Metamaterial substrate for circuit design
First Claim
1. An apparatus comprising a substantially small sized and thinner electromagnetic band gap structure for a predetermined band gap frequency band, said apparatus comprising:
- a. coplanar conductive unit elements that are periodically arrayed with an edge to edge spacing d between each of the adjacent said coplanar conductive unit elements forming a first layer,b. a dielectric having a thickness hr and a relative dielectric permittivity ∈
r forming a second layer,c. a contiguous conductive plane forming a third layer,d. a capacitive surface means arranged in part by the length of the outer perimeter of each of said coplanar conductive unit elements, in part by the spacing d between each of the adjacent said coplanar conductive unit elements and in part by said relative dielectric permittivity ∈
r of said dielectric for enabling a substantially increased distributed capacitance being electrically coupled in series between each of the adjacent said coplanar conductive unit elements in the array on said first layer,e. an inductive connection means arranged beside said capacitive surface means for enabling a substantially increased distributed inductance being electrically coupled in shunt between each of said coplanar conductive unit elements in the array on said first layer and said contiguous conductive plane on said third layer and with said dielectric therein,f. a composite reference plane comprising said first layer, second layer and third layer, forming a sufficient resonance circuit with said predetermined band gap frequency band including said capacitive surface means and said inductive connection means,g. a first miniature means originated from said inductive connection means for enabling a first ratio, alpha, of said thickness hr to the free space wavelength of at least one use frequency falling within said predetermined band gap frequency band, to be such that as to minimize said thickness hr while providing said sufficient resonance circuit of said composite reference plane, andh. a second miniature means originated from said capacitive surface means for enabling a second ratio, beta, of the length of at least one side of the outer perimeter of each of said coplanar conductive unit elements to the free space wavelength of at least one use frequency falling within said predetermined band gap frequency band, and a third ratio, gamma, of the spacing d to the free space wavelength of at least one use frequency falling within said predetermined band gap frequency band, to be such that as to minimize the length of the outer perimeter and the spacing d while providing said sufficient resonance circuit of said composite reference plane,whereby the electromagnetic band gap structure can be made substantially thinner and smaller in overall dimensions to integrate readily and practically with electrical circuits and microelectronic devices that have constraints in dimensions and thickness.
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Accused Products
Abstract
This invention enables Frequency Selective Surface (“FSS”) and Artificial Magnetic Conductor (“AMC”) which exhibits Electromagnetic Band Gap (“EBG”) in any of the substrate'"'"'s layer from a small and thin systems and sub-systems in package to a large-format PCBs. The metamaterial substrate may be integrated with electronic circuit components or buried in PCBs for circuit designs capable of transmitting, receiving and reflecting electromagnetic energy, altering electromagnetic properties of natural circuit materials, enhancing electrical characteristics of electrical components (such as filters, antennas, baluns, power dividers, transmission lines, amplifiers, power regulators, and printed circuits elements) in systems and sub-systems circuit designs. The metamaterial substrate creates new electrical characteristics, properties and systems, sub-systems or component'"'"'s specification not readily available with conventional circuit materials, substrates, and PCBs. The metamaterial substrate can be less than 70 μm thick and buried into any PCB layer.
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Citations
57 Claims
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1. An apparatus comprising a substantially small sized and thinner electromagnetic band gap structure for a predetermined band gap frequency band, said apparatus comprising:
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a. coplanar conductive unit elements that are periodically arrayed with an edge to edge spacing d between each of the adjacent said coplanar conductive unit elements forming a first layer, b. a dielectric having a thickness hr and a relative dielectric permittivity ∈
r forming a second layer,c. a contiguous conductive plane forming a third layer, d. a capacitive surface means arranged in part by the length of the outer perimeter of each of said coplanar conductive unit elements, in part by the spacing d between each of the adjacent said coplanar conductive unit elements and in part by said relative dielectric permittivity ∈
r of said dielectric for enabling a substantially increased distributed capacitance being electrically coupled in series between each of the adjacent said coplanar conductive unit elements in the array on said first layer,e. an inductive connection means arranged beside said capacitive surface means for enabling a substantially increased distributed inductance being electrically coupled in shunt between each of said coplanar conductive unit elements in the array on said first layer and said contiguous conductive plane on said third layer and with said dielectric therein, f. a composite reference plane comprising said first layer, second layer and third layer, forming a sufficient resonance circuit with said predetermined band gap frequency band including said capacitive surface means and said inductive connection means, g. a first miniature means originated from said inductive connection means for enabling a first ratio, alpha, of said thickness hr to the free space wavelength of at least one use frequency falling within said predetermined band gap frequency band, to be such that as to minimize said thickness hr while providing said sufficient resonance circuit of said composite reference plane, and h. a second miniature means originated from said capacitive surface means for enabling a second ratio, beta, of the length of at least one side of the outer perimeter of each of said coplanar conductive unit elements to the free space wavelength of at least one use frequency falling within said predetermined band gap frequency band, and a third ratio, gamma, of the spacing d to the free space wavelength of at least one use frequency falling within said predetermined band gap frequency band, to be such that as to minimize the length of the outer perimeter and the spacing d while providing said sufficient resonance circuit of said composite reference plane, whereby the electromagnetic band gap structure can be made substantially thinner and smaller in overall dimensions to integrate readily and practically with electrical circuits and microelectronic devices that have constraints in dimensions and thickness. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A method of making a substantially small sized and thinner electromagnetic band gap structure for a predetermined band gap frequency band, comprising:
