Integrated power module packaging structure

• US 9,756,754 B2
• Filed: 03/29/2016
• Issued: 09/05/2017
• Est. Priority Date: 10/23/2015
• Status: Active Grant

• Current Assignee: Delta Electronics Incorporated
• Original Assignee: Delta Electronics Incorporated
• Inventors: Cheng, Tsung-Tai
• Primary Examiner(s): Cunningham, Xanthia C
• Application Number:
  US15/083,300
• Publication Number:
  US 20170118858A1
• Time in Patent Office: 525 Days
• Field of Search: None
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/045 Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
• CPC Class Codes: H05K 2201/10053 Switch
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10174 Diode
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins
• CPC Class Codes: H05K 2201/10318 Surface mounted metallic pins
• CPC Class Codes: H05K 5/0069 having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
• CPC Class Codes: H05K 5/0247 Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: H05K 7/06 on insulating boards , e.g. wiring harnesses for printed circuits H05K1/18, H05K3/30
• CPC Class Codes: H05K 7/1427 Housings

Abstract

An integrated power module packaging structure includes a housing, a first circuit board, a second circuit board, a first pin, a second pin and a third pin. The housing has a cavity. The second circuit board is located above the first circuit board, and both them are received in the cavity. A switching module is disposed on the first circuit board. A high side current/voltage detecting device and a driving device are disposed on the second circuit board. The first pin, the second pin and the third pin are disposed between the first circuit board and the second circuit board. The first pin connects the high side current/voltage detecting device and the switching module in series. The second pin connects the switching module. The driving device controls the switching module through the third pin.

Claims

1. An integrated power module packaging structure comprising:

a housing having a cavity;

a first circuit board received in the cavity, wherein a switching module is disposed on the first circuit board;

a second circuit board received in the cavity and located above the first circuit board, wherein a high side current/voltage detecting device and a driving device are disposed on the second circuit board; and

a first pin, a second pin and a third pin disposed between the first circuit board and the second circuit board, wherein the first pin connects the high side current/voltage detecting device and the switching module in series, and the second pin connects the switching module, and the driving device controls the switching module through the third pin.

2. The integrated power module packaging structure of claim 1, further comprising a low side current detecting device disposed on the first circuit board, wherein the first pin further connects the low side current detecting device and the switching module in series.

3. The integrated power module packaging structure of claim 2, further comprising a third circuit board disposed out the housing, wherein a power supply device is disposed on the third circuit board, and the power supply device has a positive voltage terminal and a negative voltage terminal.

4. The integrated power module packaging structure of claim 3, further comprising a fourth pin disposed between the second circuit board and the third circuit board and connected to the positive voltage terminal of the power supply,

wherein the high side current/voltage detecting device and the switching module that are connected in series are connected to the positive voltage terminal of the power supply through the first pin and the fourth pin, and

wherein the low side current detecting device and the switching module that are connected in series are connected to the negative voltage terminal of the power supply through the second pin.

5. The integrated power module packaging structure of claim 4, further comprising a fifth pin disposed on the second circuit board, wherein the high side current/voltage detecting device detects the power supply device to generate a high side current/voltage detecting signal to the fifth pin.

6. The integrated power module packaging structure of claim 5, further comprising a sixth pin disposed on the first circuit board and passing through the second circuit board, wherein the low side current detecting device detects the power supply device to generate a low side current detecting signal to the sixth pin.

7. The integrated power module packaging structure of claim 6, further comprising a controller disposed out the housing, wherein the controller receives the high side current/voltage detecting signal from the fifth pin and the low side current detecting signal from the sixth pin.

8. The integrated power module packaging structure of claim 7, wherein the controller is disposed on the third circuit board.

9. The integrated power module packaging structure of claim 8, further comprising a seventh pin disposed between the second circuit board and the third circuit board, wherein the controller controls the driving device through the seventh pin.

10. The integrated power module packaging structure of claim 1, wherein the switching module comprises a power device.