Radiation-emitting component, transparent material and filler particles, and method of producing same

• US 9,748,451 B2
• Filed: 04/05/2013
• Issued: 08/29/2017
• Est. Priority Date: 04/12/2012
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Schmidtke, Kathy, Kruppa, Michael, Braune, Bert
• Primary Examiner(s): Huhn, Richard A
• Application Number:
  US14/391,769
• Publication Number:
  US 20150076544A1
• Time in Patent Office: 1,607 Days
• Field of Search: None
• CPC Class Codes: C08G 77/395 containing phosphorus
• CPC Class Codes: C08G 79/04 Phosphorus linked to oxygen or to oxygen and carbon
• CPC Class Codes: C08K 2003/2227 of aluminium
• CPC Class Codes: C08K 2003/2241 Titanium dioxide
• CPC Class Codes: C08K 3/36 Silica
• CPC Class Codes: C08K 5/52 Phosphorus bound to oxygen only
• CPC Class Codes: C08K 5/5317 Phosphonic compounds, e.g. R—P(:O)(OR')2
• CPC Class Codes: C08K 5/5333 Esters of phosphonic acids
• CPC Class Codes: C08K 5/5406 containing elements other than oxygen or nitrogen
• CPC Class Codes: C08K 5/56 Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
• CPC Class Codes: C09C 1/3607 Titanium dioxide
• CPC Class Codes: C09C 1/3653 Treatment with inorganic compounds
• CPC Class Codes: C09C 1/3669 Treatment with low-molecular organic compounds
• CPC Class Codes: C09C 1/3676 Treatment with macro-molecular organic compounds
• CPC Class Codes: C09C 1/407 Aluminium oxides or hydroxides
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2933/0041 : relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 : relating to encapsulations
• CPC Class Codes: H01L 2933/0058 : relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0075 : relating to heat extraction or cooling elements
• CPC Class Codes: H01L 2933/0091 : Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/507 : the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/641 : characterized by the materials
• CPC Class Codes: H01L 33/644 : in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

A radiation-emitting component includes a radiation source; a transparent material disposed in the beam path of the component and including a polymer material and filler particles, wherein the filler particles include an inorganic filler material and a phosphonic acid derivative or phosphoric acid derivative attached to a surface thereof and through which the filler particles are crosslinked with the polymer material.

Claims

1. A radiation-emitting component comprising:

a radiation source;

a transparent material disposed in the beam path of the component and comprises a polymer material and filler particles;

wherein the filler particles comprise an inorganic filler material and a phosphonic acid derivative or phosphoric acid derivative attached to a surface thereof having a structure represented by Formulae Ia and/or Ib;

2. The component according to claim 1,

wherein, in Formulae Ia and Ib, [X]_n-FG in the P—

[X]_n-FG fragment is at least one selected from the group consisting of vinyl, allyl, epoxyethyl, glycidyl, O-vinyl, O-glycidyl,

3. The component according to claim 1, wherein the polymer material comprises a silicone, an epoxy resin, a silicone-epoxide hybrid material or a combination thereof.

4. The component according to claim 3, wherein the transparent material is obtained by crosslinking the filler particles with the polymer material, and reacting a functional group Y of the polymer material selected from the group consisting of Si—

H, Si—

OH and alkylene-OH with a crosslinkable group or a leaving group FG of the phosphonic acid derivative or phosphoric acid derivative, the phosphonic acid derivative or phosphoric acid derivative having a structure which is represented by Formulae Ia and/or Ib.

5. The component according to claim 1, wherein the inorganic filler material comprises a diffuser, a heat-conducting metal oxide, a converter material or a combination thereof.

6. A process of producing a transparent material for a radiation-emitting component, comprising:

A) providing a polymer material;

B) providing filler particles comprising an inorganic filler material and a phosphonic acid derivative or phosphoric acid derivative attached to a surface thereof;

C) producing a mixture comprising the polymer material and the filler particles;

D) curing the mixture by crosslinking the polymer material with the filler particles via the attached phosphonic acid derivative or phosphoric acid derivative to obtain the transparent material having a structure represented by Formulae Ia and/or Ib

7. The process according to claim 6, wherein providing the filler particles in step B) comprises:

B1) providing the inorganic filler material;

B2) applying a composition to the inorganic filler material, said composition comprising a solvent and a phosphonic acid derivative or a phosphoric acid derivative, said phosphonic acid derivative or phosphoric acid derivative having a structure represented by the Formula III

8. The process according to claim 6, wherein providing the filler particles in step B) comprises:

B1) providing the inorganic filler material;

B2) applying a composition to the inorganic filler material, said composition comprising a solvent and a phosphonic acid derivative or a phosphoric acid derivative, said phosphonic acid derivative or phosphoric acid derivative having a structure represented by the Formula III

9. The process according to claim 6, further comprising:

A0) providing a radiation source, and

B0) producing a transparent material in a beam path of the component.

10. The process according to claim 9, wherein the transparent material comprises a polymer material and filler particles,

wherein the filler particles comprise an inorganic filler material and a phosphonic acid derivative or phosphoric acid derivative attached to a surface thereof and through which the filler particles are crosslinked with the polymer material.