Multi-level oscillating heat pipe implementation in an electronic circuit card module

• US 9,750,160 B2
• Filed: 01/20/2016
• Issued: 08/29/2017
• Est. Priority Date: 01/20/2016
• Status: Active Grant

• Current Assignee: Thermavant Technologies, LLC
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Short, Jr., Byron Elliott, Francis, Nathan R., Brandt, David B.
• Primary Examiner(s): Haughton, Anthony
• Assistant Examiner(s): Gafur, Razmeen
• Application Number:
  US15/002,256
• Publication Number:
  US 20170208706A1
• Time in Patent Office: 587 Days
• Field of Search: 361676-678, 36167946-67954, 361688-723, 165 801- 805, 16510433, 165185, 174 151- 153, 174 161- 163, 174547, 174548, 257712-722, 257E23088, 24453, 24458-459, 454184, 312236
• CPC Class Codes: B23P 15/26 heat exchangers or the like making heat exchangers by methods covered by other subclasses B21D53/02
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 2015/0216 having particular orientation, e.g. slanted, or being orientation-independent
• CPC Class Codes: F28D 2015/0225 Microheat pipes
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H05K 7/20309 Evaporators
• CPC Class Codes: H05K 7/20318 Condensers
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: H05K 7/20672 within sub-racks for removing heat from electronic boards

Abstract

One or both of a module cover and a heat sink for a circuit card module includes a multi-level cooling structure formed by a body, sidewalls extending from edges of the body and, together with the body, partially enclosing a volume, flanges projecting from ends of the sidewalls opposite the body and away from the volume, and an oscillating heat pipe within the body, the sidewalls, and the flanges. The oscillating heat pipe fluid path repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges. The oscillating heat pipe provides cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between an evaporator adjacent a first of the flanges and a condenser adjacent a second of the flanges.

Claims

1. A multi-level cooling structure, comprising:

a body;

sidewalls extending from edges of the body, wherein the sidewalls, together with the body, partially enclose a volume;

flanges projecting from ends of the sidewalls opposite the body, wherein the flanges project away from the volume; and

an oscillating heat pipe within the body, the sidewalls, and the flanges;

wherein a fluid path for the oscillating heat pipe repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges; and

wherein the oscillating heat pipe is configured to provide cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between an evaporator adjacent a first of the flanges and a condenser adjacent a second of the flanges.

2. The multi-level cooling structure according to claim 1, wherein the oscillating heat pipe fluid path;

traverses the body and a first of the sidewalls and extends into the first flange,

turns in a U shape within the first flange back to the first sidewall,

traverses the first sidewall, the body, and a second of the sidewalls and extends into the second flange,

turns in a U shape within the second flange back to the second sidewall, and

traverses the second sidewall, the body, and the first sidewall.

3. The multi-level cooling structure according to claim 1, wherein the oscillating heat pipe fluid path turns 90°

from the body into each of the sidewalls and from one of the sidewalls into one of the flanges.

4. The multi-level cooling structure according to claim 1, wherein a portion of the oscillating heat pipe fluid path within at least one of the flanges is offset from a portion of the oscillating heat pipe fluid path within the body.

5. The multi-level cooling structure according to claim 1, wherein segments of the oscillating heat pipe within the body are horizontal, segments of the oscillating heat pipe within the sidewalls are vertical, and segments of the oscillating heat pipe within the flanges are horizontal.

6. The multi-level cooling structure according to claim 1, wherein the oscillating heat pipe fluid path traverses the body in parallel tracks along a length of the body.

7. A circuit card module including the multi-level cooling structure according to claim 1, wherein the multi-level cooling structure comprises a module cover, the circuit card module further comprising:

a circuit card assembly at least partially received within the volume, one or more components on the circuit card assembly contacting the body of the multi-level cooling structure; and

a heat sink adjacent the circuit card assembly opposite the module cover.

8. A method, comprising:

within a multi-level structure formed by (i) a body, (ii) sidewalls extending from edges of the body and, together with the body, partially enclosing a volume, and (iii) flanges projecting from ends of the sidewalls opposite the body and away from the volume, providing an oscillating heat pipe within the body, the sidewalls, and the flanges, wherein a fluid path for the oscillating heat pipe repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges; and

providing an evaporator adjacent a first of the flanges and a condenser adjacent a second of the flanges, wherein the oscillating heat pipe is configured to provide cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between the evaporator and the condenser.

