Manufacturing method for wireless devices
First Claim
1. A method comprising:
- placing a plurality of loop antennas on a plastic layer, wherein each respective loop antenna of the plurality of loop antennas comprises an inner edge and an outer edge;
placing a plurality of sensor chips on the plastic layer such that each sensor chip is interconnected to the respective loop antenna on the plastic layer and is positioned within the inner edge and the outer edge of the respective loop antenna, wherein each sensor chip has a respective sensor facing away from the plastic layer and has respective electrical contacts interconnected with the respective loop antenna; and
providing an encapsulation layer over the plurality of loop antennas and the plurality of sensor chips on the plastic layer.
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Accused Products
Abstract
A manufacturing method for a wireless device may involve placing a plurality of antennas on a plastic layer, wherein each of the antennas comprises one or more conductive loops positioned within an inner diameter and an outer diameter; placing a plurality of sensor chips on the plastic layer such that each sensor chip is interconnected to a respective antenna on the plastic layer and is positioned within the inner diameter and outer diameter of the respective antenna, wherein each sensor chip has a respective sensor facing away from the plastic layer and has respective electrical contacts interconnected with the respective antenna; and providing an encapsulation layer over the plurality of antennas and the plurality of sensor chips on the plastic layer.
15 Citations
20 Claims
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1. A method comprising:
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placing a plurality of loop antennas on a plastic layer, wherein each respective loop antenna of the plurality of loop antennas comprises an inner edge and an outer edge; placing a plurality of sensor chips on the plastic layer such that each sensor chip is interconnected to the respective loop antenna on the plastic layer and is positioned within the inner edge and the outer edge of the respective loop antenna, wherein each sensor chip has a respective sensor facing away from the plastic layer and has respective electrical contacts interconnected with the respective loop antenna; and providing an encapsulation layer over the plurality of loop antennas and the plurality of sensor chips on the plastic layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A package comprising:
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a plastic layer; a plurality of loop antennas placed on the plastic layer, wherein each respective loop antenna of the plurality of loop antennas comprises an inner edge and an outer edge; a plurality of sensor chips placed on the plastic layer such that each sensor chip is interconnected to the respective loop antenna on the plastic layer and is positioned within the inner edge and the outer edge of the respective loop antenna, wherein each sensor chip has a respective sensor facing away from the plastic layer and has respective electrical contacts interconnected with the respective loop antenna; and an encapsulation layer provided over the plurality of loop antennas and the plurality of sensor chips on the plastic layer. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification