Tooling for coupling multiple electronic chips

• US 9,754,907 B2
• Filed: 04/20/2016
• Issued: 09/05/2017
• Est. Priority Date: 06/14/2005
• Status: Active Grant

• Current Assignee: Cufer Asset Ltd LLC (Intellectual Ventures LLC)
• Original Assignee: Cufer Asset Ltd LLC (Intellectual Ventures LLC)
• Inventors: Dugas, Roger, Trezza, John
• Primary Examiner(s): EFTA, ALEX B
• Application Number:
  US15/133,514
• Publication Number:
  US 20160322320A1
• Time in Patent Office: 503 Days
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2223/6616 Vertical connections, e.g. vias
• CPC Class Codes: H01L 2223/6622 Coaxial feed-throughs in active or passive substrates
• CPC Class Codes: H01L 2224/02372 connecting to a via connection in the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/114 by blanket deposition of the material of the bump connector
• CPC Class Codes: H01L 2224/1147 using a lift-off mask
• CPC Class Codes: H01L 2224/116 by patterning a pre-deposited material
• CPC Class Codes: H01L 2224/11912 the bump being used as a mask for patterning other parts
• CPC Class Codes: H01L 2224/13012 in top view
• CPC Class Codes: H01L 2224/13021 the bump connector being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/1308 being stacked
• CPC Class Codes: H01L 2224/13082 Two-layer arrangements
• CPC Class Codes: H01L 2224/13083 Three-layer arrangements
• CPC Class Codes: H01L 2224/13084 : Four-layer arrangements
• CPC Class Codes: H01L 2224/13099 : Material
• CPC Class Codes: H01L 2224/13111 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13144 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13155 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13166 : Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/13184 : Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/1358 : being stacked
• CPC Class Codes: H01L 2224/136 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13609 : Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/16146 : the bump connector connecting to a via connection in the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/16237 : the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/24226 : the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/45111 : Tin (Sn) as principal constituent
• CPC Class Codes: H01L 2224/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/75305 : comprising protrusions
• CPC Class Codes: H01L 2224/81001 : involving a temporary auxiliary member not forming part of the bonding apparatus
• CPC Class Codes: H01L 2224/81011 : Chemical cleaning, e.g. etching, flux
• CPC Class Codes: H01L 2224/81054 : Composition of the atmosphere
• CPC Class Codes: H01L 2224/81136 : involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/81204 : with a graded temperature profile
• CPC Class Codes: H01L 2224/81825 : Solid-liquid interdiffusion
• CPC Class Codes: H01L 2224/81894 : Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
• CPC Class Codes: H01L 2224/83102 : using surface energy, e.g. capillary forces
• CPC Class Codes: H01L 2224/92125 : the second connecting process involving a layer connector
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06524 : Electrical connections formed on device or on substrate, e.g. a deposited or grown layer
• CPC Class Codes: H01L 2225/06531 : Non-galvanic coupling, e.g. capacitive coupling
• CPC Class Codes: H01L 2225/06534 : Optical coupling
• CPC Class Codes: H01L 2225/06541 : Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
• CPC Class Codes: H01L 2225/06555 : Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06589 : Thermal management, e.g. cooling
• CPC Class Codes: H01L 2225/06593 : Mounting aids permanently on device; arrangements for alignment
• CPC Class Codes: H01L 2225/06596 : Structural arrangements for testing
• CPC Class Codes: H01L 23/427 : Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/48 : Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/481 : Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 23/488 : consisting of soldered or bonded constructions bump connectors H01L24/01
• CPC Class Codes: H01L 23/49827 : Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/5389 : the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 23/552 : Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 : High-frequency adaptations
• CPC Class Codes: H01L 24/02 : Bonding areas on insulating substrates, e.g. chip carriers, H01L23/49816, H01L23/49838, H01L23/5389; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01002 : Helium [He]
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01007 : Nitrogen [N]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01018 : Argon [Ar]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01025 : Manganese [Mn]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01052 : Tellurium [Te]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/04953 : TaN
• CPC Class Codes: H01L 2924/05042 : Si3N4
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01S 2301/176 : Specific passivation layers on surfaces other than the emission facet
• CPC Class Codes: H01S 5/02345 : Wire-bonding
• CPC Class Codes: H01S 5/0237 : by soldering
• CPC Class Codes: H01S 5/0422 : with n- and p-contacts on the same side of the active layer
• CPC Class Codes: H01S 5/0425 : Electrodes, e.g. characterised by the structure
• CPC Class Codes: H01S 5/04254 : characterised by the shape
• CPC Class Codes: H01S 5/04257 : having positive and negative electrodes on the same side of the substrate
• CPC Class Codes: H01S 5/183 : having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
• CPC Class Codes: H01S 5/18308 : having a special structure for lateral current or light confinement

