Temperature sensing assembly for measuring temperature of a surface of a structure

• US 9,752,937 B2
• Filed: 09/11/2014
• Issued: 09/05/2017
• Est. Priority Date: 09/15/2011
• Status: Active Grant

• Current Assignee: Jeffrey N. Daily, Larry Welch, Yean C. Chan
• Original Assignee: Jeffrey N. Daily, Larry Welch, Yean C. Chan
• Inventors: Daily, Jeffrey N., Welch, Larry, Chan, Yean C
• Primary Examiner(s): Jagan, Mirellys
• Application Number:
  US14/483,965
• Publication Number:
  US 20140376594A1
• Time in Patent Office: 1,090 Days
• Field of Search: 374179, 374208, 374147, 374166, 136230
• CPC Class Codes: G01K 1/026 arrangements for monitoring a plurality of temperatures, e.g. by multiplexing
• CPC Class Codes: G01K 1/143 for measuring surface temperatures
• CPC Class Codes: G01K 7/04 the object to be measured not forming one of the thermoelectric materials

Abstract

A temperature sensing assembly for measuring the temperature of a surface of a structure includes a thermocouple device having a sheath containing a pair of conductors of dissimilar materials connected at a junction point to provide indications of temperature. The assembly further includes a docking device with a recess formed in a top surface to receive a portion of the sheath that is proximate the junction point. The bottom surface of the docking device is attached to the surface of the structure. The recess extends through the bottom surface of the docking device so that when the thermocouple device is positioned in the recess, the junction point is adjacent the surface of the tube. A heat shield can be attached to the docking device to shield the sheath proximate the junction point from direct and radiant heat sources.

Claims

1. A method of monitoring temperature of a surface of a structure, comprising:

attaching a bottom surface of a docking device to the surface of the structure, the docking device having a recessed portion formed in a top surface of the docking device and extending through the bottom surface;

positioning a thermocouple device within the recessed portion after the bottom surface of the docking device is attached to the surface of the structure, wherein the thermocouple device comprises at least one junction point disposed within an elongate sheath to measure temperature at a first location on the structure, and wherein the thermocouple device is positioned within the recessed portion so that the junction point is adjacent to the surface of the structure at the first location; and

attaching a heat shield to the docking device to shield the junction point from heat from thermal sources other than the surface of the structure.

2. The method as recited in claim 1, wherein the heat shield comprises a wall having a plurality of apertures formed therethrough to allow air flow through the heat shield.

3. The method as recited in claim 1, wherein the thermocouple device comprises a pair of conductors joined at a second junction point to measure temperature at a second location on the structure, and wherein the method further comprises positioning the second junction point at the second location.

4. The method as recited in claim 3, wherein positioning the second junction point comprises attaching the second junction point directly to the surface of the structure at the second location.

5. The method as recited in claim 4, wherein the second pair of conductors and the second junction point extend outside of the elongate sheath.