Low profile electrical interconnect with fusion bonded contact retention and solder wick reduction

• US 9,755,335 B2
• Filed: 03/06/2016
• Issued: 09/05/2017
• Est. Priority Date: 03/18/2015
• Status: Active Grant

• Current Assignee: HSIO Technologies LLC
• Original Assignee: HSIO Technologies LLC
• Inventors: Rathburn, James J.
• Primary Examiner(s): Duverne, Jean F
• Application Number:
  US15/062,138
• Publication Number:
  US 20160276763A1
• Time in Patent Office: 548 Days
• CPC Class Codes: H01R 12/7076 for connection between PCB and component, e.g. display
• CPC Class Codes: H01R 12/7082 Coupling device supported only by cooperation with PCB
• CPC Class Codes: H01R 13/405 Securing in non-demountable manner, e.g. moulding, riveting
• CPC Class Codes: H01R 43/205 with a panel or printed circuit board
• CPC Class Codes: H05K 2201/10325 Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An electrical interconnect and a method of making the same. A plurality of contact members are located in through holes in a substrate so distal portions of the contact members extend above a first surface of the substrate in a cantilevered configuration and proximal portions of the contact members are accessible along a second surface of the substrate. A flowable polymeric material located on the second surface of the substrate is fusion bonded to the proximal portions of the contact members so the flowable polymeric material substantially seals the through holes in the substrate. An insulator housing is bonded to the first surface of the substrate with the distal portions of the contact members located in through holes in an insulator housing, so the distal portions are accessible from a second surface of the insulator housing.

Claims

1. A method of making an electrical interconnector, the method comprising the steps of:

positioning a plurality of discrete contact members in through holes in a substrate so distal portions of the contact members extend above a first surface of the substrate in a cantilevered configuration and proximal portions of the contact members are accessible along a second surface of the substrate;

locating a flowable polymeric on the second surface of the substrate adjacent the through holes;

subjecting the substrate and the contact members to sufficient energy and/or pressure so the flowable polymeric layer flows into engagement with the proximal portions of the contact members and fuses the contact members to the substrate;

positioning distal portions of the contact members in through holes in an insulator housing; and

bonding the first surface of the substrate to a first surface of the insulator housing so the distal portions are accessible from a second surface of the insulator housing.

2. The method of claim 1 wherein the flowable polymeric material fused to the contact members substantially seals the through holes in the substrate.

3. The method of claim 1 comprising forming distal portions of the contact members with a plurality of beams maintained in a cantilevered relationship with respect to the first surface of the substrate.

4. The method of claim 1 comprising forming distal portions of the contact members with a plurality of beams that elastically deform to mechanically and electrically engage with terminals on circuit members.

5. The method of claim 1 comprising positioning a layer of the flowable polymeric material on the second surface of the substrate.

6. The method of claim 5 comprising processing the flowable polymeric material to reveal the proximal portions of the contact members.

7. The method of claim 1 comprising molding the flowable polymeric material to the second surface of the substrate adjacent the through holes.

8. The method of claim 1 comprising depositing the flowable polymeric material on the second surface of the substrate adjacent the through holes.

9. The method of claim 1 selecting the flowable polymeric material from low melt liquid crystal polymer, an epoxy set resin, a thermoset material, or a thermoplastic material.

10. The method of claim 1 comprising:

forming the substrate from a first polymeric material have a first glass transition temperature and the flowable polymeric material from a second polymeric material have a second glass transition temperature, wherein the second glass transition temperature is lower than the first glass transition temperature; and

subjecting the substrate and the contact members to sufficient energy and/or pressure so the second glass transition temperature of the flowable polymeric material is exceeded, but the first glass transition temperature is not exceeded, so that the flowable polymeric material enters a molten or rubber-like state and flows into engagement with proximal portions of the contact members.

11. The method of claim 1 comprising:

electrically coupling proximal portions of the contact members to contact pads on a first circuit member;

positioning terminals on a second circuit member in the through holes along the second surface of the insulator housing; and

mechanically and electrically coupling the terminals on the second circuit member with distal portions of the contact members.

12. The method of claim 1 comprising:

positioning solder ball terminals on a BOA device in the through holes along the second surface of the insulator housing; and

elastically deforming distal portions of the contact members to mechanically and electrically engage with the solder ball terminals on the BOA device.

13. An electrical interconnector comprising:

a plurality of discrete contact members located in through holes in a substrate so distal portions of the contact members extend above a first surface of the substrate in a cantilevered configuration and proximal portions of the contact members are accessible along a second surface of the substrate;

a flowable polymeric material located on the second surface of the substrate is fusion bonded to the proximal portions of the contact members so the flowable polymeric material substantially seals the through holes in the substrate; and

an insulator housing bonded to the first surface of the substrate with the distal portions of the contact members located in through holes in an insulator housing, so the distal portions are accessible from a second surface of the insulator housing.

14. The electrical interconnect of claim 13 wherein distal portions of the contact members comprise a plurality of beams maintained in a cantilevered relationship with respect to the first surface of the substrate.

15. The electrical interconnect of claim 13 wherein distal portions of the contact members comprise a plurality of beams that elastically deform to mechanically and electrically engage with terminals on a circuit member.

16. The electrical interconnect of claim 13 wherein the flowable polymeric material is selected from one of a low melt liquid crystal polymer, an epoxy set resin, a thermoset material, or a thermoplastic material.

17. The electrical interconnect of claim 13 wherein the substrate is formed from a first polymeric material have a first glass transition temperature and the flowable polymeric material from a second polymeric material have a second glass transition temperature, wherein the second glass transition temperature is lower than the first glass transition temperature.

18. An electrical assembly comprising:

the electrical interconnect of claim 13;

contact pads on a first circuit member electrically coupled proximal portions of the contact members;

terminals on, a second circuit member positioned in the through holes along the second surface of the insulator housing, and mechanically and electrically coupled with distal portions of the contact members.

19. An electrical assembly comprising:

the electrical interconnect of claim 13;

solder ball terminals on a BGA device positioned in the through holes along they second surface of the insulator housing, the distal portions of the contact members mechanically and electrically coupled with the solder ball terminals on the BGA device.