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a. providing an array of coplanar conductive unit elements which are periodically arrayed with an edge to edge spacing d between each of the coplanar conductive unit elements to form a first layer, b. providing a dielectric having a thickness hr and a relative dielectric permittivity ∈
r which forms a second layer,c. providing a contiguous conductive plane which forms a third layer, d. providing a capacitive surface means which is arranged in part by the length of the outer perimeter of each of the coplanar conductive unit elements, in part by the spacing d between each of the adjacent coplanar conductive unit elements and in part by said relative dielectric permittivity ∈
r of said dielectric for enabling a substantially increased distributed capacitance being electrically coupled in series between each of the adjacent coplanar conductive unit elements in the array on said first layer,e. providing an inductive connection means which is arranged beside said capacitive surface means for enabling a substantially increased distributed inductance being electrically coupled in shunt between each of the coplanar conductive unit elements in the array on said first layer and said contiguous conductive plane on said third layer and with said dielectric therein, f. providing a composite reference plane comprising said first layer, second layer and third layer, forming a sufficient resonance circuit with said predetermined band gap frequency band including said capacitive surface means and said inductive connection means, g. providing a first miniature means which is originated from said inductive connection means for enabling a first ratio, alpha, of said thickness hr to the free space wavelength of at least one use frequency falling within said predetermined band gap frequency band, to be such that as to minimize said thickness hr while providing said sufficient resonance circuit of said composite reference plane, and h. providing a second miniature means which is originated from said capacitive surface means for enabling a second ratio, beta, of the length of at least one side of the outer perimeter of each of the coplanar conductive unit elements to the free space wavelength of at least one use frequency falling within said predetermined band gap frequency band, and a third ratio, gamma, of the spacing d to the free space wavelength of at least one use frequency falling within said predetermined band gap frequency band, to be such that as to minimize the length of the outer perimeter and the spacing d while providing said sufficient resonance circuit of said composite reference plane, whereby the electromagnetic band gap structure can be made substantially thinner and smaller in overall dimensions to integrate readily and practically with electrical circuits and microelectronic devices that have constraints in dimensions and thickness. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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40. A method of making a substantially thinner and more compact signal transmission device that has at least one substantially thinner and small sized composite reference plane, wherein the composite reference plane is a three layers structure with a predetermined band gap frequency band, comprising:
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a. providing at least one conductor which forms a first layer, b. providing a first dielectric which has a thickness h1 and a relative dielectric permittivity ∈
1 to form a second layer,c. providing an array of coplanar conductive unit elements which are periodically arrayed with an edge to edge spacing d between each of the adjacent coplanar conductive unit elements to form a third layer, d. providing a base dielectric having a thickness hr and a relative dielectric permittivity ∈
r which forms a fourth layer,e. providing a contiguous conductive plane which forms a fifth layer, f. providing a capacitive surface means which is arranged in part by the length of the outer perimeter of each of the coplanar conductive unit elements, in part by the spacing d between each of the adjacent coplanar conductive unit elements and in part by said relative dielectric permittivity ∈
r of said base dielectric for enabling a substantially increased distributed capacitance being electrically coupled in series between each of the adjacent coplanar conductive unit elements in the array on said third layer,g. providing an inductive connection means which is arranged beside said capacitive surface means for enabling a substantially increased distributed inductance being electrically coupled in shunt between each of the coplanar conductive unit elements in the array on said third layer and said contiguous conductive plane on said fifth layer and with said base dielectric therein, h. providing at least one composite reference plane which is arranged by a three layers structure comprising said third layer, fourth layer and fifth layer, forming a sufficient resonance circuit with said predetermined band gap frequency band including said capacitive surface means and said inductive connection means, i. providing a first miniature means which is originated from said inductive connection means for enabling a first ratio, alpha, of said thickness hr to the free space wavelength of at least one use frequency falling within said predetermined band gap frequency band of said composite reference plane, to be such that as to minimize thickness hr while providing said sufficient resonance circuit of said composite reference plane, and j. providing a second miniature means which is originated from said capacitive surface means for enabling a second ratio, beta, of the length of at least one side of the outer perimeter of each of the coplanar conductive unit elements to the free space wavelength of at least one use frequency falling within said predetermined band gap frequency band, and a third ratio, gamma, of the spacing d to the free space wavelength of at least one use frequency falling within said predetermined band gap frequency band of said composite reference plane, to be such that as to minimize the length of the outer perimeter and the spacing d while providing said sufficient resonance circuit of said composite reference plane. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57)
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Specification