Systems, method and apparatus for curing conductive paste
First Claim
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1. A method for curing conductive paste applied to two adjacent photovoltaic structures, the method comprising:
- placing the two adjacent photovoltaic structures on a wafer carrier, wherein the two photovoltaic structures are coupled in a cascaded manner by a conductive paste, where two adjacent edges of the two photovoltaic structures overlap, wherein the wafer carrier includes a surface element that is in direct contact with the photovoltaic structures and is substantially thermally insulating, and wherein the wafer carrier is placed on a conveyor; and
controlling movement of the conveyor to position the wafer carrier to a vicinity of a heating block such that a heated radiation surface of the heating block radiates heat to the photovoltaic structures for a predetermined duration to cure the conductive paste.
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Abstract
One embodiment can provide a system for curing conductive paste applied on photovoltaic structures. The system can include a wafer carrier for carrying a plurality of photovoltaic structures and a heater. The wafer carrier can include a surface element that is in direct contact with the photovoltaic structures and is substantially thermally insulating. The heater can be positioned above the wafer carrier. The heater can include a heated radiation surface that does not directly contact the photovoltaic structures.
267 Citations
8 Claims
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1. A method for curing conductive paste applied to two adjacent photovoltaic structures, the method comprising:
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placing the two adjacent photovoltaic structures on a wafer carrier, wherein the two photovoltaic structures are coupled in a cascaded manner by a conductive paste, where two adjacent edges of the two photovoltaic structures overlap, wherein the wafer carrier includes a surface element that is in direct contact with the photovoltaic structures and is substantially thermally insulating, and wherein the wafer carrier is placed on a conveyor; and controlling movement of the conveyor to position the wafer carrier to a vicinity of a heating block such that a heated radiation surface of the heating block radiates heat to the photovoltaic structures for a predetermined duration to cure the conductive paste. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification