Multi-level oscillating heat pipe implementation in an electronic circuit card module
First Claim
1. A multi-level cooling structure, comprising:
- a body;
sidewalls extending from edges of the body, wherein the sidewalls, together with the body, partially enclose a volume;
flanges projecting from ends of the sidewalls opposite the body, wherein the flanges project away from the volume; and
an oscillating heat pipe within the body, the sidewalls, and the flanges;
wherein a fluid path for the oscillating heat pipe repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges; and
wherein the oscillating heat pipe is configured to provide cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between an evaporator adjacent a first of the flanges and a condenser adjacent a second of the flanges.
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Accused Products
Abstract
One or both of a module cover and a heat sink for a circuit card module includes a multi-level cooling structure formed by a body, sidewalls extending from edges of the body and, together with the body, partially enclosing a volume, flanges projecting from ends of the sidewalls opposite the body and away from the volume, and an oscillating heat pipe within the body, the sidewalls, and the flanges. The oscillating heat pipe fluid path repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges. The oscillating heat pipe provides cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between an evaporator adjacent a first of the flanges and a condenser adjacent a second of the flanges.
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Citations
20 Claims
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1. A multi-level cooling structure, comprising:
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a body; sidewalls extending from edges of the body, wherein the sidewalls, together with the body, partially enclose a volume; flanges projecting from ends of the sidewalls opposite the body, wherein the flanges project away from the volume; and an oscillating heat pipe within the body, the sidewalls, and the flanges; wherein a fluid path for the oscillating heat pipe repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges; and wherein the oscillating heat pipe is configured to provide cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between an evaporator adjacent a first of the flanges and a condenser adjacent a second of the flanges. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method, comprising:
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within a multi-level structure formed by (i) a body, (ii) sidewalls extending from edges of the body and, together with the body, partially enclosing a volume, and (iii) flanges projecting from ends of the sidewalls opposite the body and away from the volume, providing an oscillating heat pipe within the body, the sidewalls, and the flanges, wherein a fluid path for the oscillating heat pipe repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges; and providing an evaporator adjacent a first of the flanges and a condenser adjacent a second of the flanges, wherein the oscillating heat pipe is configured to provide cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between the evaporator and the condenser. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A circuit card module, comprising:
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a module cover including a body and sidewalls partially enclosing a first volume, and flanges; a heat sink including a body and sidewalls partially enclosing a second volume adjacent the first volume, and flanges; a circuit card assembly within the first and second volumes with at least one component on the circuit card assembly in contact with one of the module cover body and the heat sink body; an evaporator adjacent a first of the module cover flanges and a first of the heat sink flanges; a condenser adjacent a second of the module cover flanges and a second of the heat sink flanges; a first oscillating heat pipe within the module cover body, the module cover sidewalls, and the module cover flanges, wherein a first fluid path for the first oscillating heat pipe repeatedly traverses the module cover body, a length of each of the module cover sidewalls, and a portion of each of the module cover flanges; and a second oscillating heat pipe within the heat sink body, the heat sink sidewalls, and the heat sink flanges, wherein a second fluid path for the second oscillating heat pipe repeatedly traverses the heat sink body, a length of each of the heat sink sidewalls, and a portion of each of the heat sink flanges, wherein the first and second oscillating heat pipes are configured to provide cooling through both phase change of fluid slugs and vapor bubbles within the respective oscillating heat pipes and movement of the fluid slugs and the vapor bubbles along the first and second fluid paths between the evaporator and the condenser. - View Dependent Claims (17, 18, 19, 20)
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Specification