Data center floor management

• US 9,752,329 B2
• Filed: 10/29/2015
• Issued: 09/05/2017
• Est. Priority Date: 07/06/2015
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Rodriguez, Jean-Michel
• Primary Examiner(s): Canfield, Robert
• Application Number:
  US14/926,041
• Publication Number:
  US 20170009461A1
• Time in Patent Office: 677 Days
• CPC Class Codes: E04F 15/02177 Floor elements for use at a specific location not used, see subgroups
• CPC Class Codes: E04F 15/02417 made of box-like elements
• CPC Class Codes: E04F 15/02447 Supporting structures
• CPC Class Codes: E04F 15/02458 Framework supporting the panels
• CPC Class Codes: E04F 2290/02 for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets

Abstract

A floor tile for a data center floor is provided that includes a first tile module having a main surface including a first side wall portion and a second side wall portion extending from opposite edges of the main surface, the first side wall portion and second side wall portion each including at least one recess for receiving cabling; and a second tile module having a main further surface adapted to form a removable lid of the first tile module. A data center floor including such a floor tile and a data center including such a data center floor are also provided.

Claims

1. A floor tile for a data center floor, comprising:

a first tile module comprising a main tile portion having a first surface area and opposite inner and outer main surfaces, and a first side wall and a second side wall each extending away from the opposite main surfaces to a side wall edge, the first side wall and second side wall being opposing side walls and each side wall edge comprising at least one recess for receiving cabling;

a second tile module comprising a further main tile portion, having a second surface area, and opposite inner and outer further main surfaces, and a first further side wall and a second further side wall extending away from the opposite further main surfaces to a further sidewall edge, the first further side wall and the second further side wall being opposing side walls and each further side wall edge comprising at least one further recess for receiving the cabling, the second tile module being adapted to form a removable lid of the first tile module, and the second surface area of the further main tile portion of the second tile module being different from the first surface area of the main tile portion of the first tile module;

wherein with the floor tile in position, the first further side wall of the second tile module is disposed opposite the first side wall of the first tile module and the second further side wall of the second tile module is disposed opposite the second side wall of the first tile module and the at least one further recess in the first further side wall and second further side wall are arranged to cooperate with the at least one recess in the first side wall and second side wall to allow passing of the cabling through the floor tile; and

wherein with the floor tile in position, the side wall edges of the first and second side walls of the first tile module contact the inner further main surface of the second tile module or the further side wall edges of the first and second further side walls of the second tile module contact the inner main surface of the first tile module.

2. The floor tile of claim 1, further comprising a third side wall opposite a fourth side wall, the third side wall and fourth side wall each extending from the first side wall to the second side wall.

3. The floor tile of claim 2, wherein the third side wall and the fourth side wall each comprise at least one further recess for receiving cabling.

4. The floor tile of claim 1, wherein the further main tile portion of the second tile module contact the side wall edges of the first side wall and the second side wall when the second tile module is placed on the first tile module.

5. The floor tile of claim 1, wherein the further side wall edges of the first further side wall and the second further side wall contact the main tile portion of the first tile module when the second tile module is placed on the first tile module.

6. The floor tile of claim 1, further comprising at least one fastener to fasten the first tile module to the second tile module.

7. The floor tile of claim 1, wherein the main tile portion and the main further tile portion each comprise a plurality of air holes for circulating air through the floor tile.

8. The floor tile of claim 7, wherein the main tile portion and the main further tile portion are perforated surfaces.

9. A data center floor comprising a grid of floor tiles including floor tiles having:

a first tile module comprising a main tile portion having a first surface area, and opposite inner and outer main surfaces, and a first side wall and a second side wall each extending away from the opposite main surfaces to a side wall edge, the first side wall and second side wall being opposite side walls and each side wall edge comprising at least one recess for receiving cabling;

a second tile module comprising a further main tile portion, having a second surface area, and opposite inner and outer main surfaces, and a first further side wall and a second further side wall extending away from the opposite further main surfaces to a further side wall edge, the first further side wall and the second further side wall being opposite side walls and each further side wall edge comprising at least one further recess for receiving the cabling, the second tile module being adapted to form a removable lid of the first tile module, and the second surface area of the further main tile portion of the second tile module being different from the first surface area of the main tile portion of the first tile module;

wherein with the floor tile in position, the first further side wall of the second tile module is disposed opposite the first side wall of the first tile module and the second further side wall of the second tile module is disposed opposite the second side wall of the first tile module and the at least one further recess in the first further side wall and second further side wall are arranged to cooperate with the at least one recess in the first side wall and second side wall to allow passing of the cabling through the first tile; and

wherein with the floor tile in position, the side wall edges of the first and second side walls of the first tile module contact the inner further main surface of the second tile module or the further side wall edges of the first and second further side walls of the second tile module contact the inner main surface of the first tile module.

10. The data center floor of claim 9, further comprising a plurality of legs for raising the grid of floor tiles above a floor surface on which the legs are to be positioned.

11. A data center including a data center floor comprising a grid of floor tiles including floor tiles having:

a first tile module comprising a main tile portion having a first surface area, and opposite inner and outer main surfaces, and a first side wall and a second side wall each extending away from the opposite main surfaces to a side wall edge, the first side wall and second side wall being opposite side walls and each side wall edge comprising at least one recess for receiving cabling;

a second tile module comprising a further main tile portion, having a second surface area, and opposite inner and outer further main surfaces, and a first further side wall and a second further side wall extending away from the opposite further main surfaces to a further side wall edge, the first further side wall and the second further side wall being opposite side walls and each further side wall edge comprising at least one further recess for receiving the cabling, the second tile module being adapted to form a removable lid of the first tile module, and the second surface area of the further main tile portion of the second tile module being different from the first surface area of the main tile portion of the first tile module;

wherein with the floor tile in position, the first further side wall of the second tile module is disposed opposite the first side wall of the first tile module and the second further side wall of the second tile module is disposed opposite the second side wall of the first tile module and the at least one further recess in the first further side wall and second further side wall are arranged to cooperate with the at least one recess in the first side wall and second side wall to allow passing of the cabling through the first tile; and

wherein with the floor tile in position, the side wall edges of the first and second side walls of the first tile module contact the inner further main surface of the second tile module or the further side wall edges of the first and second further side walls of the second tile module contact the inner main surface of the first tile module.

12. The data center of claim 11, further comprising a plurality of legs mounted on the grid of floor tiles, the legs raising the grid of floor tiles above a floor surface of the data center on which the legs are placed.

13. The data center of claim 11, further comprising a third side wall opposite a fourth side wall, the third side wall and fourth side wall each extending from the first side wall to the second side wall.

14. The data center of claim 13, wherein the third side wall and the fourth side wall each comprise at least one further recess for receiving cabling.