Solar cell and method for producing same
First Claim
1. A rear contacted heterojunction intrinsic thin layer solar cell comprising:
- a silicon substrate with a front surface and a rear surface;
a passivating layer at the front surface of the silicon substrate;
a continuous thin intrinsic amorphous silicon layer covering the entire rear surface of the substrate, the intrinsic amorphous silicon layer having a front surface adjacent to the rear surface of the silicon substrate and the intrinsic amorphous silicon layer having a back surface opposite to the front surface of the intrinsic amorphous silicon layer;
an emitter layer comprising a doped semiconducting material of a first doping polarity and covering one or more portions of the back surface of the intrinsic amorphous silicon layer;
a base layer comprising a doped semiconducting material of a second doping polarity opposite to the first doping polarity and with higher doping concentration than the silicon substrate and covering one or more portions of the back surface of the intrinsic amorphous silicon layer neighboring the portion covered by the emitter layer;
a separating layer comprising an electrically insulating material and being arranged on one or more portions of the back surface of the intrinsic amorphous silicon layer laterally between neighboring portions of the emitter layer and portions of the base layer;
whereinadjacent regions of the emitter layer and the separating layer and adjacent regions of the base layer and the separating layer are partially laterally overlapping in such a way that, in an overlapping area, at least a portion of the separating layer is located closer to the substrate than an overlapping portion of a respective one of the emitter layer and the base layer, and that the separating layer comprises a first portion that is arranged between the silicon substrate and the base layer and a second portion that is arranged between the silicon substrate and the emitter layer.
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Abstract
A rear contact heterojunction solar cell and a fabricating method. The solar cell comprises a silicon substrate having a passivating layer and an intrinsic amorphous silicon layer. At a back side of the intrinsic amorphous silicon layer, an emitter layer and a base layer are provided. Interposed between these emitter and base layers is a separation layer comprising an electrically insulating material. This separation layer as well as the base layer and emitter layer may be generated by vapor deposition. Due to such processing, adjacent regions of the emitter layer and the separating layer and adjacent regions of the base layer and the separating layer partially laterally overlap in overlapping areas in such a way that at least a part of the separating layer is located closer to the substrate than an overlapping portion of the respective one of the emitter layer and the base layer.
17 Citations
7 Claims
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1. A rear contacted heterojunction intrinsic thin layer solar cell comprising:
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a silicon substrate with a front surface and a rear surface; a passivating layer at the front surface of the silicon substrate; a continuous thin intrinsic amorphous silicon layer covering the entire rear surface of the substrate, the intrinsic amorphous silicon layer having a front surface adjacent to the rear surface of the silicon substrate and the intrinsic amorphous silicon layer having a back surface opposite to the front surface of the intrinsic amorphous silicon layer; an emitter layer comprising a doped semiconducting material of a first doping polarity and covering one or more portions of the back surface of the intrinsic amorphous silicon layer; a base layer comprising a doped semiconducting material of a second doping polarity opposite to the first doping polarity and with higher doping concentration than the silicon substrate and covering one or more portions of the back surface of the intrinsic amorphous silicon layer neighboring the portion covered by the emitter layer; a separating layer comprising an electrically insulating material and being arranged on one or more portions of the back surface of the intrinsic amorphous silicon layer laterally between neighboring portions of the emitter layer and portions of the base layer; wherein adjacent regions of the emitter layer and the separating layer and adjacent regions of the base layer and the separating layer are partially laterally overlapping in such a way that, in an overlapping area, at least a portion of the separating layer is located closer to the substrate than an overlapping portion of a respective one of the emitter layer and the base layer, and that the separating layer comprises a first portion that is arranged between the silicon substrate and the base layer and a second portion that is arranged between the silicon substrate and the emitter layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification