codes: G01J 1/44 Electric circuits for command of an exposure part G03B7/02
• CPC Class Codes: G01J 2001/4466 Avalanche
• CPC Class Codes: G01S 17/10 using transmission of interrupted, pulse-modulated waves determination of distance by phase measurements G01S17/32
• CPC Class Codes: G01S 17/42 Simultaneous measurement of distance and other co-ordinates indirect measurement G01S17/46
• CPC Class Codes: G01S 17/89 for mapping or imaging
• CPC Class Codes: G01S 7/4812 transmitted and received beams following a coaxial path
• CPC Class Codes: G01S 7/4817 relating to scanning
• CPC Class Codes: G01S 7/4865 Time delay measurement, e.g. time-of-flight measurement, time of arrival measurement or determining the exact position of a peak peak detection in noise, signal conditioning G01S7/487
• CPC Class Codes: G01S 7/4868 Controlling received signal intensity or exposure of sensor
• CPC Class Codes: G02B 27/0961 Lens arrays lens arrays per se G02B3/0006
• CPC Class Codes: G06F 3/011 Arrangements for interaction with the human body, e.g. for user immersion in virtual reality blind teaching G09B21/00
• CPC Class Codes: G06T 15/00 3D [Three Dimensional] image rendering
• CPC Class Codes: H01S 3/0071 Beam steering, e.g. whereby a mirror outside the cavity is present to change the beam direction
• CPC Class Codes: H01S 5/02253 using lenses
• CPC Class Codes: H01S 5/02257 using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/4012 Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
• CPC Class Codes: H01S 5/4075 Beam steering
• CPC Class Codes: H01S 5/423 : having a vertical cavity
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

A beam generating device includes a semiconductor substrate, having an optical passband. A first array of vertical-cavity surface-emitting lasers (VCSELs) is formed on a first face of the semiconductor substrate and are configured to emit respective laser beams through the substrate at a wavelength within the passband. A second array of microlenses is formed on a second face of the semiconductor substrate, with the microlenses in respective alignment with the VCSELs so as to transmit the laser beams generated by the VCSELs.

Claims

1. A beam generating device, comprising:

a collimation lens;

a semiconductor substrate, having an optical passband;

a first array of vertical-cavity surface-emitting lasers (VCSELs), which are formed on a first face of the semiconductor substrate and are configured to emit respective laser beams through the substrate at a wavelength within the passband; and

a second array of microlenses, which are formed on a second face of the semiconductor substrate in respective alignment with the VCSELs so as to transmit the laser beams generated by the VCSELs and to direct the laser beams from the VCSELs toward the collimation lens.

2. The device according to claim 1, wherein the VCSELs are offset inwardly relative to the microlenses, so as to cause the respective laser beams to spread apart.

3. The device according to claim 1, wherein the VCSELs are offset outwardly relative to the microlenses, so as to cause the respective laser beams to converge together to a focal waist.

4. The device according to claim 1, wherein the substrate comprises GaAs.

5. The device according to claim 1, wherein the semiconductor substrate has a thickness of 0.5 mm, and is transparent to wavelengths longer than 900 nm.

6. The device according to claim 1, wherein the VCSELs are coupled to be driven in predefined groups, so as to vary a diameter of an output beam transmitted by the collimation lens.

7. The device according to claim 1, wherein the first and second arrays are configured in a hexagonal arrangement.

8. An optoelectronic module, comprising:

a collimation lens;

a micro-optical substrate;

a beam transmitter, mounted on the micro-optical substrate, and comprising;

a semiconductor substrate, having an optical passband;

a first array of surface-emitting devices, which are formed on a first face of the semiconductor substrate and are configured to emit respective laser beams through the substrate at a wavelength within the passband; and

a second array of microlenses, which are formed on a second face of the semiconductor substrate in respective alignment with the surface-emitting devices so as to direct the laser beams generated by the surface-emitting devices toward the collimation lens, which transmits the laser beams along a beam axis; and

a receiver, comprising a detector die mounted on the micro-optical substrate and configured to sense light collected by the collimation lens and received by the module along a collection axis of the receiver.

9. The module according to claim 8, and comprising beam-combining optics, which are configured to direct the laser beams and the received light so that the beam axis is aligned with the collection axis outside the module.

10. The module according to claim 9, wherein the beam-combining optics comprise a beamsplitter, which is intercepted by both the beam axis and the collection axis.

11. The module according to claim 8, wherein the laser beams and the received light are directed to impinge on a scanning mirror, wherein the mirror scans both the laser beams and a field of view of the receiver over a scene.

12. The module according to claim 8, wherein the surface-emitting devices comprise vertical-cavity surface-emitting lasers (VCSELs).

13. The module according to claim 8, wherein the receiver comprises an avalanche photodiode.

14. The module according to claim 8, wherein the receiver comprises a linear array of photodetectors.

15. The module according to claim 8, wherein the receiver comprises a two-dimensional matrix of photodetectors.

16. A method for producing a beam generating device, comprising:

forming a first array of vertical-cavity surface-emitting lasers (VCSELs) on a first face of a semiconductor substrate so that the VCSELs emit respective laser beams through the substrate at a wavelength within an optical passband of the substrate; and

forming a second array of microlenses on a second face of the semiconductor substrate in respective alignment with the VCSELs so as to transmit the laser beams generated by the VCSELs,

wherein the VCSELs are offset inwardly relative to the microlenses, so as to cause the respective laser beams to spread apart.

17. The method according to claim 16, wherein the substrate comprises GaAs.

18. The method according to claim 16, and comprising mounting a collimation lens to collimate the laser beams transmitted by the microlenses in the second array.