Light emitting device

• US 9,752,734 B2
• Filed: 08/08/2016
• Issued: 09/05/2017
• Est. Priority Date: 12/16/2005
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Tanda, Yuichiro, Matsushita, Toshio
• Primary Examiner(s): GRAMLING, SEAN P
• Application Number:
  US15/231,735
• Publication Number:
  US 20160348853A1
• Time in Patent Office: 393 Days
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/235 Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps F21K9/238 takes precedence
• CPC Class Codes: F21V 13/14 the elements being filters or photoluminescent elements, reflectors and refractors
• CPC Class Codes: F21V 19/006 of point-like light sources, e.g. incandescent or halogen lamps, with screw-threaded or bayonet base of sources having contact pins, wires or blades F21V19/0005; of LEDs or sources mounted on printed-circuit board F21V19/001
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21V 31/005 Sealing arrangements therefor
• CPC Class Codes: F21V 9/30 Elements containing photoluminescent material distinct from or spaced from the light source shades F21V1/17; globes, bowls or cover glasses F21V3/08, F21V3/12; refractors F21V5/10; reflectors F21V7/26, F21V7/30; elements with provision for controlling the spectral properties or intensity F21V9/40
• CPC Class Codes: F21V 9/32 characterised by the arrangement of the photoluminescent material
• CPC Class Codes: F21V 9/38 Combination of two or more photoluminescent elements of different materials
• CPC Class Codes: F21Y 2101/00 Point-like light sources
• CPC Class Codes: F21Y 2109/00 Light sources with light-generating elements disposed on transparent or translucent supports or substrates
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: F21Y 2115/30 Semiconductor lasers
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01063 : Europium [Eu]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 33/501 : characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/505 : characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 : the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/508 : having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05B 33/04 : Sealing arrangements , e.g. against humidity

Abstract

A light emitting device includes a board, light emitting element chips, a wavelength conversion member, a transparent bulb, support leads, and a support base. The board has a first surface and a second surface. The second surface is an opposite side to the first surface. The light emitting element chips are mounted on the first surface side. The wavelength conversion member is formed unitarily with a transparent member. The transparent bulb encloses the board and the light emitting element chips. The support leads secure the light emitting element chips inside the transparent bulb. The support base can be threadedly engaged with a conventional light bulb socket along a socket axis. The wavelength conversion member is provided on a first surface side and a second surface side, and is elongated in a longitudinal direction. The light emitting element chips is aligned along a line that extends in the longitudinal direction.

Claims

1. A light emitting device comprising:

a board having end portions and a center portion therebetween in a longitudinal direction, the board having a first surface on a first surface side thereof and a second surface on a second surface side thereof, the second surface being an opposite side to the first surface, the first surface including a first region and a second region, the first region extending from the center portion of the board to one of the end portions, the second region extending from the center portion of the board to the other of the end portions;

a plurality of light emitting element chips mounted on the first surface side of the board;

a wavelength conversion member formed unitarily with a transparent member that seals the plurality of light emitting element chips;

a transparent bulb that encloses the board and the plurality of light emitting element chips;

support leads that secure the plurality of light emitting element chips inside the transparent bulb;

a support base that can be threadedly engaged with a conventional light bulb socket along a socket axis; and

a pair of metal plates protruding at both ends of the wavelength conversion member,

wherein the wavelength conversion member is provided on the first surface side and the second surface side, the wavelength conversion member is elongated in the longitudinal direction when viewed in plan view of the first surface side of the board,

wherein a first set of the light emitting element chips are mounted on the first region and arranged from the center portion of the board to the one of the end portions,

wherein a second set of the light emitting element chips are mounted on the second region and arranged from the center portion of the board to the other one of the end portions, and

wherein the pair of metal plates are electrically connected with the support base via the support leads.

2. The light emitting device according to claim 1, wherein the transparent bulb forms a cylindrical shape.

3. The light emitting device according to claim 1, wherein the transparent bulb is made of glass.

4. The light emitting device according to claim 1, wherein each of the metal plates crosses the support lead.

5. The light emitting device according to claim 1, wherein the pair of support leads is elongated tapering toward the base to conform with a figure of the bulb.

6. The light emitting device according to claim 1, wherein the wavelength conversion member comprises a phosphor therein.

7. The light emitting device according to claim 6, wherein the phosphor comprises a YAG group phosphor.

8. The light emitting device according to claim 6, wherein the phosphor comprises CaSi₂O₂N₂:

Eu or SrSi₂O₂N₂;

Eu.

9. The light emitting device according to claim 6, wherein the phosphor comprises (Sr,Ca)₅(PO₄)₃Cl:

Eu.

10. The light emitting device according to claim 6, wherein the phosphor comprises (Ca,Sr)₂Si₅N₈:

Eu.