Abstract

A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

Claims

1. A method comprising:

bringing a material located on a body into contact with multiple chips;

hardening the material to increasingly constrain at least a portion of each of the multiple chips therewithin such that the hardened material and the multiple chips behave as a rigid body;

applying a force to the body to uniformly transfer a force from the hardened material on the body to the multiple chips to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element, without causing damage to the multiple chips or the bonding surface of the element; and

removing all of the hardened material from contact with the multiple chips.

2. The method of claim 1, further comprising moving the multiple chips constrained by the hardened material from a first location to a second location where the element, to which the multiple chips are to be bonded, is located.

3. The method of claim 1, further comprising bonding each of the multiple chips to the element.

4. The method of claim 1, further comprising removing the body using at least one of a chemical process, a mechanical process, or a chemical-mechanical process.

5. The method of claim 1, further comprising removing at least a portion of the hardened material through at least one of a chemical process, a mechanical process, or a chemical-mechanical process.

6. The method of claim 1, further comprising flowing an underfill between at least some of the multiple chips.

7. The method of claim 1, wherein the element to which the multiple chips are to be bonded comprises a plurality of complementary chips corresponding to the multiple chips, and wherein one or more of the bonding surfaces of the multiple chips or the corresponding complementary chips comprise a malleable material.

8. The method of claim 7, wherein the one or more of the bonding surfaces of the multiple chips or the corresponding complementary chips further comprise a post comprising a conductive material that is less malleable than the malleable material.

9. The method of claim 8, wherein the force is sufficient for the post to penetrate into the malleable material at a temperature below a melting point of the malleable material.

10. The method of claim 9, further comprising heating the malleable material to the temperature below the melting point of the malleable material.

11. The method of claim 10, further comprising fusing the malleable material with at least a portion of the post, thereby forming an electrical connection between bonded chips.

12. The method of claim 1, wherein the material is in a liquidus or gel form before being hardened.

13. The method of claim 1, wherein said bringing a material located on a body into contact with multiple chips comprises conforming the material to shapes on portions of the multiple chips.

14. A method comprising:

bringing a material that is disposed on a body into contact with a plurality of chips;

hardening the material to increasingly constrain at least a portion of each of the plurality of chips such that the hardened material and the plurality of chips behave as a rigid body;

applying a force to the body to cause the hardened material to transfer the force from the body to the plurality of chips to thereby bond bonding surfaces of the plurality of chips to a bonding surface of an element; and

removing all of the hardened material from contact with the plurality of chips.

15. The method of claim 14, further comprising, after said hardening, moving the plurality of chips from a first location to a second location where the element is located, wherein the second location is different from the first location.

16. The method of claim 15, wherein said applying a force to the body is done at the second location.

17. The method of claim 14, wherein said applying a force to the body comprises uniformly applying force.

18. The method of claim 14, further comprising flowing an underfill between at least some of the plurality of chips.

19. The method of claim 14, wherein the element comprises a plurality of complementary chips corresponding to the plurality of chips.

20. The method of claim 19, wherein one or more of the bonding surfaces of the plurality of chips or the corresponding complementary chips comprise a malleable material.