Semiconductor device and method for manufacturing the same

• US 9,754,974 B2
• Filed: 11/03/2016
• Issued: 09/05/2017
• Est. Priority Date: 07/10/2009
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei, Sakakura, Masayuki
• Primary Examiner(s): Le, Thao P
• Application Number:
  US15/342,373
• Publication Number:
  US 20170148824A1
• Time in Patent Office: 306 Days
• CPC Class Codes: H01L 21/02554 Oxides
• CPC Class Codes: H01L 21/02565 Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
• CPC Class Codes: H01L 27/1225 with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 27/1248 with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
• CPC Class Codes: H01L 27/1255 integrated with passive devices, e.g. auxiliary capacitors
• CPC Class Codes: H01L 29/66969 of devices having semiconductor bodies not comprising group 14 or group 13/15 materials comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide H01L21/02365
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/42 Transparent materials

Abstract

It is an object to manufacture and provide a highly reliable display device including a thin film transistor with a high aperture ratio which has stable electric characteristics. In a manufacturing method of a semiconductor device having a thin film transistor in which a semiconductor layer including a channel formation region is formed using an oxide semiconductor film, a heat treatment for reducing moisture and the like which are impurities and for improving the purity of the oxide semiconductor film (a heat treatment for dehydration or dehydrogenation) is performed. Further, an aperture ratio is improved by forming a gate electrode layer, a source electrode layer, and a drain electrode layer using conductive films having light transmitting properties.

Claims

1. A display panel comprising:

a substrate;

a display portion over the substrate, the display portion comprising;

a capacitor comprising a first electrode layer and a second electrode layer; and

a pixel, the pixel comprising;

a transistor comprising a gate electrode layer, a semiconductor layer, a gate insulating layer interposed between the gate electrode layer and the semiconductor layer, a source electrode layer and a drain electrode layer;

a protective insulating layer over the transistor; and

a pixel electrode layer over the protective insulating layer, and electrically connected to one of the source electrode layer and the drain electrode layer; and

a terminal portion configured to be connected with a driving portion, the terminal portion comprising;

a first conductive layer over the substrate;

an insulating layer over the first conductive layer;

a second conductive layer over the insulating layer; and

a third conductive layer over and in contact with the second conductive layer;

wherein the second conductive layer and the third conductive layer each have a light transmitting property,

wherein each of the pixel electrode layer, the first electrode layer and the second electrode layer have a light transmitting property, and

wherein the first conductive layer is electrically floating.

2. The display panel according to claim 1, wherein the driving portion comprises at least one of a signal line driver circuit and a scan line driver circuit.

3. The display panel according to claim 1, wherein the first conductive layer has a light transmitting property.

4. The display panel according to claim 1, wherein the first electrode layer and the source electrode layer are formed from a same conductive film.

5. The display panel according to claim 1, wherein the second electrode layer and the gate electrode layer are formed from a same conductive film.

6. The display panel according to claim 1, wherein the second electrode layer and the pixel electrode layer are formed from a same conductive film.

7. The display panel according to claim 1, wherein the semiconductor layer comprises an oxide semiconductor layer.

8. A display panel according to claim 1, wherein the capacitor is a storage capacitor included in the pixel.

9. An electronic appliance comprising the display panel according to claim 1.

10. A display panel comprising:

a substrate;

a display portion over the substrate, the display portion comprising a pixel, the pixel comprising;

a capacitor comprising a first electrode layer and a second electrode layer;

a transistor comprising a gate electrode layer, a semiconductor layer, a gate insulating layer interposed between the gate electrode layer and the semiconductor layer, a source electrode layer and a drain electrode layer;

a protective insulating layer over the transistor; and

a pixel electrode layer over the protective insulating layer, and electrically connected to one of the source electrode layer and the drain electrode layer; and

a terminal portion configured to be connected with a driving portion, the terminal portion comprising;

a first conductive layer over the substrate;

an insulating layer over the first conductive layer;

a second conductive layer over the insulating layer; and

a third conductive layer over and in contact with the second conductive layer;

wherein the second conductive layer and the third conductive layer each have a light transmitting property,

wherein the second conductive layer and the first electrode layer are formed from a same first conductive film,

wherein the third conductive layer and the pixel electrode layer are formed from a same second conductive film,

wherein the insulating layer and the gate insulating layer are formed from a same insulating film,

wherein each of the pixel electrode layer, the first electrode layer and the second electrode layer have a light transmitting property, and

wherein the first conductive layer is electrically floating.

11. The display panel according to claim 10, wherein the driving portion comprises at least one of a signal line driver circuit and a scan line driver circuit.

12. The display panel according to claim 10, wherein the first conductive layer has a light transmitting property.

13. The display panel according to claim 10, wherein the first conductive layer is in electrical contact with the second conductive layer via the third conductive layer.

14. The display panel according to claim 10, wherein the first electrode layer and the source electrode layer are formed from a same conductive film.

15. The display panel according to claim 10, wherein the second electrode layer and the gate electrode layer are formed from a same conductive film.

16. The display panel according to claim 10, wherein the second electrode layer and the pixel electrode layer are formed from the same second conductive film.

17. The display panel according to claim 10, wherein the semiconductor layer comprises an oxide semiconductor layer.

18. A display panel according to claim 10, wherein the capacitor is a storage capacitor included in the pixel.

19. An electronic appliance comprising the display panel according to claim 10.