9. The method according to claim 8, wherein the oscillating heat pipe fluid path;

traverses the body and a first of the sidewalls and extends into the first flange,

turns in a U shape within the first flange back to the first sidewall,

traverses the first sidewall, the body, and a second of the sidewalls and extends into the second flange,

turns in a U shape within the second flange back to the second sidewall, and

traverses the second sidewall, the body, and the first sidewall.

10. The method according to claim 8, wherein the oscillating heat pipe fluid path turns 90°

from the body into each of the sidewalls and from one of the sidewalls into one of the flanges.

11. The method according to claim 8, wherein a portion of the oscillating heat pipe fluid path within at least one of the flanges is offset from a portion of the oscillating heat pipe fluid path within the body.

12. The method according to claim 8, wherein segments of the oscillating heat pipe within the body are horizontal, segments of the oscillating heat pipe within the sidewalls are vertical, and segments of the oscillating heat pipe within the flanges are horizontal.

13. The method according to claim 8, wherein the oscillating heat pipe fluid path traverses the body in parallel tracks along a length of the body.

14. The method according to claim 8, wherein the body, the sidewalls, and the flanges form a module cover, the method further comprising:

disposing a circuit card assembly at least partially within the volume with one or more components on the circuit card assembly contacting the body; and

disposing a heat sink adjacent the circuit card assembly opposite the module cover.

15. The method according to claim 8, further comprising:

forming the body, the sidewalls and the flanges using additive ultrasonic welding.

16. A circuit card module, comprising:

a module cover including a body and sidewalls partially enclosing a first volume, and flanges;

a heat sink including a body and sidewalls partially enclosing a second volume adjacent the first volume, and flanges;

a circuit card assembly within the first and second volumes with at least one component on the circuit card assembly in contact with one of the module cover body and the heat sink body;

an evaporator adjacent a first of the module cover flanges and a first of the heat sink flanges;

a condenser adjacent a second of the module cover flanges and a second of the heat sink flanges;

a first oscillating heat pipe within the module cover body, the module cover sidewalls, and the module cover flanges, wherein a first fluid path for the first oscillating heat pipe repeatedly traverses the module cover body, a length of each of the module cover sidewalls, and a portion of each of the module cover flanges; and

a second oscillating heat pipe within the heat sink body, the heat sink sidewalls, and the heat sink flanges, wherein a second fluid path for the second oscillating heat pipe repeatedly traverses the heat sink body, a length of each of the heat sink sidewalls, and a portion of each of the heat sink flanges,

wherein the first and second oscillating heat pipes are configured to provide cooling through both phase change of fluid slugs and vapor bubbles within the respective oscillating heat pipes and movement of the fluid slugs and the vapor bubbles along the first and second fluid paths between the evaporator and the condenser.

17. The circuit card module according to claim 16, wherein the second oscillating heat pipe fluid path:

traverses the heat sink body and a first of the heat sink sidewalls and extends into the first heat sink flange,

turns in a U shape within the first heat sink flange back to the first heat sink sidewall,

traverses the first heat sink sidewall, the heat sink body, and a second of the heat sink sidewalls and extends into the second heat sink flange,

turns in a U shape within the second heat sink flange back to the second heat sink sidewall, and

traverses the second heat sink sidewall, the heat sink body, and the first heat sink sidewall.

18. The circuit card module according to claim 16, wherein the second oscillating heat pipe fluid path turns 90°

from the heat sink body into each of the heat sink sidewalls and from one of the heat sink sidewalls into one of the heat sink flanges.

19. The circuit card module according to claim 16, wherein a portion of the second oscillating heat pipe fluid path within at least one of the heat sink flanges is offset from a portion of the second oscillating heat pipe fluid path within the heat sink body.

20. The circuit card module according to claim 16, wherein segments of the second oscillating heat pipe within the heat sink body are horizontal, segments of the second oscillating heat pipe within the heat sink sidewalls are vertical, and segments of the second oscillating heat pipe within the heat sink flanges are horizontal.