Mutual capacitance sensing array

• US 9,753,597 B2
• Filed: 08/19/2015
• Issued: 09/05/2017
• Est. Priority Date: 07/24/2009
• Status: Active Grant

• Current Assignee: Cypress Semiconductor Corporation (Infineon Technologies AG)
• Original Assignee: Cypress Semiconductor Corporation (Infineon Technologies AG)
• Inventors: Peng, Tao
• Primary Examiner(s): Spar, Ilana
• Assistant Examiner(s): Rayan, Mihir K
• Application Number:
  US14/830,624
• Publication Number:
  US 20150355755A1
• Time in Patent Office: 748 Days
• CPC Class Codes: G06F 2203/04102 Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
• CPC Class Codes: G06F 3/0416 Control or interface arrangements specially adapted for digitisers
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G06F 3/0448 Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A method and apparatus for sensing a conductive object by a mutual capacitance sensing array is described according to an embodiment of the present invention. The mutual capacitance sensing array comprises one or more sensor elements. Each sensor element comprises an outer frame including a conductive material. A cavity is formed within the interior of the outer frame. In an example embodiment, the sensor elements include transmit (TX) sensor elements and receive (RX) sensor elements that are disposed in a stackup that comprises a substrate, where the TX sensor elements are laminated by optically clear adhesive and are disposed on one side of the substrate, and where the RX sensor elements are laminated by optically clear adhesive and are disposed on a different side of the substrate than the TX elements.

Claims

1. An apparatus, comprising a mutual capacitance sensing array, the mutual capacitance sensing array comprising a plurality of sensor elements, each sensor element comprising an outer frame including a conductive material, the outer frame forming a single cavity within the interior therein, wherein an area of the cavity is substantially 50% to 90% of an area within an outer boundary of the sensor element, wherein a non-conductive dielectric material is disposed in the cavity, wherein the non-conductive dielectric material is electrically grounded, and wherein the electrical grounding is a floating ground.

2. The apparatus of claim 1, wherein the conductive material is transparent.

3. The apparatus of claim 1, wherein the non-conductive dielectric material is co-planar with the outer frame.

4. The apparatus of claim 1, wherein the non-conductive dielectric material is non-coplanar with the outer frame.

5. The apparatus of claim 1, wherein the outer frame has substantially a diamond shape.

6. The apparatus of claim 1, wherein the plurality of sensor elements comprises transmit (TX) sensor elements and receive (RX) sensor elements that are disposed in a stackup that comprises a substrate, wherein the TX sensor elements are laminated by optically clear adhesive and are disposed on one side of the substrate, and wherein the RX sensor elements are laminated by optically clear adhesive and are disposed on a different side of the substrate than the TX elements.

7. The apparatus of claim 1, further comprising a processing device coupled to the mutual capacitance sensing array, wherein the processing device is operable to detect a presence of a conductive object on the mutual capacitance sensing array.

8. The apparatus of claim 7, wherein the mutual capacitance sensing array is disposed on a touch sensor screen.

9. The apparatus of claim 7, wherein the mutual capacitance sensing array is disposed on a trackpad.

10. A method, comprising:

forming an outer frame for a plurality of sensor elements, each outer frame comprising a conductive material, each outer frame forming a single cavity within the interior therein, wherein an area of the cavity is substantially 50% to 90% of an area within an outer boundary of the sensor element, wherein a non-conductive dielectric material is disposed in the cavity, wherein the non-conductive dielectric material is electrically grounded, and wherein the electrical grounding is a floating ground; and

interconnecting the plurality of sensor elements to form a mutual capacitance sensor array.

11. The method of claim 10, wherein the outer frame has substantially a diamond shape.

12. The method of claim 10, further comprising providing a processing device to detect a presence of a conductive object on the mutual capacitance sensing array.

13. The method of claim 12, further comprising disposing the mutual capacitance sensor array on a touch sensor screen.

14. A system, comprising:

a plurality of capacitive sensor elements configured in an array, each sensor element comprising an outer frame including a conductive material, the outer frame forming a single cavity within the interior therein, wherein an area of the cavity is substantially 50% to 90% of an area within an outer boundary of the sensor element, wherein a non-conductive dielectric material is disposed in the cavity, wherein the non-conductive dielectric material is electrically grounded, and wherein the electrical grounding is a floating ground; and

a mutual capacitance sensing circuit coupled to the plurality of capacitive sensor elements to detect the presence of a conductive object on the plurality of capacitive sensor elements.

15. The system of claim 14, wherein the plurality of capacitive sensor elements is coupled to a touch screen.

16. The system of claim 14, wherein the plurality of capacitive sensor elements comprises transmit (TX) sensor elements and receive (RX) sensor elements that are disposed in a stackup that comprises a substrate, wherein the TX sensor elements are laminated by optically clear adhesive and are disposed on one side of the substrate, and wherein the RX sensor elements are laminated by optically clear adhesive and are disposed on a different side of the substrate than the TX elements.