11. The light emitting device according to claim 6, wherein an average particle size of the phosphor is 3 μ

m or more.

12. The light emitting device according to claim 1, wherein the plurality of light emitting element chips is electrically connected in series.

13. The light emitting device according to claim 1, wherein the plurality of light emitting element chips is so configured that a main peak light emission wavelength of the light emitting element is varied within a range between 420 nm and 490 nm.

14. The light emitting device according to claim 1, wherein each of the light emitting element chips comprises nitride semiconductor made of In_xAl_yGa_1-x-yN (0≦

x, 0≦

y, x+y≦

1).

15. The light emitting device according to claim 1, wherein the wavelength conversion member substantially surrounds the board.

16. The light emitting device according to claim 15, wherein the wavelength conversion member opens opposing sides of the board.

17. The light emitting device according to claim 1, wherein the board is configured to be transparent so that a light emitted from the plurality of light emitting element chips on the first surface side of the board forwards outside of the light emitting device through the second surface of the board.

18. The light emitting device according to claim 1, wherein the wavelength conversion member is capable of converting light emitted from the plurality of light emitting element chips into light with a different wavelength such that the converted light with the different wavelength is radiated along a first direction from the first surface side of the board to an outer periphery of the wavelength conversion member, and along a second direction from the second surface of the board to the outer periphery of the wavelength conversion member.

19. The light emitting device according to claim 1, wherein all light emitting element chips mounted on the first surface side of the board are aligned along a line.

20. The light emitting device according to claim 1, wherein the wavelength conversion member seals all light emitting element chips mounted on the first surface side of the board.

21. The light emitting device according to claim 19, wherein the wavelength conversion member seals all light emitting element chips mounted on the first surface side of the board.

22. The light emitting device according to claim 1, wherein the first set of light emitting element chips and the second set of light emitting element chips are aligned along substantially a single line that extends in the longitudinal direction of the wavelength conversion member.

23. The light emitting device according to claim 1, wherein the support leads extend from the support base towards the pair of metal plates.

24. The light emitting device according to claim 1, wherein one of the support leads is positioned between one of the metal plates and the support base.

25. The light emitting device according to claim 1, wherein all of the light emitting element chips mounted on the first surface side of the board are aligned along a single line when viewed in plan view of the first surface side of the board.

26. A light emitting device comprising:

a board having end portions and a center portion therebetween in a longitudinal direction, the board having a first surface on a first surface side thereof and a second surface on a second surface side thereof, the second surface being an opposite side to the first surface, the first surface including a first region and a second region, the first region extending from the center portion of the board to one of the end portions, the second region extending from the center portion of the board to the other of the end portions;

a plurality of light emitting element chips mounted on the first surface side of the board;

a wavelength conversion member formed unitarily with a transparent member that seals the plurality of light emitting element chips;

a transparent bulb that encloses the board and the plurality of light emitting element chips;

support leads that secure the plurality of light emitting element chips inside the transparent bulb;

a support base that can be threadedly engaged with a conventional light bulb socket along a socket axis; and

a pair of metal plates protruding at both ends of the wavelength conversion member,

wherein the wavelength conversion member is provided on the first surface side and the second surface side, the wavelength conversion member is elongated in the longitudinal direction when viewed in plan view of the first surface side of the board,

wherein a first set of the light emitting element chips are mounted on the first region and arranged from the center portion of the board to the one of the end portions,

wherein a second set of the light emitting element chips are mounted on the second region and arranged from the center portion of the board to the other one of the end portions, and

wherein the support leads extend from the support base towards the pair of metal plates.

27. A light emitting device comprising:

a board having end portions and a center portion therebetween in a longitudinal direction, the board having a first surface on a first surface side thereof and a second surface on a second surface side thereof, the second surface being an opposite side to the first surface, the first surface including a first region and a second region, the first region extending from the center portion of the board to one of the end portions, the second region extending from the center portion of the board to the other of the end portions;

a plurality of light emitting element chips mounted on the first surface side of the board;

a wavelength conversion member formed unitarily with a transparent member that seals the plurality of light emitting element chips;

a transparent bulb that encloses the board and the plurality of light emitting element chips;

support leads that secure the plurality of light emitting element chips inside the transparent bulb;

a support base that can be threadedly engaged with a conventional light bulb socket along a socket axis; and

a pair of metal plates protruding at both ends of the wavelength conversion member,

wherein the wavelength conversion member is provided on the first surface side and the second surface side, the wavelength conversion member is elongated in the longitudinal direction when viewed in plan view of the first surface side of the board,

wherein a first set of the light emitting element chips are mounted on the first region and arranged from the center portion of the board to the one of the end portions,

wherein a second set of the light emitting element chips are mounted on the second region and arranged from the center portion of the board to the other one of the end portions, and

wherein one of the support leads is positioned between one of the metal plates and the support base.