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Systems, method and apparatus for curing conductive paste

  • US 9,748,434 B1
  • Filed: 05/24/2016
  • Issued: 08/29/2017
  • Est. Priority Date: 05/24/2016
  • Status: Active Grant
First Claim
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1. A method for curing conductive paste applied to two adjacent photovoltaic structures, the method comprising:

  • placing the two adjacent photovoltaic structures on a wafer carrier, wherein the two photovoltaic structures are coupled in a cascaded manner by a conductive paste, where two adjacent edges of the two photovoltaic structures overlap, wherein the wafer carrier includes a surface element that is in direct contact with the photovoltaic structures and is substantially thermally insulating, and wherein the wafer carrier is placed on a conveyor; and

    controlling movement of the conveyor to position the wafer carrier to a vicinity of a heating block such that a heated radiation surface of the heating block radiates heat to the photovoltaic structures for a predetermined duration to cure the conductive paste.

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